TW202349486A - Substrate washing apparatus and substrate washing method characterized by reducing the hydraulic pressure of the washing liquid supplied to the substrate, diminishing the substrate damage caused by the supply of the washing liquid and avoiding separation of the electronic components with low adhesion to the substrate - Google Patents

Abstract

To reduce the hydraulic pressure of the washing liquid supplied for the substrate, diminish the substrate damage caused by the supply of the washing liquid and avoiding separation of the electronic components with low adhesion to the substrate. A device is used to wash the substrate (W) by supplying the washing liquid (L) for the rotary substrate (W). The device is equipped with: the workbench (10) that is used to hold the substrate (W) and carry out rotation; and the spraying head (40) that is mounted in the status where the spraying direction of the washing liquid (L) is deviated from the substrate (W). The washing liquid (L) is supplied to the substrate (W) on the workbench (10) via the falling of the water mist of the washing liquid (L) sprayed from the spraying head (40) onto the substrate (W).

Description

Substrate cleaning device and substrate cleaning method

The present invention relates to a substrate cleaning device and a substrate cleaning method.

It is known that when cleaning a substrate such as a semiconductor, a cleaning liquid is supplied from a nozzle arranged above the substrate toward the upper surface of the substrate while the substrate is rotated, and the cleaning liquid is spread to the upper surface of the substrate to perform cleaning. A clean rotation-type substrate cleaning device (for example, Patent Documents 1 to 3). In Patent Documents 1 to 3, the nozzle is arranged above the substrate, and the cleaning liquid supplied from the nozzle is supplied toward the center portion of the upper surface of the substrate. The cleaning liquid supplied to the center portion of the substrate spreads toward the outer periphery of the substrate due to the rotation of the substrate, thereby cleaning the entire upper surface of the substrate. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2015-201627 [Patent Document 2] Japanese Patent Application Publication No. 2019-41116 [Patent Document 3] Japanese Patent Application Publication No. 2021-16007

[Problem to be solved by the invention]

Patterns and electronic components (hereinafter referred to as "electronic components, etc.") formed on a substrate may have low adhesion to the substrate. When cleaning such a substrate, if the cleaning liquid is supplied from the nozzle toward the substrate, there is a risk that all or part of electronic components with low adhesion may be peeled off from the substrate due to the hydraulic pressure of the cleaning liquid. If electronic parts and the like are peeled off from the substrate, it will not only affect the quality of the electronic device, but also reduce the yield during the manufacturing of the electronic device, which is undesirable.

An object of the present invention is to provide a substrate cleaning device that can reduce the hydraulic pressure of the cleaning liquid supplied to the substrate, reduce damage to the substrate caused by the supply of the cleaning liquid, and prevent electronic components with low adhesion to the substrate from peeling off; Substrate cleaning method. [Means used to solve problems]

A substrate cleaning apparatus according to an aspect of the present invention is an apparatus for supplying a cleaning liquid to a rotating substrate to clean the substrate. The apparatus includes: a worktable on which the substrate is placed and rotated; and a spray head on which the substrate is rotated. The spraying direction of the cleaning liquid is deviated from the substrate; the water mist of the cleaning liquid sprayed from the spray head falls on the substrate to supply the cleaning liquid to the substrate on the workbench.

A substrate cleaning method according to an aspect of the present invention is a method for cleaning the substrate by spraying a cleaning liquid from a spray head while rotating the substrate. The method includes: spraying the cleaning liquid from the spray head with the spray direction deviating from the substrate. Cleaning liquid is a process in which the cleaning liquid droplets fall onto the substrate to supply the cleaning liquid to the substrate. [Effects of the invention]

According to the substrate cleaning apparatus and substrate cleaning method of the above-mentioned aspect, the direction of the cleaning liquid sprayed from the spray head is set to a direction away from the substrate, and the cleaning liquid sprayed from the spray head becomes water mist (droplets, mist). ) falls to the upper surface of the substrate and is supplied to the substrate, so that the hydraulic pressure of the cleaning fluid on the substrate becomes smaller. As a result, damage to the substrate caused by the supply of the cleaning solution is reduced, and even electronic components with low adhesion to the substrate can be prevented from peeling off from the substrate.

Hereinafter, embodiments will be described with reference to the drawings. However, the present invention is not limited to the contents described below. In the drawings, a part is emphasized or a part is simplified for easy understanding of each structure, but the actual structure, shape, size, etc. may differ from each other. Use the XYZ coordinate system in the diagram to illustrate the orientation in the diagram. The XY plane is a horizontal plane. Let one of the directions on the XY plane be denoted as the X direction. Let the direction orthogonal to the X direction in the horizontal plane be denoted as the Y direction. The direction perpendicular to the X direction and the Y direction is expressed as the Z direction. Furthermore, for the X direction, Y direction and Z direction, the direction pointed by the arrow in the figure is the + direction, and the direction opposite to the direction pointed by the arrow is the - direction.

<First Embodiment> [Substrate cleaning device] The substrate cleaning apparatus 100 according to the first embodiment will be described. FIG. 1 is a side view showing an example of the substrate cleaning device 100 according to the first embodiment. FIG. 2 is a top view showing an example of the substrate cleaning device 100 according to the first embodiment. The substrate cleaning apparatus 100 is used, for example, to remove deposits (residues) attached to the upper surface of the substrate W or films formed on the substrate W (hereinafter referred to as "deposits, etc.") that adhere to the upper surface of the substrate W when manufacturing a semiconductor device. wait. The substrate W is, for example, a semiconductor substrate on which electronic components, electronic circuits, etc. are formed. In this embodiment, a circular substrate W is shown in plan view. However, the substrate W is not limited to a circular shape and may be a rectangular (square shape, rectangular shape) corner substrate.

