TW202415715A - 導電性接著劑層 - Google Patents

導電性接著劑層 Download PDF

Info

Publication number
TW202415715A
TW202415715A TW112124216A TW112124216A TW202415715A TW 202415715 A TW202415715 A TW 202415715A TW 112124216 A TW112124216 A TW 112124216A TW 112124216 A TW112124216 A TW 112124216A TW 202415715 A TW202415715 A TW 202415715A
Authority
TW
Taiwan
Prior art keywords
metal particles
adhesive layer
conductive adhesive
particles
alloyed
Prior art date
Application number
TW112124216A
Other languages
English (en)
Chinese (zh)
Inventor
春名裕介
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW202415715A publication Critical patent/TW202415715A/zh

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
TW112124216A 2022-09-30 2023-06-29 導電性接著劑層 TW202415715A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-158736 2022-09-30
JP2022158736 2022-09-30

Publications (1)

Publication Number Publication Date
TW202415715A true TW202415715A (zh) 2024-04-16

Family

ID=90478170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112124216A TW202415715A (zh) 2022-09-30 2023-06-29 導電性接著劑層

Country Status (5)

Country Link
JP (2) JP7494411B1 (https=)
KR (1) KR20250078889A (https=)
CN (1) CN119604949A (https=)
TW (1) TW202415715A (https=)
WO (1) WO2024071400A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4828151B2 (ja) * 2005-04-15 2011-11-30 タツタ電線株式会社 導電性接着シート及び回路基板
JP4933217B2 (ja) 2006-10-26 2012-05-16 タツタ電線株式会社 導電性接着剤
WO2022024757A1 (ja) * 2020-07-31 2022-02-03 タツタ電線株式会社 導電性接着剤
TWI884347B (zh) * 2021-03-26 2025-05-21 日商拓自達電線股份有限公司 導電性接著劑層

Also Published As

Publication number Publication date
JPWO2024071400A1 (https=) 2024-04-04
JP7494411B1 (ja) 2024-06-03
KR20250078889A (ko) 2025-06-04
JP7496949B1 (ja) 2024-06-07
CN119604949A (zh) 2025-03-11
JP2024094389A (ja) 2024-07-09
WO2024071400A1 (ja) 2024-04-04

Similar Documents

Publication Publication Date Title
TWI645975B (zh) 多層異向導電膠膜及其製作方法
JP2018039959A (ja) 導電性接着剤組成物
JP6794591B1 (ja) 導電性接着シート
JP5608426B2 (ja) 異方性導電膜の製造方法
TWI859458B (zh) 導電性接著劑
TWI884347B (zh) 導電性接著劑層
TWI812889B (zh) 電磁波屏蔽膜
TW202415715A (zh) 導電性接著劑層
KR102887121B1 (ko) 도전성 접착제, 전자파 차폐 필름 및 도전성 본딩 필름
CN110054996A (zh) 导电性接合膜及使用该导电性接合膜的电磁波屏蔽膜
JP6370562B2 (ja) 接続体の製造方法、フレキシブル基板の接続方法、接続体及びフレキシブル基板
US20250197694A1 (en) Thermally-conductive electrical conducting layer
WO2025205404A1 (ja) 熱伝導性導電接着剤層
HK40114151A (zh) 导电性粘接剂层和散热结构
HK40009870A (en) Conductive bonding film and electromagnetic wave shielding film using the same