JPWO2023190004A1 - - Google Patents
Info
- Publication number
- JPWO2023190004A1 JPWO2023190004A1 JP2024512256A JP2024512256A JPWO2023190004A1 JP WO2023190004 A1 JPWO2023190004 A1 JP WO2023190004A1 JP 2024512256 A JP2024512256 A JP 2024512256A JP 2024512256 A JP2024512256 A JP 2024512256A JP WO2023190004 A1 JPWO2023190004 A1 JP WO2023190004A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022059505 | 2022-03-31 | ||
| PCT/JP2023/011435 WO2023190004A1 (ja) | 2022-03-31 | 2023-03-23 | カバーレイ用フィルム、プリント配線板、カバーレイ用フィルムの製造方法及びプリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190004A1 true JPWO2023190004A1 (https=) | 2023-10-05 |
| JPWO2023190004A5 JPWO2023190004A5 (https=) | 2024-12-13 |
Family
ID=88201989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512256A Pending JPWO2023190004A1 (https=) | 2022-03-31 | 2023-03-23 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250220822A1 (https=) |
| JP (1) | JPWO2023190004A1 (https=) |
| CN (1) | CN118830336A (https=) |
| TW (1) | TW202402987A (https=) |
| WO (1) | WO2023190004A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105532080B (zh) * | 2013-09-12 | 2019-03-01 | 住友电气工业株式会社 | 印刷线路板用粘合剂组合物、结合膜、覆盖层、敷铜箔层压板和印刷线路板 |
| JP6639775B2 (ja) * | 2014-10-21 | 2020-02-05 | 住友電工プリントサーキット株式会社 | 樹脂フィルム、プリント配線板用カバーレイ、プリント配線板用基板及びプリント配線板 |
| WO2021131244A1 (ja) * | 2019-12-25 | 2021-07-01 | タツタ電線株式会社 | 電磁波シールドフィルム |
-
2023
- 2023-03-23 WO PCT/JP2023/011435 patent/WO2023190004A1/ja not_active Ceased
- 2023-03-23 US US18/850,596 patent/US20250220822A1/en active Pending
- 2023-03-23 CN CN202380025562.9A patent/CN118830336A/zh active Pending
- 2023-03-23 JP JP2024512256A patent/JPWO2023190004A1/ja active Pending
- 2023-03-28 TW TW112111619A patent/TW202402987A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20250220822A1 (en) | 2025-07-03 |
| WO2023190004A1 (ja) | 2023-10-05 |
| CN118830336A (zh) | 2024-10-22 |
| TW202402987A (zh) | 2024-01-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240807 |
|
| A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20251121 |