Examples of the aforementioned attachments include a film (layer) formed on the substrate W such as an adhesive layer. Examples of substances constituting the adhesive layer include hydrocarbon resins, acrylic-styrene resins, maleimide resins, elastic resins, polystyrene resins, or compounds that combine these resins. . Moreover, as other attachments, for example, when the substrate W and the support are laminated with the photoreaction layer interposed therebetween, the residue of the photoreaction layer adhered to the upper surface of the substrate W after the support is removed from the laminated body. Examples of substances constituting the photoreactive layer include fluorocarbons, polymers whose repeating units include a structure that absorbs light (eg, laser light), inorganic substances, and compounds that have a structure that absorbs infrared rays.

As shown in FIGS. 1 and 2 , the substrate cleaning apparatus 100 includes a workbench 10 , a storage part 20 , a nozzle driving part 30 , a spray head 40 , a cleaning liquid supply part 50 , and a control part 60 . The table 10 includes a shaft portion 11 . The shaft portion 11 is provided to extend downward (-Z direction) from the center portion of the lower surface of the table 10 . The shaft portion 11 is supported rotatably about the central axis AX1 by a bearing not shown or the like. The central axis AX1 is parallel to the vertical direction. The table 10 rotates around the central axis AX1 together with the shaft portion 11 . The shaft portion 11 is connected to the rotation drive portion 12 . The rotation drive part 12 rotates the table 10 through the shaft part 11 . The rotation drive unit 12 rotates the table 10 in the rotation direction P at a predetermined rotation speed about the central axis AX1. As the rotation drive unit 12, for example, an electric motor or the like is used.

The workbench 10 places the substrate W on the upper surface. The table 10 has, for example, a circular shape in a plan view, and the diameter of the upper surface is set to be slightly larger than the diameter of the substrate W. That is, when the substrate W is placed on the upper surface of the table 10 with the center part O of the substrate W aligned with the central axis AX1 of the table 10 , the outer edge part E of the substrate W becomes the center of the table 10 . The inside of the outer perimeter of the upper surface.

The table 10 is provided with a suction part (not shown) in a range where the substrate W is placed, for example. The suction part is formed on the upper surface of the workbench 10 by combining a plurality of radial grooves and a plurality of annular grooves, and a part of the grooves is connected to a suction pump. After the substrate W is placed on the table 10, the suction pump of the suction part is driven, so that the substrate W is held on the upper surface of the table 10 by the suction part. In addition, the adsorption part may have any form, and any form capable of holding the substrate W on the upper surface of the table 10 may be applied.

The storage unit 20 accommodates the workbench 10 . The accommodating portion 20 is, for example, fixed to a base (not shown) of the substrate cleaning device 100 . The accommodating part 20 is, for example, in the shape of a cup surrounding the workbench 10 . Examples of the material of the accommodating portion 20 include metal and resin. However, when the cleaning liquid L is supplied to the substrate W, the cleaning liquid L may adhere to the substrate W. Therefore, a material that is resistant to the components of the cleaning liquid L is good. The receiving portion cup portion is provided with an insertion hole 21 at the bottom for inserting the shaft portion 11 .

The nozzle driving part 30 includes a pillar 31 , a lifting part 32 , a rotating part 33 , a supporting part 34 , a shaft part 35 , an arm part 36 , and a driving part 37 . The pillar 31 is provided to extend in the vertical direction (Z direction), and is, for example, fixed to a base (not shown) of the substrate cleaning device 100 . The lifting part 32 is supported by the pillar 31 so as to be movable in the vertical direction. The pillar 31 is provided with a guide portion (not shown) in the vertical direction, and the lifting portion 32 can move in the vertical direction along the guide portion. The rotating part 33 is provided on the upper surface side (+Z surface side) of the lifting part 32 . The rotating part 33 is held by the lifting part 32 through a bearing (not shown), and is rotatable about the rotation axis AX2 with respect to the lifting part 32 . The rotation axis AX2 is parallel to the vertical direction.

The support portion 34 is provided to extend upward from the upper surface of the rotating portion 33 . The support portion 34 is provided at a position separated from the rotation axis AX2 in a plan view. When the rotating part 33 rotates around the rotating axis AX2, the supporting part 34 becomes integral with the rotating part 33 and rotates around the rotating axis AX2. The shaft portion 35 is provided to extend in the horizontal direction from the side surface of the support portion 34 . The shaft portion 35 is held by the support portion 34 through a bearing (not shown), and is rotatable about the rotation axis AX3 with respect to the support portion 34 . The rotation axis AX3 is parallel to the horizontal direction and orthogonal to the rotation axis AX2. Furthermore, when the rotating part 33 rotates around the rotating axis AX2, the shaft part 35 becomes integral with the supporting part 34 and rotates around the rotating axis AX2.

The arm portion 36 is a rod-shaped body and is held by the shaft portion 35 . The arm portion 36 is attached to the shaft portion 35 in a state where a portion of the arm portion 36 is inserted into an insertion hole provided in the shaft portion 35 . The length of the arm 36 is arbitrary. In addition, the attachment position of the arm portion 36 to the shaft portion 35 may be changed. That is, the distance between the spray head 40 attached to the front end of the arm part 36 and the shaft part 35 may be adjusted. The arm portion 36 swings in the horizontal direction with the rotation axis AX2 as the center when the rotation portion 33 rotates around the rotation axis AX2. In addition, when the shaft portion 35 rotates around the rotation axis AX3, the arm portion 36 swings in the up and down direction with the rotation axis AX3 as the center.

