KR20250078889A - 도전성 접착제층 - Google Patents

도전성 접착제층 Download PDF

Info

Publication number
KR20250078889A
KR20250078889A KR1020257001016A KR20257001016A KR20250078889A KR 20250078889 A KR20250078889 A KR 20250078889A KR 1020257001016 A KR1020257001016 A KR 1020257001016A KR 20257001016 A KR20257001016 A KR 20257001016A KR 20250078889 A KR20250078889 A KR 20250078889A
Authority
KR
South Korea
Prior art keywords
adhesive layer
conductive adhesive
metal particles
particles
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257001016A
Other languages
English (en)
Korean (ko)
Inventor
유스케 하루나
Original Assignee
타츠타 전선 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20250078889A publication Critical patent/KR20250078889A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
KR1020257001016A 2022-09-30 2023-09-29 도전성 접착제층 Pending KR20250078889A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-158736 2022-09-30
JP2022158736 2022-09-30
PCT/JP2023/035699 WO2024071400A1 (ja) 2022-09-30 2023-09-29 導電性接着剤層

Publications (1)

Publication Number Publication Date
KR20250078889A true KR20250078889A (ko) 2025-06-04

Family

ID=90478170

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257001016A Pending KR20250078889A (ko) 2022-09-30 2023-09-29 도전성 접착제층

Country Status (5)

Country Link
JP (2) JP7494411B1 (https=)
KR (1) KR20250078889A (https=)
CN (1) CN119604949A (https=)
TW (1) TW202415715A (https=)
WO (1) WO2024071400A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008108625A (ja) 2006-10-26 2008-05-08 Tatsuta System Electronics Kk 導電性接着剤

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4828151B2 (ja) * 2005-04-15 2011-11-30 タツタ電線株式会社 導電性接着シート及び回路基板
WO2022024757A1 (ja) * 2020-07-31 2022-02-03 タツタ電線株式会社 導電性接着剤
TWI884347B (zh) * 2021-03-26 2025-05-21 日商拓自達電線股份有限公司 導電性接著劑層

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008108625A (ja) 2006-10-26 2008-05-08 Tatsuta System Electronics Kk 導電性接着剤

Also Published As

Publication number Publication date
JPWO2024071400A1 (https=) 2024-04-04
JP7494411B1 (ja) 2024-06-03
TW202415715A (zh) 2024-04-16
JP7496949B1 (ja) 2024-06-07
CN119604949A (zh) 2025-03-11
JP2024094389A (ja) 2024-07-09
WO2024071400A1 (ja) 2024-04-04

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20250110

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application