JP2023156161A - Substrate cleaning apparatus and substrate cleaning method - Google Patents

Abstract

To reduce the damage to a substrate caused by the supply of cleaning solution by lowering the fluid pressure of the cleaning solution supplied to the substrate, and to prevent detachment of electronic components, etc., which have weak adhesion to the substrate.SOLUTION: An apparatus for cleaning a substrate W by supplying cleaning solution L to the rotating substrate W comprises a table 10 on which the substrate W is placed and rotates, and a spray nozzle 40 installed with the spray direction D of the cleaning solution L off the substrate W, and the mist m of the cleaning solution L ejected from the spray nozzle 40 falls onto the substrate W to supply the cleaning solution L to the substrate W on the table 10.SELECTED DRAWING: Figure 1

Description

The present invention relates to a substrate cleaning apparatus and a substrate cleaning method.

When cleaning a substrate such as a semiconductor, a spin-type substrate cleaning method supplies cleaning liquid from a nozzle placed above the substrate toward the top surface of the substrate while rotating the substrate, spreading the cleaning liquid over the top surface of the substrate for cleaning. Devices are known (for example, Patent Documents 1 to 3). In Patent Documents 1 to 3, the nozzle is arranged above the substrate, and the cleaning liquid supplied from the nozzle is supplied toward approximately the center of the upper surface of the substrate. The cleaning liquid supplied to the center of the substrate spreads toward the outer periphery of the substrate as the substrate rotates, cleaning the entire upper surface of the substrate.

Japanese Patent Application Publication No. 2015-201627 JP2019-41116A JP 2021-16007 Publication

Some patterns and electronic components (hereinafter referred to as "electronic components, etc.") formed on a substrate may have weak adhesion to the substrate. When cleaning such a substrate, if a cleaning liquid is supplied from a nozzle toward the substrate, there is a risk that all or part of electronic components and the like with weak adhesion may peel off from the substrate due to the hydraulic pressure of the cleaning liquid. Peeling off of electronic components from the substrate not only affects the quality of the electronic device but also reduces the yield during the manufacture of the electronic device, which is undesirable.

The present invention provides substrate cleaning that reduces the liquid pressure of the cleaning liquid supplied to the substrate, reduces damage to the substrate due to the supply of the cleaning liquid, and prevents peeling of electronic components etc. that have weak adhesion to the substrate. The purpose of the present invention is to provide an apparatus and a substrate cleaning method.

A substrate cleaning apparatus according to an aspect of the present invention is an apparatus that cleans a rotating substrate by supplying a cleaning liquid to the substrate, and includes a table on which a substrate is placed and rotates, and a state in which the cleaning liquid is ejected in a direction away from the substrate. The cleaning liquid is supplied to the substrate on the table by the mist of the cleaning liquid ejected from the spray nozzle falling onto the substrate.

A substrate cleaning method according to an aspect of the present invention is a method of cleaning a substrate by spouting a cleaning liquid from a spray nozzle while rotating the substrate, and by spouting the cleaning liquid from the spray nozzle with the jetting direction away from the substrate. , including supplying a cleaning liquid to the substrate by causing a droplet of the cleaning liquid to fall onto the substrate.

According to the substrate cleaning apparatus and substrate cleaning method of the above aspects, the direction in which the cleaning liquid is jetted from the spray nozzle is set to be away from the substrate, and the cleaning liquid jetted from the spray nozzle is formed into a mist (droplets, mist). The liquid then falls onto the top surface of the substrate and is supplied to the substrate, reducing the liquid pressure of the cleaning liquid against the substrate. As a result, damage to the substrate due to the supply of the cleaning liquid is reduced, and even electronic components and the like that have weak adhesion to the substrate can be prevented from peeling off from the substrate.

FIG. 1 is a side view showing an example of the substrate cleaning apparatus according to the first embodiment. FIG. 1 is a plan view showing an example of a substrate cleaning apparatus according to a first embodiment. It is a side view which shows an example which changes the ejection direction of a spray nozzle to an up-down direction. It is a top view which shows an example which changes the ejection direction of a spray nozzle to a horizontal direction. It is a top view which shows an example which moves a spray nozzle in a horizontal direction. It is a side view showing an example of moving a spray nozzle in the vertical direction. FIG. 3 is a side view showing an example of swinging the ejection direction of the spray nozzle in the vertical direction. FIG. 3 is a plan view showing an example in which the ejection direction of the spray nozzle is oscillated in the horizontal direction. 1 is a flowchart illustrating an example of a substrate cleaning method according to an embodiment. FIG. 7 is a side view showing a substrate cleaning apparatus according to a modified example. FIG. 7 is a side view showing another example of a substrate cleaning apparatus according to a modification. FIG. 7 is a plan view showing an example of a substrate cleaning apparatus according to a second embodiment. FIG. 7 is a side view showing an example of a substrate cleaning apparatus according to a third embodiment.