The driving part 37 drives each part of the nozzle driving part 30. The driving part 37 raises and lowers the lifting part 32 with respect to the support|pillar 31. Moreover, the driving part 37 rotates the rotating part 33 with respect to the lifting part 32. In addition, the driving part 37 rotates the shaft part 35 through the supporting part 34. Furthermore, the drive unit 37 may be provided with individual drive sources for driving each unit, or may be configured to use one drive source and drive each unit by switching propagation paths. As a driving source of the driving part 37, for example, an electric motor, a cylinder device, etc. are used.

The spray head 40 is installed at the front end of the arm 36 . The spray head 40 is arranged above the substrate W and outside the substrate W in a plan view. In this embodiment, the spray head 40 is disposed above the upper part of the accommodating part 20 and outside of the accommodating part 20 . The position of the spray head 40 in a top view can be adjusted through the length of the arm 36 or the fixed position of the arm 36 with respect to the shaft 35. The spray head 40 is connected to the shaft portion 35 through the arm portion 36 . Therefore, the spray head 40 swings in the horizontal direction through the arm portion 36 with the rotation axis AX2 as the center, thereby swinging in the horizontal direction, and swings in the up and down direction through the arm portion 36 with the rotation axis AX3 as the center, thereby swinging in the up and down direction. direction.

The spray head 40 is provided with an ejection port 41 for ejecting the cleaning liquid L. The cleaning liquid L sprayed from the spray port 41 becomes a mist m and travels while spreading from the spray port 41 . At this time, the spray direction D of the cleaning liquid L of the spray head 40 is set in a direction deviating from the upper surface of the substrate W as shown in FIG. 1 . That is, the spray head 40 is disposed so that the spray direction D of the cleaning liquid L is directed outside the outer edge E of the substrate W. In addition, in a plan view, the discharge direction D of the cleaning liquid L is set so as to pass through the center part O of the substrate W as shown in FIG. 2 . The cleaning liquid L sprayed from the spray port 41 in the spray direction D passes through and becomes water mist m (droplets, mist, etc.) and falls on the substrate W, thereby being supplied to the substrate W. The cleaning liquid L supplied to the substrate W rotates around the central axis AX1 through the substrate W, and spreads on the upper surface of the substrate W by centrifugal force, so that the substrate W is cleaned. In addition, the details about the discharge direction D of the cleaning liquid L will be described later.

The spray head 40 is connected to the cleaning liquid supply part 50 . The cleaning liquid L passes through a supply pipe (not shown) and is sent from the cleaning liquid supply part 50 to the spray head 40 . In addition, as a supply pipe, a flexible pipe etc. are used, for example. As long as the material of the supply pipe is resistant to the components of the cleaning liquid L, any known material can be used. For example, materials for the supply pipe include metal, resin such as vinyl chloride, and the like. The cleaning liquid supply part 50 has, for example, a tank for storing the cleaning liquid L, a liquid supply pump for sending out the cleaning liquid L, and a flow rate adjustment part. This flow rate adjustment unit adjusts the flow rate of the cleaning liquid L sent to the spray head 40 per unit time.

The cleaning liquid L is a liquid required for cleaning the attachment layer adhering to the upper surface of the substrate W. For example, pure water, an organic solvent, etc. are used. For example, when the attachments attached to the upper surface of the substrate W are an adhesive layer provided on the substrate W, an organic solvent or the like is used as the cleaning liquid L. In addition, when the attachment attached to the upper surface of the substrate W is the aforementioned photoreactive layer, the organic solvent is used as the cleaning liquid L to wash, and then pure water is passed through to wash.

In addition, the above-mentioned nozzle driving part 30 is only an example, and is not limited to this form. The nozzle drive unit 30 may use any drive system that moves the ejection direction D of the cleaning liquid L by the nozzle head 40 to the X direction, the Y direction, the Z direction, or a combination of these directions. For example, the nozzle driving unit 30 may use a robot arm (multi-joint arm) that holds the spray head 40 at the front end.

The control unit 60 controls the system and the substrate cleaning device 100, for example, using a computer. The control unit 60 controls the rotation drive unit 12 , the drive unit 37 and the cleaning liquid supply unit 50 . The control unit 60 controls the rotation drive unit 12 to cause the cleaning liquid L to be sprayed from the spray head 40 by rotating and stopping the table 10 and further driving the cleaning liquid supply unit 50 during the rotation of the table 10 . control. In addition, the control unit 60 can set the spray direction D of the cleaning liquid L caused by the spray head 40 by controlling the driving unit 37 . The control unit 60 sets the cleaning liquid L by controlling the height of the spray head 40, the horizontal swing amount of the spray head 40 about the rotation axis AX2, and the vertical swing amount of the spray head 40 about the rotation axis AX3. The ejection direction D. Furthermore, the ejection direction D may be a setting memorized in advance using a memory unit (not shown) included in the control unit 60, or may be appropriately set by the operator.

