CN118830336A - 覆盖层用膜、印刷布线板、覆盖层用膜的制造方法及印刷布线板的制造方法 - Google Patents

覆盖层用膜、印刷布线板、覆盖层用膜的制造方法及印刷布线板的制造方法 Download PDF

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Publication number
CN118830336A
CN118830336A CN202380025562.9A CN202380025562A CN118830336A CN 118830336 A CN118830336 A CN 118830336A CN 202380025562 A CN202380025562 A CN 202380025562A CN 118830336 A CN118830336 A CN 118830336A
Authority
CN
China
Prior art keywords
film
main surface
cover layer
thickness
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380025562.9A
Other languages
English (en)
Chinese (zh)
Inventor
一松拓马
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Printed Circuits Inc
Publication of CN118830336A publication Critical patent/CN118830336A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN202380025562.9A 2022-03-31 2023-03-23 覆盖层用膜、印刷布线板、覆盖层用膜的制造方法及印刷布线板的制造方法 Pending CN118830336A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022059505 2022-03-31
JP2022-059505 2022-03-31
PCT/JP2023/011435 WO2023190004A1 (ja) 2022-03-31 2023-03-23 カバーレイ用フィルム、プリント配線板、カバーレイ用フィルムの製造方法及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN118830336A true CN118830336A (zh) 2024-10-22

Family

ID=88201989

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380025562.9A Pending CN118830336A (zh) 2022-03-31 2023-03-23 覆盖层用膜、印刷布线板、覆盖层用膜的制造方法及印刷布线板的制造方法

Country Status (5)

Country Link
US (1) US20250220822A1 (https=)
JP (1) JPWO2023190004A1 (https=)
CN (1) CN118830336A (https=)
TW (1) TW202402987A (https=)
WO (1) WO2023190004A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105532080B (zh) * 2013-09-12 2019-03-01 住友电气工业株式会社 印刷线路板用粘合剂组合物、结合膜、覆盖层、敷铜箔层压板和印刷线路板
JP6639775B2 (ja) * 2014-10-21 2020-02-05 住友電工プリントサーキット株式会社 樹脂フィルム、プリント配線板用カバーレイ、プリント配線板用基板及びプリント配線板
WO2021131244A1 (ja) * 2019-12-25 2021-07-01 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
US20250220822A1 (en) 2025-07-03
JPWO2023190004A1 (https=) 2023-10-05
WO2023190004A1 (ja) 2023-10-05
TW202402987A (zh) 2024-01-16

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