Hereinafter, embodiments will be described with reference to the drawings, but the present invention is not limited to the content described below. In the drawings, in order to make each structure easier to understand, some parts are emphasized or some parts are simplified, and the actual structure, shape, scale, etc. may differ. In the drawings, directions in the drawings will be explained using an XYZ coordinate system. The XY plane is a horizontal plane. One direction in the XY plane is referred to as the X direction. The direction perpendicular to the X direction on the horizontal plane is referred to as the Y direction. The direction perpendicular to the X direction and the Y direction is referred to as the Z direction. Note that in each of the X direction, Y direction, and Z direction, the direction indicated by the arrow in the figure is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

<First embodiment>
[Substrate cleaning equipment]
A substrate cleaning apparatus 100 according to a first embodiment will be described. FIG. 1 is a side view showing an example of a substrate cleaning apparatus 100 according to the first embodiment. FIG. 2 is a plan view showing an example of the substrate cleaning apparatus 100 according to the first embodiment. The substrate cleaning apparatus 100 removes, for example, deposits (residues) that adhere to the upper surface of the substrate W or a film formed on the substrate W (hereinafter referred to as "deposit etc.") when manufacturing a semiconductor device from the substrate W. used for removal. The substrate W is, for example, a semiconductor substrate on which electronic components or electronic circuits are formed. In this embodiment, the substrate W is circular in plan view, but the substrate W is not limited to being circular, and may be a rectangular (square, rectangular) square substrate. .

The above-mentioned deposits are, for example, a film (layer) formed on the substrate W, such as an adhesive layer. Examples of the substance constituting the adhesive layer include compounds such as hydrocarbon resins, acrylic-styrene resins, maleimide resins, elastomer resins, polysal resins, or combinations thereof. In addition, other deposits include, for example, when the substrate W and the support are laminated with a photoreactive layer interposed therebetween, the photoreaction that adheres to the upper surface of the substrate W after the support is removed from this laminate. It is the residue of the layer. Examples of substances constituting the photoreactive layer include fluorocarbons, polymers containing a repeating unit of a structure that absorbs light (for example, laser light), inorganic substances, compounds that have an infrared absorbing structure, etc. can be mentioned.

As shown in FIGS. 1 and 2, the substrate cleaning apparatus 100 includes a table 10, a storage section 20, a nozzle drive section 30, a spray nozzle 40, a cleaning liquid supply section 50, and a control section 60. The table 10 includes a shaft portion 11. The shaft portion 11 is provided to extend downward (in the -Z direction) from the center of the lower surface of the table 10. The shaft portion 11 is rotatably supported around the central axis AX1 by a bearing (not shown) or the like. The central axis AX1 is parallel to the vertical direction. The table 10 rotates together with the shaft portion 11 around a central axis AX1. The shaft portion 11 is connected to a rotational drive portion 12 . The rotation drive section 12 rotates the table 10 via the shaft section 11. The rotation drive unit 12 rotates the table 10 in the rotation direction P around the central axis AX1 at a predetermined number of rotations. As the rotation drive unit 12, for example, an electric motor or the like is used.

A substrate W is placed on the top surface of the table 10 . The table 10 is, for example, circular in plan view, and the diameter of the top surface is set to be slightly larger than the diameter of the substrate W. That is, when the substrate W is placed on the top surface of the table 10 with the center O of the substrate W aligned with the central axis AX1 of the table 10, the outer edge E of the substrate W is aligned with the outer circumference on the top surface of the table 10. I try to keep it on the inside.

For example, the table 10 is provided with a suction section (not shown) in a range where the substrate W is placed. The suction section is formed, for example, on the top surface of the table 10 by combining a plurality of radial grooves and a plurality of annular grooves, and some of these grooves are connected to a suction pump. After the substrate W is placed on the table 10, the suction pump of the suction section is driven to hold the substrate W on the upper surface of the table 10 by the suction section. Note that the form of the suction part is arbitrary, and any form that can hold the substrate W on the upper surface of the table 10 can be applied.

The accommodating section 20 accommodates the table 10. The housing section 20 is fixed to, for example, a base (not shown) of the substrate cleaning apparatus 100. The accommodating portion 20 is, for example, in the shape of a cup surrounding the table 10. Examples of the material for the accommodating part 20 include metal and resin, but since the cleaning liquid L may adhere to the substrate W when the cleaning liquid L is supplied, a material that is resistant to the components of the cleaning liquid L is preferable. . The accommodating cup is provided with an insertion hole 21 at the bottom through which the shaft 11 is inserted.