FIG. 3 is a side view showing an example in which the spray direction D of the spray head 40 is changed to the up-down direction. The spray head 40 penetrates the nozzle driving part 30, and the arm part 36 swings around the rotation axis AX3, thereby swinging in the up and down direction. As described above, the ejection direction D of the spray head 40 is set in a direction away from the substrate W. Therefore, as shown in FIG. 3 , the ejection direction D of the spray head 40 can be set between the ejection direction DA parallel to the horizontal direction and the ejection direction DB toward the outer edge E of the substrate W. In addition, in this embodiment, the ejection direction D deviating from the substrate W is used to include the ejection direction DB toward the outer edge portion E of the substrate W.

The discharge direction D is set based on the state of the cleaning liquid L discharged from the discharge port 41 of the spray head 40 . That is, when the particle diameter of the water mist m of the sprayed cleaning liquid L is large, it is set in the spray direction DA or a direction close to the spray direction DA. Even in the ejection direction DA or a direction close to the ejection direction DA, the cleaning liquid L can be supplied to the substrate W appropriately because the water mist m falls quickly. On the other hand, when the particle size of the water mist m of the sprayed cleaning liquid L is small, it is set in the spray direction DB or a direction close to the spray direction DB. Even if the particle diameter of the water mist m of the sprayed cleaning liquid L is small, the cleaning liquid L can be appropriately supplied to the substrate W by being set in the spraying direction DB or in a direction close to the spraying direction DB. The particle diameter of the water mist m of the cleaning liquid L can be appropriately set according to the application by exchanging or adjusting the spray head 40. For example, when the particle diameter is large, it is 300 to 1000 μm, and when the particle diameter is small, it is 0.01 to 100 μm.

FIG. 4 is a plan view showing an example in which the spray direction D of the spray head 40 is changed to the horizontal direction. The spray head 40 passes through the spray head driving part 30, and the arm part 36 swings around the rotation axis AX2, thereby swinging in the horizontal direction. In the example shown in FIG. 2 , the ejection direction D is set so as to overlap the center portion O of the substrate W in a plan view, but the ejection direction D is not limited to this form. The ejection direction D may be deviated from the center portion O of the substrate W in a plan view. As shown in FIG. 4 , the ejection direction D of the spray head 40 can be set to one of the ejection direction DC, which is one of the connection directions with the outer edge part E of the substrate W, and the connection direction with the outer edge part E of the substrate W from a plan view. The other is between the ejection direction DD.

The ejection direction D may be set closer to the ejection direction DC than the center part O or to the ejection direction DD side of the center part O in a plan view, and may be set based on the relationship with the rotation direction P of the substrate W. When the discharge direction D is set closer to the discharge direction DC than the center portion O, the direction of the cleaning liquid L discharged from the discharge port 41 (the flow direction of the water mist m) is opposite to the rotation direction P of the substrate W. That is, the water mist m can be supplied to the substrate W slightly strongly. When the discharge direction D is set closer to the discharge direction DD than the center part O, the direction of the cleaning liquid L discharged from the discharge port 41 (the flow direction of the water mist m) becomes the same as the rotation direction P of the substrate W. That is, the water mist m can be supplied to the substrate W gently.

FIG. 5 is a top view showing an example of moving the spray head 40 in the horizontal direction. As shown in FIG. 4 , the spray head 40 may move in the Y direction with the spray direction D facing the -X direction. The support 31 of the nozzle driving unit 30 is provided movably along the rail R. The track R is arranged to extend in the Y direction. The pillar 31 moves along the rail R in the Y direction by the driving part 37 . The spray head 40 moves in the Y direction by the movement of the support 31 in the Y direction. Therefore, in a plan view, the position in the Y direction with respect to the ejection direction D of the substrate W can be arbitrarily set by the position of the spray head 40 in the Y direction.

FIG. 6 is a side view showing an example of raising and lowering the spray head 40 in the vertical direction. As described above, the lifting portion 32 can be raised and lowered along the guide portion (not shown) of the pillar 31 by the driving portion 37 . As a mechanism for raising and lowering the lifting part 32 by the driving part 37, for example, a ball screw mechanism using an electric motor as a driving source, a rack mechanism, or the like is used. In addition, when the spray head 40 is set to face downward, the position of the spray head 40 can be raised by raising the lifting portion 32, so that the spray direction D can be deviated from the substrate W.

In the above-mentioned embodiment, the form in which the position of the spray head 40 is fixed when the cleaning liquid L is ejected is taken as an example for description, but the invention is not limited to this form. For example, the spray head 40 may be moved together with the spraying of the cleaning liquid L. FIG. 7 is a side view showing an example of swinging the spray direction D of the spray head 40 in the up and down direction. As described above, the spray head 40 can change the direction of the ejection port 41 to the up-down direction with the rotation axis AX3 as the center. The control unit 60 may drive the cleaning liquid supply unit 50 to eject the cleaning liquid L from the spray head 40 and drive the nozzle driving unit 30 to rock the spray head 40 in the up and down direction. As a result, the discharge direction D of the cleaning liquid L swings in the up and down direction.

The swing range of the vertical discharge direction D may be set to a range from the discharge direction DA to the discharge direction DB shown in FIG. 3 , for example. Furthermore, when the ejection direction D is oscillated in the up-and-down direction, the ejection direction D may be directed toward the substrate W in a part of the oscillation range. Even in this form, the time required to direct the ejection direction D toward the substrate W is short, so the damage to the substrate W will not increase. Furthermore, instead of swinging the spray head 40 in the up and down direction, as shown in FIG. 6 , the spray head 40 may be raised and lowered by raising and lowering the lifting part 32 while spraying the cleaning liquid L from the spray head 40 . In a part of the lifting range of the spray head 40 , the spray direction D may be directed toward the substrate W in the same manner as when the spray head 40 is rocked in the up-and-down direction.

