TW202402987A - 覆蓋層用膜、印刷電路板、覆蓋層用膜之製造方法及印刷電路板之製造方法 - Google Patents

覆蓋層用膜、印刷電路板、覆蓋層用膜之製造方法及印刷電路板之製造方法 Download PDF

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Publication number
TW202402987A
TW202402987A TW112111619A TW112111619A TW202402987A TW 202402987 A TW202402987 A TW 202402987A TW 112111619 A TW112111619 A TW 112111619A TW 112111619 A TW112111619 A TW 112111619A TW 202402987 A TW202402987 A TW 202402987A
Authority
TW
Taiwan
Prior art keywords
film
main surface
layer
adhesive layer
thickness
Prior art date
Application number
TW112111619A
Other languages
English (en)
Chinese (zh)
Inventor
一松拓馬
Original Assignee
日商住友電工印刷電路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電工印刷電路股份有限公司 filed Critical 日商住友電工印刷電路股份有限公司
Publication of TW202402987A publication Critical patent/TW202402987A/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW112111619A 2022-03-31 2023-03-28 覆蓋層用膜、印刷電路板、覆蓋層用膜之製造方法及印刷電路板之製造方法 TW202402987A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022059505 2022-03-31
JP2022-059505 2022-03-31

Publications (1)

Publication Number Publication Date
TW202402987A true TW202402987A (zh) 2024-01-16

Family

ID=88201989

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111619A TW202402987A (zh) 2022-03-31 2023-03-28 覆蓋層用膜、印刷電路板、覆蓋層用膜之製造方法及印刷電路板之製造方法

Country Status (5)

Country Link
US (1) US20250220822A1 (https=)
JP (1) JPWO2023190004A1 (https=)
CN (1) CN118830336A (https=)
TW (1) TW202402987A (https=)
WO (1) WO2023190004A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105532080B (zh) * 2013-09-12 2019-03-01 住友电气工业株式会社 印刷线路板用粘合剂组合物、结合膜、覆盖层、敷铜箔层压板和印刷线路板
JP6639775B2 (ja) * 2014-10-21 2020-02-05 住友電工プリントサーキット株式会社 樹脂フィルム、プリント配線板用カバーレイ、プリント配線板用基板及びプリント配線板
WO2021131244A1 (ja) * 2019-12-25 2021-07-01 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
US20250220822A1 (en) 2025-07-03
JPWO2023190004A1 (https=) 2023-10-05
WO2023190004A1 (ja) 2023-10-05
CN118830336A (zh) 2024-10-22

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