The nozzle drive section 30 includes a support column 31, an elevating section 32, a rotating section 33, a support section 34, a shaft section 35, an arm 36, and a drive section 37. The support column 31 is provided to extend in the vertical direction (Z direction), and is fixed to, for example, a base (not shown) of the substrate cleaning apparatus 100. The elevating section 32 is supported by the support column 31 so as to be movable in the vertical direction. The support column 31 is provided with a vertical guide portion (not shown), and the elevating portion 32 is movable in the vertical direction along this guide portion. The rotating section 33 is provided on the upper surface side (+Z surface side) of the elevating section 32. The rotating part 33 is held by the elevating part 32 via a bearing (not shown), and is rotatable about the rotating axis AX2 with respect to the elevating part 32. The rotation axis AX2 is parallel to the vertical direction.

The support portion 34 is provided to extend upward from the upper surface of the rotating portion 33 . The support portion 34 is provided at a position away from the rotation axis AX2 in plan view. The support portion 34 rotates around the rotation axis AX2 integrally with the rotation portion 33 when the rotation portion 33 rotates around the rotation axis AX2. The shaft portion 35 is provided to extend horizontally from the side surface of the support portion 34 . The shaft portion 35 is held by the support portion 34 via a bearing (not shown), and is rotatable with respect to the support portion 34 around the rotation axis AX3. The rotation axis AX3 is parallel to the horizontal direction and orthogonal to the rotation axis AX2. Moreover, when the rotating part 33 rotates around the rotation axis AX2, the shaft part 35 rotates together with the support part 34 around the rotation axis AX2.

The arm 36 is a rod-shaped body and is held by the shaft portion 35. The arm 36 is attached to the shaft portion 35 with a portion thereof inserted into an insertion hole provided in the shaft portion 35 . The length of the arm 36 is arbitrary. Further, the arm 36 may be able to change its attachment position with respect to the shaft portion 35. That is, the distance between the spray nozzle 40 attached to the tip of the arm 36 and the shaft portion 35 may be adjustable. The arm 36 swings in the horizontal direction about the rotation axis AX2 when the rotating part 33 rotates around the rotation axis AX2. Furthermore, when the shaft portion 35 rotates around the rotation axis AX3, the arm 36 swings in the vertical direction about the rotation axis AX3.

The drive unit 37 drives each part of the nozzle drive unit 30. The drive section 37 moves the elevating section 32 up and down with respect to the support column 31. Further, the drive section 37 rotates the rotating section 33 with respect to the elevating section 32. Further, the drive section 37 rotates the shaft section 35 via the support section 34. Note that the drive unit 37 may have a form that includes individual drive sources for driving each part, or may have a form that drives each part by switching the transmission path using one drive source. . As a drive source for the drive unit 37, for example, an electric motor, a cylinder device, or the like is used.

Spray nozzle 40 is attached to the tip of arm 36. The spray nozzle 40 is arranged above the substrate W and outside the substrate W in a plan view. In this embodiment, the spray nozzle 40 is arranged above the upper part of the housing part 20 and outside of the housing part 20. The position of the spray nozzle 40 in plan view can be adjusted by adjusting the length of the arm 36 or the fixed position of the arm 36 with respect to the shaft portion 35. The spray nozzle 40 is connected to the shaft portion 35 via the arm 36. Therefore, the spray nozzle 40 swings in the horizontal direction when the arm 36 swings horizontally around the rotation axis AX2, and in the vertical direction when the arm 36 swings up and down around the rotation axis AX3. to sway.

The spray nozzle 40 includes a spout 41 that spouts the cleaning liquid L. The cleaning liquid L spouted from the spout 41 turns into mist m and spreads out from the spout 41 as it advances. At this time, the spraying direction D of the cleaning liquid L in the spray nozzle 40 is set in a direction away from the upper surface of the substrate W, as shown in FIG. That is, the spray nozzle 40 is arranged so that the ejection direction D of the cleaning liquid L is directed outward from the outer edge E of the substrate W. Furthermore, in plan view, the jetting direction D of the cleaning liquid L is set to pass through the center O of the substrate W, as shown in FIG. The cleaning liquid L ejected from the ejection port 41 in the ejection direction D becomes a mist m (droplets, mist, etc.) and falls onto the substrate W, thereby being supplied to the substrate W. The cleaning liquid L supplied to the substrate W spreads over the upper surface of the substrate W due to centrifugal force as the substrate W rotates around the central axis AX1, thereby cleaning the substrate W. Note that the details of the jetting direction D of the cleaning liquid L will be described later.