FIG. 8 is a plan view showing an example of swinging the spray direction D of the spray head 40 to the horizontal direction. As described above, the spray head 40 can change the direction of the ejection port 41 to the horizontal direction with the rotation axis AX2 as the center. The control unit 60 may drive the cleaning liquid supply unit 50 to eject the cleaning liquid L from the spray head 40 and drive the nozzle driving unit 30 to rock the spray head 40 in the horizontal direction. As a result, the discharge direction D of the cleaning liquid L swings in the horizontal direction.

The swing range in the horizontal discharge direction D may be set to a range from the discharge direction DC shown in FIG. 4 to the discharge direction DD, for example. In addition, the swing range of the ejection direction D may be set including the range in which the ejection direction D deviates from the substrate W in a plan view. Furthermore, instead of swinging the spray head 40 in the horizontal direction, as shown in FIG. 5 , the support 31 may be reciprocated in the +Y direction and the -Y direction while spraying the cleaning liquid L from the spray head 40 . In a part of the reciprocating movement range of the spray head 40 , the discharge direction D may deviate from the substrate W in a plan view, similarly to the case where the spray head 40 is rocked in the horizontal direction.

[Substrate cleaning method] The substrate cleaning method according to the embodiment will be described. FIG. 9 is a flowchart showing an example of a substrate cleaning method according to the embodiment. This substrate cleaning method is performed by the aforementioned substrate cleaning device 100 . As shown in FIG. 9 , first, the substrate W is placed on the stage 10 (step S01 ). In step S01, the substrate W is placed on the workbench 10 by, for example, a transport device. This conveying device includes, for example, an adsorption pad that adsorbs the upper surface of the substrate W. The substrate W is conveyed while being adsorbed through the adsorption pad, and the substrate W is placed on the workbench 10 . Thereafter, the substrate W is evacuated from the substrate cleaning apparatus 100 through adsorption by opening the adsorption pad, and the substrate W is placed on the workbench 10 .

In addition, after the substrate W is placed on the table 10, the control unit 60 drives the suction unit (not shown) to cause the table 10 to suction and hold the substrate W. Furthermore, after the substrate W is placed on the stage 10 and before the substrate W is adsorbed, the substrate W may be calibrated so that the center part O of the substrate W coincides with the central axis AX1. When performing such calibration of the substrate W, after the calibration of the substrate W, the substrate W is adsorbed by the adsorption unit.

Next, the control unit 60 rotates the table 10 (step S02). In step S02 , the control unit 60 drives the rotation drive unit 12 to rotate the table 10 through the shaft unit 11 . The control unit 60 can appropriately change the number of rotations of the table 10 according to the type of attachments removed from the substrate W and the like. The value of the rotational speed of the table 10 may be set in advance in a memory unit (not shown) provided in the control unit 60, or may be appropriately set by the operator.

Next, the control unit 60 drives the nozzle driving unit 30 to set the ejection direction D of the spray head 40 away from the substrate W (step S03). In step S03, the control unit 60 obtains information related to the diameter of the cleaned substrate W in advance. The control unit 60 controls the nozzle driving unit 30 so that the direction of the ejection port 41 of the spray head 40 (discharge direction D) deviates from the substrate W based on the information about the diameter of the substrate W. The control unit 60 drives the driving unit 37 of the nozzle driving unit 30 to set the height of the spray head 40, the position in the Y direction, the direction of the ejection port 41 in the up and down direction, the direction of the ejection port 41 in the horizontal direction, and the like.

At this time, as shown in the aforementioned embodiment, when the spray head 40 is rocked in the up and down direction, the control unit 60 sets the rocking range of the spray head 40 in the up and down direction and the rocking range in the horizontal direction. The direction, swing range, etc. of the spray head 40 are associated with the diameter of the substrate W, the removed attachments, etc., and are stored in a memory unit (not shown) in advance. The control unit 60 sets the direction, swing range, etc. of the spray head 40 based on the setting values stored in the memory unit in advance. However, the direction, swing range, etc. of the spray head 40 are not limited to being set to preset values, and may be set manually by the operator.

Next, the control unit 60 sprays the cleaning liquid L (step S04). In step S04 , the control unit 60 drives the cleaning liquid supply unit 50 to spray the cleaning liquid L from the spray head 40 . The amount of cleaning liquid L ejected from the spray head 40 or the ejection time are stored in advance by a memory unit (not shown) or the like. The control unit 60 sprays the cleaning liquid L from the spray head 40 based on a predetermined amount or a predetermined time stored in a memory unit or the like in advance. The amount or the spraying time of the cleaning liquid L sprayed from the spray head 40 may be set according to the rotation speed of the table 10 . However, the amount or the spraying time of the cleaning liquid L sprayed from the spray head 40 is not limited to being set to a preset value, and may be set manually by the operator.

In the aforementioned step S03, the spray direction D is set to a direction away from the substrate W. Therefore, the cleaning liquid L sprayed in the step S04 turns into water mist m and falls on the upper surface of the substrate W. As a result, the cleaning liquid L is supplied with a low hydraulic pressure to the upper surface of the substrate W, so that damage to the electronic components of the substrate W and the like can be reduced. The cleaning liquid L supplied to the upper surface of the substrate W rotates around the central axis AX1 through the substrate W and spreads to the entire substrate W by centrifugal force to remove attachments and the like on the upper surface of the substrate W.

