JPWO2024203602A1 - - Google Patents
Info
- Publication number
- JPWO2024203602A1 JPWO2024203602A1 JP2025510575A JP2025510575A JPWO2024203602A1 JP WO2024203602 A1 JPWO2024203602 A1 JP WO2024203602A1 JP 2025510575 A JP2025510575 A JP 2025510575A JP 2025510575 A JP2025510575 A JP 2025510575A JP WO2024203602 A1 JPWO2024203602 A1 JP WO2024203602A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023055445 | 2023-03-30 | ||
| PCT/JP2024/010712 WO2024203602A1 (ja) | 2023-03-30 | 2024-03-19 | 基板処理装置及び基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024203602A1 true JPWO2024203602A1 (https=) | 2024-10-03 |
| JPWO2024203602A5 JPWO2024203602A5 (https=) | 2025-12-04 |
Family
ID=92906148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025510575A Pending JPWO2024203602A1 (https=) | 2023-03-30 | 2024-03-19 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024203602A1 (https=) |
| KR (1) | KR20250170639A (https=) |
| CN (1) | CN120917542A (https=) |
| TW (1) | TW202443643A (https=) |
| WO (1) | WO2024203602A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017098367A (ja) * | 2015-11-20 | 2017-06-01 | 東京エレクトロン株式会社 | 基板処理方法 |
| KR102791311B1 (ko) * | 2016-08-12 | 2025-04-04 | 인프리아 코포레이션 | 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법 |
| JP7024307B2 (ja) | 2017-01-26 | 2022-02-24 | 東京エレクトロン株式会社 | 塗布膜除去装置、塗布膜除去方法及び記憶媒体 |
| JP2020013823A (ja) * | 2018-07-13 | 2020-01-23 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP6688860B2 (ja) * | 2018-10-24 | 2020-04-28 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
-
2024
- 2024-03-18 TW TW113109940A patent/TW202443643A/zh unknown
- 2024-03-19 CN CN202480020816.2A patent/CN120917542A/zh active Pending
- 2024-03-19 WO PCT/JP2024/010712 patent/WO2024203602A1/ja not_active Ceased
- 2024-03-19 JP JP2025510575A patent/JPWO2024203602A1/ja active Pending
- 2024-03-19 KR KR1020257036295A patent/KR20250170639A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202443643A (zh) | 2024-11-01 |
| WO2024203602A1 (ja) | 2024-10-03 |
| KR20250170639A (ko) | 2025-12-05 |
| CN120917542A (zh) | 2025-11-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A527 Effective date: 20250916 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250916 |