The spray nozzle 40 is connected to a cleaning liquid supply section 50. The cleaning liquid L is sent from the cleaning liquid supply section 50 to the spray nozzle 40 via a supply pipe (not shown). Note that as the supply pipe, for example, a flexible tube is used. As the material of the supply pipe, any known material can be used as long as it is resistant to the components of the cleaning liquid L. For example, materials for the supply pipe include metals and resins such as vinyl chloride. The cleaning liquid supply unit 50 includes, for example, a tank that stores the cleaning liquid L, a liquid feeding pump that supplies the cleaning liquid L, and a flow rate adjustment unit. This flow rate adjustment section adjusts the flow rate of the cleaning liquid L sent to the spray nozzle 40 per unit time.

The cleaning liquid L is a liquid necessary for cleaning the deposit layer adhering to the upper surface of the substrate W, and for example, pure water, an organic solvent, or the like is used. For example, if the deposits adhering to the upper surface of the substrate W are adhesive layers provided on the substrate W, an organic solvent or the like is used as the cleaning liquid L. Further, if the deposit adhering to the upper surface of the substrate W is the photoreactive layer described above, cleaning is performed using an organic solvent as the cleaning liquid L, and then cleaning is performed with pure water.

Note that the nozzle drive unit 30 described above is an example, and is not limited to this form. The nozzle drive unit 30 can use any drive system that moves the ejection direction D of the cleaning liquid L by the spray nozzle 40 in the X direction, the Y direction, the Z direction, or a direction that is a combination of these directions. For example, the nozzle drive unit 30 may be a robot arm (multi-joint arm) holding the spray nozzle 40 at its tip.

The control unit 60 centrally controls the substrate cleaning apparatus 100, and uses, for example, a computer. The control unit 60 controls the rotation drive unit 12, the drive unit 37, and the cleaning liquid supply unit 50. The control unit 60 controls the rotation drive unit 12 to rotate and stop the table 10, and also drives the cleaning liquid supply unit 50 when the table 10 is rotated, so that the cleaning liquid L is spouted from the spray nozzle 40. Control. In addition, the control unit 60 can set the direction D in which the cleaning liquid L is ejected from the spray nozzle 40 by controlling the drive unit 37 . The control unit 60 controls the height of the spray nozzle 40, the amount of horizontal swing of the spray nozzle 40 about the rotation axis AX2, and the amount of vertical swing of the spray nozzle 40 about the rotation axis AX3. , the jetting direction D of the cleaning liquid L is set. Note that the jetting direction D may be set in advance in a storage section (not shown) provided in the control section 60, or may be set as appropriate by the operator.

FIG. 3 is a side view showing an example of changing the ejection direction D of the spray nozzle 40 in the vertical direction. The spray nozzle 40 is swingable in the vertical direction by the arm 36 swinging around the rotation axis AX3 in the nozzle drive unit 30. As described above, the ejection direction D of the spray nozzle 40 is set in a direction away from the substrate W. Therefore, as shown in FIG. 3, the ejection direction D of the spray nozzle 40 can be set between the ejection direction DA parallel to the horizontal direction and the ejection direction DB directed toward the outer edge E of the substrate W. In this embodiment, the ejection direction D away from the substrate W is used to include the ejection direction DB toward the outer edge E of the substrate W.

The ejection direction D is set depending on the state of the cleaning liquid L ejected from the ejection port 41 of the spray nozzle 40. That is, when the particle size of the mist m of the cleaning liquid L to be jetted is large, the jetting direction DA or a direction close to the jetting direction DA is set. Even in the ejection direction DA or a direction close to the ejection direction DA, since the mist m falls quickly, the cleaning liquid L can be appropriately supplied to the substrate W. On the other hand, when the particle size of the mist m of the cleaning liquid L to be jetted is small, the jetting direction DB or a direction close to the jetting direction DB is set. Even if the particle size of the mist m of the cleaning liquid L to be jetted is small, the cleaning liquid L can be appropriately supplied to the substrate W by setting the jetting direction DB or a direction close to the jetting direction DB. The particle size of the mist m of the cleaning liquid L can be set appropriately depending on the application by replacing or adjusting the spray nozzle 40. For example, if the particle size is large, it is 300 to 1000 μm, and if it is small, it is 0.01 μm. ~100 μm.

