TW202400340A - 雷射處理設備、雷射處理工件的方法及相關配置 - Google Patents

雷射處理設備、雷射處理工件的方法及相關配置 Download PDF

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Publication number
TW202400340A
TW202400340A TW112136236A TW112136236A TW202400340A TW 202400340 A TW202400340 A TW 202400340A TW 112136236 A TW112136236 A TW 112136236A TW 112136236 A TW112136236 A TW 112136236A TW 202400340 A TW202400340 A TW 202400340A
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Taiwan
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positioner
laser
workpiece
scan
range
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TW112136236A
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English (en)
Chinese (zh)
Inventor
馬克 昂瑞斯
馬克 匹柏斯
休 歐文斯
格溫多林 拜恩
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美商伊雷克托科學工業股份有限公司
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Publication of TW202400340A publication Critical patent/TW202400340A/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/703Cooling arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Lasers (AREA)
TW112136236A 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置 TW202400340A (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US201562216102P 2015-09-09 2015-09-09
US62/216,102 2015-09-09
US201562241624P 2015-10-14 2015-10-14
US62/241,624 2015-10-14
US201562271446P 2015-12-28 2015-12-28
US62/271,446 2015-12-28
US201662294991P 2016-02-12 2016-02-12
US62/294,991 2016-02-12
US201662366984P 2016-07-26 2016-07-26
US62/366,984 2016-07-26

Publications (1)

Publication Number Publication Date
TW202400340A true TW202400340A (zh) 2024-01-01

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TW112136236A TW202400340A (zh) 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置
TW111136791A TWI819817B (zh) 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置
TW110115591A TWI780684B (zh) 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置
TW105129325A TWI726909B (zh) 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置

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TW111136791A TWI819817B (zh) 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置
TW110115591A TWI780684B (zh) 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置
TW105129325A TWI726909B (zh) 2015-09-09 2016-09-09 雷射處理設備、雷射處理工件的方法及相關配置

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US (2) US11077526B2 (cg-RX-API-DMAC7.html)
JP (3) JP6921057B2 (cg-RX-API-DMAC7.html)
KR (3) KR20250037607A (cg-RX-API-DMAC7.html)
CN (3) CN108025396B (cg-RX-API-DMAC7.html)
TW (4) TW202400340A (cg-RX-API-DMAC7.html)
WO (1) WO2017044646A1 (cg-RX-API-DMAC7.html)

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