TW202349486A - 基板洗淨裝置及基板洗淨方法 - Google Patents

基板洗淨裝置及基板洗淨方法 Download PDF

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Publication number
TW202349486A
TW202349486A TW112113426A TW112113426A TW202349486A TW 202349486 A TW202349486 A TW 202349486A TW 112113426 A TW112113426 A TW 112113426A TW 112113426 A TW112113426 A TW 112113426A TW 202349486 A TW202349486 A TW 202349486A
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TW
Taiwan
Prior art keywords
substrate
cleaning liquid
spray head
spray
cleaning
Prior art date
Application number
TW112113426A
Other languages
English (en)
Chinese (zh)
Inventor
山田芳裕
Original Assignee
日商新創機電科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新創機電科技股份有限公司 filed Critical 日商新創機電科技股份有限公司
Publication of TW202349486A publication Critical patent/TW202349486A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW112113426A 2022-04-12 2023-04-11 基板洗淨裝置及基板洗淨方法 TW202349486A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-065855 2022-04-12
JP2022065855A JP7471671B2 (ja) 2022-04-12 2022-04-12 基板洗浄装置及び基板洗浄方法

Publications (1)

Publication Number Publication Date
TW202349486A true TW202349486A (zh) 2023-12-16

Family

ID=88421215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112113426A TW202349486A (zh) 2022-04-12 2023-04-11 基板洗淨裝置及基板洗淨方法

Country Status (3)

Country Link
JP (1) JP7471671B2 (ja)
KR (1) KR20230146473A (ja)
TW (1) TW202349486A (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001170584A (ja) 1999-12-17 2001-06-26 Sharp Corp 超音波処理装置
JP3778815B2 (ja) 2001-06-21 2006-05-24 大日本スクリーン製造株式会社 基板洗浄装置
JP6180811B2 (ja) 2013-06-19 2017-08-16 株式会社荏原製作所 基板処理装置
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP6338275B2 (ja) 2014-06-27 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
KR20230146473A (ko) 2023-10-19
JP7471671B2 (ja) 2024-04-22
JP2023156161A (ja) 2023-10-24

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