FIG. 4 is a plan view showing an example of changing the ejection direction D of the spray nozzle 40 to the horizontal direction. The spray nozzle 40 can be pivoted in the horizontal direction by the arm 36 pivoting about the rotation axis AX2 in the nozzle drive section 30. In the example shown in FIG. 2, the ejection direction D is set to overlap the center O of the substrate W in plan view, but the ejection direction is not limited to this form. The ejection direction D may be deviated from the center O of the substrate W in plan view. As shown in FIG. 4, the ejection direction D of the spray nozzle 40 is the ejection direction DC, which is one of the tangential directions to the outer edge E of the substrate W in plan view, and the ejection direction DC, which is one of the tangential directions to the outer edge E of the substrate W. It can be set between the other ejection direction DD.

Whether the ejection direction D is set closer to the ejection direction DC than the center O or closer to the ejection direction DD than the center O in plan view may be determined in relation to the rotation direction P of the substrate W. When the ejection direction D is set closer to the ejection direction DC than the center O, the direction of the cleaning liquid L ejected from the ejection port 41 (the flow of the mist m) is opposite to the rotation direction P of the substrate W. In other words, it becomes possible to supply the mist m to the substrate W in a slightly stronger manner. Further, when the ejection direction D is set to the ejection direction DD side from the center O, the direction of the cleaning liquid L ejected from the ejection port 41 (the flow of the mist m) is the same as the rotation direction P of the substrate W. That is, it becomes possible to supply the mist m to the substrate W gently.

FIG. 5 is a plan view showing an example of moving the spray nozzle 40 in the horizontal direction. As shown in FIG. 4, the spray nozzle 40 may be movable in the Y direction while the ejection direction D is directed in the −X direction. The support column 31 of the nozzle drive unit 30 is provided so as to be movable along the rail R. The rail R is provided to extend in the Y direction. The support column 31 is moved in the Y direction along the rail R by the drive unit 37. The spray nozzle 40 moves in the Y direction due to the movement of the support column 31 in the Y direction. Therefore, in plan view, the position in the Y direction of the jetting direction D with respect to the substrate W can be arbitrarily set by the position of the spray nozzle 40 in the Y direction.

FIG. 6 is a side view showing an example of vertically moving the spray nozzle 40 up and down. As described above, the elevating section 32 can be moved up and down by the drive section 37 along a guide section (not shown) provided in the support column 31. As a mechanism for raising and lowering the elevating part 32 by the driving part 37, for example, a ball screw mechanism, a rack and pinion mechanism, etc. using an electric motor as a driving source is used. Further, when the spray nozzle 40 is set downward, the ejection direction D can be removed from the substrate W by raising the elevating part 32 to raise the position of the spray nozzle 40.

In the above-described embodiment, the spray nozzle 40 is fixed in position when the cleaning liquid L is ejected, but the present invention is not limited to this embodiment. For example, the spray nozzle 40 may be moved as the cleaning liquid L is ejected. FIG. 7 is a side view showing an example of swinging the spray nozzle 40 in the ejection direction D in the vertical direction. As described above, the spray nozzle 40 can change the direction of the ejection port 41 in the vertical direction around the rotation axis AX3. The control unit 60 may drive the cleaning liquid supply unit 50 to eject the cleaning liquid L from the spray nozzle 40 while driving the nozzle drive unit 30 to swing the spray nozzle 40 in the vertical direction. As a result, the jetting direction D of the cleaning liquid L is swung in the vertical direction.

The swing range of the ejection direction D in the vertical direction may be set, for example, in the range from the ejection direction DA to the ejection direction DB as shown in FIG. Furthermore, when the ejection direction D is oscillated in the vertical direction, the ejection direction D may be directed toward the substrate W in a part of the oscillation range. Even in this form, since the time for directing the ejection direction D toward the substrate W is short, damage to the substrate W does not become large. Note that instead of swinging the spray nozzle 40 in the vertical direction, as shown in FIG. good. In a part of the vertical range of the spray nozzle 40, the ejection direction D may be directed toward the substrate W, as in the case of vertically swinging the spray nozzle 40.

FIG. 8 is a plan view showing an example of swinging the ejection direction D of the spray nozzle 40 in the horizontal direction. As described above, the spray nozzle 40 can change the direction of the ejection port 41 in the horizontal direction around the rotation axis AX2. The control unit 60 may drive the cleaning liquid supply unit 50 to eject the cleaning liquid L from the spray nozzle 40, and may also drive the nozzle drive unit 30 to swing the spray nozzle 40 in the horizontal direction. As a result, the jetting direction D of the cleaning liquid L is swung in the horizontal direction.

The swing range of the ejection direction D in the horizontal direction may be set, for example, in the range from the ejection direction DC to the ejection direction DD as shown in FIG. Further, the swing range of the ejection direction D may be set to include the range where the ejection direction D deviates from the substrate W in a plan view. Note that instead of swinging the spray nozzle 40 in the horizontal direction, as shown in FIG. good. In a part of the range of reciprocating movement of the spray nozzle 40, the ejection direction D may deviate from the substrate W in plan view, as in the case where the spray nozzle 40 is oscillated in the horizontal direction.