Next, the control unit 60 stops the ejection of the cleaning liquid L (step S05). In step S05 , after the control unit 60 sprays the cleaning liquid L by a predetermined amount, or after the spraying of the cleaning liquid L elapses for a predetermined time, the control unit 60 stops driving the cleaning liquid supply unit 50 and stops the spraying of the cleaning liquid L from the spray head 40 . . The control unit 60 obtains the elapsed time of a predetermined time from a timer not shown, for example, stops driving the cleaning liquid supply unit 50 , and stops the supply of the cleaning liquid L to the spray head 40 . Furthermore, the control unit 60 obtains information on the flow rate of the cleaning liquid L sent from the flow rate adjustment unit provided in the cleaning liquid supply unit 50, and may stop driving the cleaning liquid supply unit 50 at the timing when a predetermined flow rate is sent. .

Next, the control unit 60 stops the rotation of the table 10 (step S06). In step S06, the control unit 60 drives the rotation drive unit 12 to stop the rotation of the table 10. Next, the control unit 60 unloads the substrate W from the workbench 10 (step S07). In step S07, the control unit 60 retracts the spray head 40 from above the substrate W. Next, the control unit 60 releases the adsorption of the substrate W by the adsorption unit of the stage 10 . As a result, the substrate W becomes ready to be carried out from the workbench 10 . The substrate W on the workbench 10 is carried out from the workbench 10 by, for example, the aforementioned transport device.

By performing the above-mentioned series of steps, the cleaning of the substrate W is completed. Furthermore, the rotation of the table 10 in step S02 may be performed simultaneously with the setting of the direction of the spray head 40 in step S03, or step S03 may be performed earlier than step S02. In addition, before unloading the substrate W in step S07, a step of drying the substrate W may be performed. This drying step is applicable to a state where the substrate W is placed on the workbench 10, and the substrate W may be maintained for a predetermined time in a heated or non-heated manner.

In this way, according to the first embodiment, the ejection direction D of the cleaning liquid L is set in a direction deviating from the substrate W. Therefore, the cleaning liquid L turns into water mist m and falls on the upper surface of the substrate W, thereby reducing the impact on the substrate W. Hydraulic pressure on the upper surface. Therefore, excessive pressure is not applied to the electronic components and the like on the substrate W, and peeling off of the electronic components and the like from the substrate W can be suppressed.

In the above-mentioned embodiment, the form in which the spray head 40 is arranged offset from the upper side of the substrate W is taken as an example for description, but the invention is not limited to this form. The spray head 40 may be arranged above the substrate W. FIG. 10 is a side view showing a substrate cleaning device 100 according to a modified example. As shown in FIG. 10 , the spray head 40 is arranged above the substrate W, and the ejection direction D is set at an angle V1 with respect to the vertical direction. In the configuration shown in Figure 10, angle V1 is approximately 30˚. Even in this situation, the discharge direction D of the cleaning liquid L is set from the outer edge E of the substrate W toward the outside. In addition, in the form shown in FIG. 10 , the cleaning liquid L turns into water mist m and falls on the upper surface of the substrate W, similarly to the aforementioned embodiment. Furthermore, in the form shown in FIG. 10 , the spray head 40 may be swung in the up-and-down direction or the horizontal direction, which is the same as in the aforementioned embodiment.

FIG. 11 is a side view showing another example of the substrate cleaning device 100 according to the modification. As shown in FIG. 11 , the spray head 40 is arranged above the substrate W, and the ejection direction D is set at an angle V2 with respect to the vertical direction. In the configuration shown in Figure 11, angle V2 is approximately 60˚. Even in this situation, the discharge direction D of the cleaning liquid L is set from the outer edge E of the substrate W toward the outside. In addition, in the form shown in FIG. 11 , the cleaning liquid L turns into water mist m and falls on the upper surface of the substrate W, similarly to the aforementioned embodiment. Furthermore, in the form shown in FIG. 11 , the spray head 40 may be swung in the up-and-down direction or the horizontal direction, which is the same as in the aforementioned embodiment.

As shown in FIGS. 10 and 11 , when the spray head 40 is arranged above the substrate W, the spray direction D can also be set downward and set at an angle of 30˚ to 60˚ with respect to the vertical direction. The discharge direction D of the clean liquid L is deviated outward from the outer edge E of the substrate W. In this way, the spray head 40 can also be arranged above the substrate W, so the variation in the arrangement of the spray head 40 can be increased. In addition, as mentioned above, the cleaning liquid L is sprayed from the spray port 41 of the spray head 40 in a spreading manner. Therefore, even in the form shown in FIGS. 10 and 11 , the cleaning liquid L can be supplied to the center part O of the substrate W and its vicinity.

<Second Embodiment> The substrate cleaning apparatus 200 according to the second embodiment will be described. In the above-mentioned first embodiment, the form using one spray head 40 is taken as an example and explained, but the invention is not limited to this form. A plurality of spray heads 40 may be used. FIG. 12 is a top view showing an example of the substrate cleaning device 200 according to the second embodiment. In addition, in FIG. 12 , the same structures as those in the first embodiment are assigned the same reference numerals and their descriptions are omitted or simplified.

