JPWO2024203602A1 - - Google Patents

Info

Publication number
JPWO2024203602A1
JPWO2024203602A1 JP2025510575A JP2025510575A JPWO2024203602A1 JP WO2024203602 A1 JPWO2024203602 A1 JP WO2024203602A1 JP 2025510575 A JP2025510575 A JP 2025510575A JP 2025510575 A JP2025510575 A JP 2025510575A JP WO2024203602 A1 JPWO2024203602 A1 JP WO2024203602A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510575A
Other languages
Japanese (ja)
Other versions
JPWO2024203602A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024203602A1 publication Critical patent/JPWO2024203602A1/ja
Publication of JPWO2024203602A5 publication Critical patent/JPWO2024203602A5/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
JP2025510575A 2023-03-30 2024-03-19 Pending JPWO2024203602A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023055445 2023-03-30
PCT/JP2024/010712 WO2024203602A1 (ja) 2023-03-30 2024-03-19 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
JPWO2024203602A1 true JPWO2024203602A1 (https=) 2024-10-03
JPWO2024203602A5 JPWO2024203602A5 (https=) 2025-12-04

Family

ID=92906148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510575A Pending JPWO2024203602A1 (https=) 2023-03-30 2024-03-19

Country Status (5)

Country Link
JP (1) JPWO2024203602A1 (https=)
KR (1) KR20250170639A (https=)
CN (1) CN120917542A (https=)
TW (1) TW202443643A (https=)
WO (1) WO2024203602A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098367A (ja) * 2015-11-20 2017-06-01 東京エレクトロン株式会社 基板処理方法
KR102791311B1 (ko) * 2016-08-12 2025-04-04 인프리아 코포레이션 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법
JP7024307B2 (ja) 2017-01-26 2022-02-24 東京エレクトロン株式会社 塗布膜除去装置、塗布膜除去方法及び記憶媒体
JP2020013823A (ja) * 2018-07-13 2020-01-23 株式会社Screenホールディングス 基板処理装置および基板処理方法
JP6688860B2 (ja) * 2018-10-24 2020-04-28 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Also Published As

Publication number Publication date
TW202443643A (zh) 2024-11-01
WO2024203602A1 (ja) 2024-10-03
KR20250170639A (ko) 2025-12-05
CN120917542A (zh) 2025-11-07

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Legal Events

Date Code Title Description
A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A527

Effective date: 20250916

A621 Written request for application examination

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Effective date: 20250916