[Substrate cleaning method]
A substrate cleaning method according to an embodiment will be described. FIG. 9 is a flowchart illustrating an example of the substrate cleaning method according to the embodiment. This substrate cleaning method is executed by the substrate cleaning apparatus 100 described above. As shown in FIG. 9, first, a substrate W is placed on the table 10 (step S01). In step S01, the substrate W is placed on the table 10 by, for example, a transport device. This transport device includes, for example, a suction pad that suctions the upper surface of the substrate W, and transports the substrate W while being suctioned by the suction pad, and places the substrate W on the table 10 . Thereafter, the substrate W is placed on the table 10 by releasing the suction by the suction pad and retreating from the substrate cleaning apparatus 100.

Further, after the substrate W is placed on the table 10, the control section 60 drives a suction section (not shown) to suction and hold the substrate W on the table 10. Note that after the substrate W is placed on the table 10 and prior to adsorption of the substrate W, the substrate W may be aligned so that the center O of the substrate W and the center axis AX1 are aligned. When performing such alignment of the substrate W, the suction unit sucks the substrate W after the alignment of the substrate W.

Next, the control unit 60 rotates the table 10 (step S02). In step S02, the control section 60 drives the rotation drive section 12 to rotate the table 10 via the shaft section 11. The control unit 60 can change the rotation speed of the table 10 as appropriate depending on the type of deposits etc. to be removed from the substrate W. The value of the rotation speed of the table 10 may be set in advance in a storage unit (not shown) included in the control unit 60, or may be set as appropriate by the operator.

Next, the control unit 60 drives the nozzle drive unit 30 to set the ejection direction D of the spray nozzle 40 away from the substrate W (step S03). In step S03, the control unit 60 has previously acquired information regarding the diameter of the substrate W to be cleaned. The control unit 60 controls the nozzle drive unit 30 based on the information regarding the diameter of the substrate W so that the direction of the ejection port 41 of the spray nozzle 40 (the ejection direction D) is deviated from the substrate W. The control unit 60 drives the drive unit 37 of the nozzle drive unit 30 to control the height of the spray nozzle 40, the position in the Y direction, the orientation of the spout 41 in the vertical direction, the orientation of the spout 41 in the horizontal direction, etc. Set.

At this time, when the spray nozzle 40 is to be vertically swung as shown in the above-described embodiment, the control unit 60 sets the oscillating range in the vertical direction and the oscillating range in the horizontal direction of the spray nozzle 40. . The direction, swing range, etc. of the spray nozzle 40 are stored in advance in a storage unit (not shown) or the like in association with the diameter of the substrate W, deposits to be removed, etc. The control unit 60 sets the direction, swing range, etc. of the spray nozzle 40 based on the set values stored in the storage unit. However, the direction, swing range, etc. of the spray nozzle 40 are not limited to being set to preset values, and may be set manually by the operator.

Next, the control unit 60 jets out the cleaning liquid L (step S04). In step S04, the control unit 60 drives the cleaning liquid supply unit 50 to spray the cleaning liquid L from the spray nozzle 40. The amount or ejection time of the cleaning liquid L to be ejected from the spray nozzle 40 is stored in advance in a storage unit (not shown) or the like. The control unit 60 causes the cleaning liquid L to be ejected from the spray nozzle 40 based on a predetermined amount or a predetermined time that is stored in advance in a storage unit or the like. The amount or ejection time of the cleaning liquid L ejected from the spray nozzle 40 may be set corresponding to the rotation speed of the table 10. However, the amount or ejection time of the cleaning liquid L ejected from the spray nozzle 40 is not limited to being set to a preset value, and may be set manually by the operator.

In step S03 described above, the ejection direction D is set in a direction away from the substrate W, so the cleaning liquid L ejected in step S04 falls on the upper surface of the substrate W as a mist m. As a result, the cleaning liquid L is supplied to the upper surface of the substrate W at a low hydraulic pressure, so that damage to electronic components and the like of the substrate W can be reduced. The cleaning liquid L supplied to the upper surface of the substrate W is spread over the entire surface of the substrate W by centrifugal force as the substrate W rotates around the central axis AX1, and removes deposits and the like on the upper surface of the substrate W.