As shown in FIG. 12 , the substrate cleaning device 200 has three spray heads 40 arranged around the accommodating part 20 (substrate W) in a plan view. The three spray heads 40 are arranged at equal intervals (at intervals of 120˚) around the accommodating part 20 . Furthermore, the three spray heads 40 are not limited to being arranged at equal intervals around the accommodating part 20, but may be arranged at different intervals. In addition, the three spray heads 40 may be of the same type or may be of different types. Each of the three spray heads 40 sets the spray direction D of the cleaning liquid L through the nozzle driving unit 30 . The three spray heads 40 are set as the discharge directions D of the cleaning liquid L, respectively, as the discharge directions D1, D2, and D3.

The ejection directions D1, D2, and D3 are each set toward the outside of the outer edge portion E of the substrate W. However, the lengths (angles with respect to the vertical direction) from the substrate W in the ejection directions D1, D2, and D3 may be the same or different for the three spray heads 40. The ejection directions D1, D2, and D3 are each set so as to pass through the center portion O of the substrate W in a plan view. However, it may be set so that at least one of the ejection directions D1, D2, and D3 is offset from the center portion O of the substrate W.

The three spray heads 40 supply the cleaning liquid L from the cleaning liquid supply part 50 . At this time, the cleaning liquid L may be supplied from one cleaning liquid supply part 50 to the three spray heads 40 . For the three spray heads 40 , the cleaning liquid L may be supplied from individual cleaning liquid supply parts 50 The form of supply is also available. At this time, different types of cleaning liquid L can be sprayed from the three spray heads 40 . In addition, the timing at which the cleaning liquid L is ejected and the ejection amount of the cleaning liquid L from the three spray heads 40 may be the same or different. The spray directions D1, D2, and D3 of the three spray heads 40 and the spray of the cleaning liquid L are controlled by the control unit 60.

In this manner, in the second embodiment, similarly to the above-described first embodiment, the cleaning liquid L turns into water mist m and falls on the upper surface of the substrate W, thereby reducing the hydraulic pressure on the upper surface of the substrate W. In addition, since the cleaning liquid L is sprayed from the three spray heads 40, the cleaning liquid L can be widely supplied to the upper surface of the substrate W. In addition, since the cleaning liquid L is sprayed from the three spray heads 40, a predetermined amount of the cleaning liquid L can be sprayed in a short time, and the substrate W can be cleaned efficiently. Furthermore, in the second embodiment, three spray heads 40 are used, but two or four or more spray heads 40 may be used.

<3rd Embodiment> The substrate cleaning device 300 according to the third embodiment will be described. In the above-mentioned second embodiment, the configuration in which the plurality of spray heads 40 are arranged around the housing portion 20 (substrate W) is taken as an example and explained, but the configuration is not limited to this configuration. A plurality of spray heads 40 may be arranged in the up-and-down direction. FIG. 13 is a top view showing an example of the substrate cleaning device 300 according to the third embodiment. In addition, in FIG. 13 , the same structures as those in the first embodiment are assigned the same reference numerals and their descriptions are omitted or simplified.

As shown in FIG. 13 , the substrate cleaning device 300 has two spray heads 40 arranged one above the other. The two spray heads 40 are supported by the nozzle driving unit 30A. The nozzle driving part 30A has a support part 34A extending upward from the rotating part 33 (see FIG. 2 ). The support part 34A is longer in the vertical direction than the support part 34 of the first embodiment. Two shaft portions 35 are provided on the upper and lower sides of the support portion 34A, and the spray heads 40 are supported through each shaft portion 35. The two spray heads 40 may be of the same type, or may be of different types.

The two spray heads 40 set the spray direction D of the cleaning liquid L by the nozzle driving unit 30A. The two spray heads 40 are set as the discharge directions D of the cleaning liquid L, respectively, as the discharge directions D4 and D5. The ejection directions D4 and D5 are respectively set toward the outside of the outer edge portion E of the substrate W. However, the lengths (angles with respect to the vertical direction) from the substrate W in the ejection directions D4 and D5 may be the same or different for the two spray heads 40 . For example, the discharge direction D5 may be set further downward than the discharge direction D4. That is, the angle with respect to the vertical discharge direction D5 may be smaller than the angle with respect to the vertical discharge direction D4.

In addition, the discharge directions D4 and D5 in the plan view are made the same by using one support part 34A as described above. For example, the ejection directions D4 and D5 may be set so as to pass through the center part O of the substrate W in a plan view, or may be set so as to be offset from the center part O of the substrate W. Furthermore, a structure in which the two spray heads 40 are individually swung in the horizontal direction may be applied.

The two spray heads 40 supply the cleaning liquid L from the cleaning liquid supply part 50 . At this time, the cleaning liquid L may be supplied from one cleaning liquid supply part 50 to the two spray heads 40 . For the two spray heads 40 , the cleaning liquid L may be supplied from separate cleaning liquid supply parts 50 . The form of supply is also available. At this time, different types of cleaning liquid L can be sprayed from the two spray heads 40 . In addition, the timing at which the cleaning liquid L is ejected from the two spray heads 40 and the ejection amount of the cleaning liquid L may be the same or different. The spray directions D4 and D5 of the two spray heads 40 and the spray of the cleaning liquid L are controlled by the control unit 60 .

Thus, in the third embodiment, similarly to the above-described first embodiment, the cleaning liquid L turns into water mist m and falls on the upper surface of the substrate W, thereby reducing the hydraulic pressure on the upper surface of the substrate W. In addition, since the cleaning liquid L is sprayed from the two spray heads 40, the cleaning liquid L can be widely supplied to the upper surface of the substrate W. In addition, since the cleaning liquid L is sprayed from the two spray heads 40, a predetermined amount of the cleaning liquid L can be sprayed in a short time, and the substrate W can be cleaned efficiently. Furthermore, in the third embodiment, two spray heads 40 are used, but three or more spray heads 40 may be used.

