JPWO2024071400A1 - - Google Patents
Info
- Publication number
- JPWO2024071400A1 JPWO2024071400A1 JP2024502034A JP2024502034A JPWO2024071400A1 JP WO2024071400 A1 JPWO2024071400 A1 JP WO2024071400A1 JP 2024502034 A JP2024502034 A JP 2024502034A JP 2024502034 A JP2024502034 A JP 2024502034A JP WO2024071400 A1 JPWO2024071400 A1 JP WO2024071400A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024069037A JP7496949B1 (ja) | 2022-09-30 | 2024-04-22 | 導電性接着剤層 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022158736 | 2022-09-30 | ||
| JP2022158736 | 2022-09-30 | ||
| PCT/JP2023/035699 WO2024071400A1 (ja) | 2022-09-30 | 2023-09-29 | 導電性接着剤層 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024069037A Division JP7496949B1 (ja) | 2022-09-30 | 2024-04-22 | 導電性接着剤層 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024071400A1 true JPWO2024071400A1 (https=) | 2024-04-04 |
| JP7494411B1 JP7494411B1 (ja) | 2024-06-03 |
| JPWO2024071400A5 JPWO2024071400A5 (https=) | 2024-09-05 |
Family
ID=90478170
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024502034A Active JP7494411B1 (ja) | 2022-09-30 | 2023-09-29 | 導電性接着剤層 |
| JP2024069037A Active JP7496949B1 (ja) | 2022-09-30 | 2024-04-22 | 導電性接着剤層 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024069037A Active JP7496949B1 (ja) | 2022-09-30 | 2024-04-22 | 導電性接着剤層 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7494411B1 (https=) |
| KR (1) | KR20250078889A (https=) |
| CN (1) | CN119604949A (https=) |
| TW (1) | TW202415715A (https=) |
| WO (1) | WO2024071400A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4828151B2 (ja) * | 2005-04-15 | 2011-11-30 | タツタ電線株式会社 | 導電性接着シート及び回路基板 |
| JP4933217B2 (ja) | 2006-10-26 | 2012-05-16 | タツタ電線株式会社 | 導電性接着剤 |
| WO2022024757A1 (ja) * | 2020-07-31 | 2022-02-03 | タツタ電線株式会社 | 導電性接着剤 |
| TWI884347B (zh) * | 2021-03-26 | 2025-05-21 | 日商拓自達電線股份有限公司 | 導電性接著劑層 |
-
2023
- 2023-06-29 TW TW112124216A patent/TW202415715A/zh unknown
- 2023-09-29 JP JP2024502034A patent/JP7494411B1/ja active Active
- 2023-09-29 CN CN202380055322.3A patent/CN119604949A/zh active Pending
- 2023-09-29 WO PCT/JP2023/035699 patent/WO2024071400A1/ja not_active Ceased
- 2023-09-29 KR KR1020257001016A patent/KR20250078889A/ko active Pending
-
2024
- 2024-04-22 JP JP2024069037A patent/JP7496949B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7494411B1 (ja) | 2024-06-03 |
| TW202415715A (zh) | 2024-04-16 |
| KR20250078889A (ko) | 2025-06-04 |
| JP7496949B1 (ja) | 2024-06-07 |
| CN119604949A (zh) | 2025-03-11 |
| JP2024094389A (ja) | 2024-07-09 |
| WO2024071400A1 (ja) | 2024-04-04 |
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