Next, the control unit 60 stops spouting the cleaning liquid L (step S05). In step S05, after spouting a predetermined amount of the cleaning liquid L or after a predetermined period of time has elapsed since the cleaning liquid L has elapsed, the control unit 60 stops driving the cleaning liquid supply unit 50, and stops the cleaning liquid L from being spouted from the spray nozzle 40. make it stop. For example, the control unit 60 acquires the passage of a predetermined time using a timer (not shown) or the like, and stops driving the cleaning liquid supply unit 50 to stop supplying the cleaning liquid L to the spray nozzle 40 . Note that the control unit 60 may acquire information regarding the flow rate at which the cleaning liquid L is sent from a flow rate adjustment unit provided in the cleaning liquid supply unit 50, and may stop driving the cleaning liquid supply unit 50 at the timing when a predetermined flow rate is sent. .

Next, the control unit 60 stops the rotation of the table 10 (step S06). In step S06, the control unit 60 controls the rotation drive unit 12 to stop the rotation of the table 10. Next, the control unit 60 carries out the substrate W from the table 10 (step S07). In step S07, the control unit 60 retracts the spray nozzle 40 from above the substrate W. Subsequently, the control unit 60 releases the suction of the substrate W by the suction unit of the table 10 . As a result, the substrate W becomes ready to be carried out from the table 10. The substrate W on the table 10 is carried out from the table 10 by, for example, the above-mentioned transport device.

By performing the series of steps described above, cleaning of the substrate W is completed. Note that the rotation of the table 10 in step S02 and the setting of the orientation of the spray nozzle 40 in step S03 may be performed at the same time, or step S03 may be performed before step S02. Further, a step of drying the substrate W may be performed prior to carrying out the substrate W in step S07. This drying step may be performed by maintaining the substrate W on the table 10 with or without heating for a predetermined period of time.

As described above, according to the first embodiment, since the jetting direction D of the cleaning liquid L is set in a direction away from the substrate W, the cleaning liquid L falls as a mist m on the upper surface of the substrate W, thereby causing the cleaning liquid L to The hydraulic pressure against the top surface is small. Therefore, strong pressure is not applied to the electronic components and the like on the substrate W, and separation of the electronic components and the like from the substrate W can be suppressed.

In the above-described embodiment, the spray nozzle 40 is disposed above the substrate W, but the present invention is not limited to this embodiment. The spray nozzle 40 may be arranged above the substrate W. FIG. 10 is a side view showing a substrate cleaning apparatus 100 according to a modification. As shown in FIG. 10, the spray nozzle 40 is arranged above the substrate W, and the ejection direction D is set at an angle V1 with respect to the vertical direction. In the embodiment shown in FIG. 10, the angle V1 is approximately 30°. Even in this case, the jetting direction D of the cleaning liquid L is set so as to be directed outward from the outer edge E of the substrate W. Further, even in the form shown in FIG. 10, the cleaning liquid L becomes mist m and falls on the upper surface of the substrate W, similarly to the above-described embodiment. In addition, in the form shown in FIG. 10, the point that the spray nozzle 40 may be swung in the vertical direction or the horizontal direction is similar to the above-described embodiment.

FIG. 11 is a side view showing another example of the substrate cleaning apparatus 100 according to the modification. As shown in FIG. 11, the spray nozzle 40 is arranged above the substrate W, and the ejection direction D is set at an angle V2 with respect to the vertical direction. In the embodiment shown in FIG. 11, angle V1 is approximately 60°. Even in this case, the jetting direction D of the cleaning liquid L is set so as to be directed outward from the outer edge E of the substrate W. Further, even in the form shown in FIG. 11, the cleaning liquid L becomes mist m and falls on the upper surface of the substrate W, similarly to the above-described embodiment. In addition, in the form shown in FIG. 11, the point that the spray nozzle 40 may be swung in the vertical direction or the horizontal direction is similar to the above-described embodiment.

As shown in FIGS. 10 and 11, even when the spray nozzle 40 is placed above the substrate W, the ejection direction D is set downward and at an angle of 30° to 60° with respect to the vertical direction. This makes it possible to deviate the jetting direction D of the cleaning liquid L from the outer edge E of the substrate W to the outside. In this way, since the spray nozzle 40 can be arranged above the substrate W, it is possible to expand the variations in the arrangement of the spray nozzle 40. Note that, as described above, the cleaning liquid L spreads and is ejected from the ejection port 41 of the spray nozzle 40. Therefore, even in the embodiments shown in FIGS. 10 and 11, the cleaning liquid L is also supplied to the center O of the substrate W and the vicinity thereof.

<Second embodiment>
A substrate cleaning apparatus 200 according to a second embodiment will be described. In the first embodiment described above, a mode using one spray nozzle 40 has been described as an example, but the present invention is not limited to this mode. A configuration may be adopted in which a plurality of spray nozzles 40 are used. FIG. 12 is a plan view showing an example of a substrate cleaning apparatus 200 according to the second embodiment. Note that in FIG. 12, the same components as in the first embodiment are given the same reference numerals, and the description thereof will be omitted or simplified.