The embodiments have been described above. However, the technical scope of the present invention is not limited to the above-described embodiments. Those with ordinary knowledge in the technical field to which this invention belongs will clearly understand that various changes or improvements can be made to the aforementioned embodiments. In addition, such modifications or improvements are also included in the technical scope of the present invention. In some cases, one or more of the requirements described in the aforementioned embodiments are omitted. In addition, the requirements described in the aforementioned embodiments can be combined appropriately. In addition, the execution order of each operation shown in the embodiment can be implemented in any order as long as the result of the previous operation is not used in the subsequent operation. In addition, even if the operations of the above-described embodiments are described using "first", "next", "next", etc. for convenience, this order is not necessary for implementation.

10:Workbench 11: Shaft 12: Rotary drive part 20: Containment Department 21:Insert hole 30:Nozzle driving part 30A: Nozzle driving part 31:Pillar 32:Lifting part 33:Rotation part 34:Support Department 35: Shaft 36:Arm 37:Drive Department 40:Spray head 41:Spout 50: Detergent supply department 60:Control Department 100:Substrate cleaning device 200:Substrate cleaning device 300:Substrate cleaning device AX1: central axis AX2: Rotation axis AX3: Rotation axis D: Ejection direction DA: ejection direction DB: ejection direction DC: ejection direction DD: ejection direction D1: Ejection direction D2: Ejection direction D3: Ejection direction D4: Ejection direction D5: Ejection direction P: rotation direction E: Outer edge part L: cleaning fluid m:water mist O: Center W: substrate

[Fig. 1] A side view showing an example of the substrate cleaning device according to the first embodiment. [Fig. 2] A plan view showing an example of the substrate cleaning device according to the first embodiment. [Fig. 3] A side view showing an example in which the spray direction of the spray head is changed to the up-down direction. [Fig. 4] A plan view showing an example in which the spray direction of the spray head is changed to the horizontal direction. [Fig. 5] A plan view showing an example of moving the spray head in the horizontal direction. [Fig. 6] A side view showing an example of moving the spray head in the vertical direction. [Fig. 7] A side view showing an example of swinging the spray direction of the spray head in the up and down direction. [Fig. 8] A plan view showing an example of swinging the spray direction of the spray head in the horizontal direction. [Fig. 9] A flowchart showing an example of the substrate cleaning method according to the embodiment. [Fig. 10] A side view showing a substrate cleaning device according to a modified example. [Fig. 11] A side view showing another example of the substrate cleaning device according to the modification. [Fig. 12] Fig. 12 is a plan view showing an example of the substrate cleaning device according to the second embodiment. [Fig. 13] A side view showing an example of the substrate cleaning device according to the third embodiment.

10:Workbench

11: Shaft

12: Rotary drive part

20: Containment Department

21:Insert hole

30:Nozzle driving part

31:Pillar

32:Lifting part

34:Support Department

35: Shaft

36:Arm

37:Drive Department

40:Spray head

41:Spout

50: Detergent supply department

60:Control Department

100:Substrate cleaning device

AX1: central axis

AX2: Rotation axis

D: Ejection direction

E: Outer edge part

L: cleaning liquid

m:water mist

O: Center

W: substrate

Claims (11)

A substrate cleaning device is a device that supplies cleaning liquid to a rotating substrate to clean the substrate. It is characterized by: A workbench for placing and rotating the substrate; and The spray head is installed in a state where the spray direction of the cleaning liquid is deviated from the substrate; The water mist of the cleaning liquid sprayed from the spray head falls onto the substrate, so that the cleaning liquid is supplied to the substrate on the workbench. The substrate cleaning device as described in claim 1, wherein, The spray head is disposed above the substrate placed on the workbench and further outside the substrate in a plan view. The substrate cleaning device as described in claim 1 or 2, wherein, The above-mentioned spray head has the above-mentioned spray direction pointing downward and is set at an angle of 30˚ to 60˚ with respect to the vertical direction. The substrate cleaning device as described in claim 1 or 2, wherein, The spray head is provided so as to be movable in at least one of a vertical direction and a horizontal direction. The substrate cleaning device as described in claim 1 or 2, wherein, A plurality of the aforementioned spray heads are provided. The substrate cleaning device as described in claim 5, wherein, The plurality of spray heads have mutually different spray directions of the cleaning liquid. The substrate cleaning device as described in claim 1 or 2, wherein, The above-mentioned spray head is provided so as to be able to swing about a vertical axis. The substrate cleaning device as described in claim 7, wherein, The swing range of the spray head is set to a range in which the spray direction of the cleaning liquid overlaps the substrate in a plan view. The substrate cleaning device as described in claim 1 or 2, wherein, The above-mentioned spray head is installed so as to be able to swing about a horizontal axis. The substrate cleaning device as described in claim 1 or 2, which includes: The control unit controls the rotation of the worktable and the spraying of the cleaning liquid from the spray head; The control unit sprays the cleaning liquid from the spray head in response to the rotation of the table. A substrate cleaning method is a method of spraying a cleaning liquid from a spray head while rotating the substrate to clean the substrate, and is characterized by including: A process in which the cleaning liquid is sprayed from the spray head with the spraying direction deviating from the substrate, and the liquid droplets passing through the cleaning liquid fall onto the substrate, thereby supplying the cleaning liquid to the substrate.

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