As shown in FIG. 12, in the substrate cleaning apparatus 200, three spray nozzles 40 are arranged around the accommodating part 20 (substrate W) in plan view. The three spray nozzles 40 are arranged at equal intervals (120° intervals) around the accommodating part 20. Note that the three spray nozzles 40 are not limited to being arranged at equal intervals around the accommodating portion 20, but may be arranged at different intervals. Moreover, the same type may be used for the three spray nozzles 40, or different types may be used. The ejection direction D of the cleaning liquid L is set for each of the three spray nozzles 40 by the nozzle drive section 30. The three spray nozzles 40 are set to spray directions D1, D2, and D3 as spray directions D of the cleaning liquid L, respectively.

The ejection directions D1, D2, and D3 are each set toward the outside of the outer edge E of the substrate W. However, in the ejection directions D1, D2, and D3, the lengths (angles with respect to the vertical direction) that are deviated from the substrate W may be the same or different for the three spray nozzles 40. Further, the ejection directions D1, D2, and D3 are set to pass through the center O of the substrate W, respectively, in a plan view. However, at least one of the ejection directions D1, D2, and D3 may be set to deviate from the center O of the substrate W.

The cleaning liquid L is sent to the three spray nozzles 40 from the cleaning liquid supply section 50. In this case, the cleaning liquid L may be sent from one cleaning liquid supply unit 50 to the three spray nozzles 40, or the cleaning liquid L may be sent to the three spray nozzles 40 from individual cleaning liquid supply units 50. It may be. In this case, it becomes possible to spray different types of cleaning liquid L from the three spray nozzles 40. Further, the timing of ejecting the cleaning liquid L from the three spray nozzles 40 and the amount of the cleaning liquid L ejected may be the same or different. The ejection directions D1, D2, D3 and the ejection of the cleaning liquid L from the three spray nozzles 40 are controlled by the control unit 60.

In this way, in the second embodiment as well, as in the first embodiment described above, the cleaning liquid L falls on the upper surface of the substrate W as a mist m, so that the liquid pressure on the upper surface of the substrate W can be reduced. can. Further, since the cleaning liquid L is jetted from the three spray nozzles 40, the cleaning liquid L can be widely supplied to the upper surface of the substrate W. Further, since the cleaning liquid L is spouted from the three spray nozzles 40, a predetermined amount of the cleaning liquid L can be spouted in a short time, and the substrate W can be cleaned efficiently. Note that in the second embodiment, three spray nozzles 40 are used, but two or four or more spray nozzles 40 may be used.

<Third embodiment>
A substrate cleaning apparatus 300 according to a third embodiment will be described. In the above-described second embodiment, a configuration in which a plurality of spray nozzles 40 are arranged around the housing portion 20 (substrate W) is described as an example, but the configuration is not limited to this configuration. A configuration may also be adopted in which a plurality of spray nozzles 40 are arranged in the vertical direction. FIG. 13 is a plan view showing an example of a substrate cleaning apparatus 300 according to the third embodiment. Note that in FIG. 13, the same components as in the first embodiment are given the same reference numerals, and the description thereof will be omitted or simplified.

As shown in FIG. 13, the substrate cleaning apparatus 300 has two spray nozzles 40 arranged one above the other. The two spray nozzles 40 are supported by a nozzle drive unit 30A. The nozzle drive section 30A includes a support section 34A extending upward from the rotating section 33 (see FIG. 2). The support portion 34A is longer in the vertical direction than the support portion 34 of the first embodiment. The support portion 34A is provided with two shaft portions 35 at the top and bottom, and the spray nozzle 40 is supported via each shaft portion 35. The two spray nozzles 40 may be of the same type or different types.

For the two spray nozzles 40, the ejection direction D of the cleaning liquid L is set by the nozzle drive unit 30A. The two spray nozzles 40 are set to spray directions D4 and D5, respectively, as the spray directions D of the cleaning liquid L. The ejection directions D4 and D5 are each set toward the outside of the outer edge E of the substrate W. However, in the ejection directions D4 and D5, the length of the distance from the substrate W (angle with respect to the vertical direction) may be the same or different between the two spray nozzles 40. For example, the ejection direction D5 may be set downward than the ejection direction D4. That is, the angle of the ejection direction D5 with respect to the vertical direction may be smaller than the angle of the ejection direction D4 with respect to the vertical direction.

Moreover, the ejection directions D4 and D5 in plan view become the same because one support portion 34A is used as described above. For example, the ejection directions D4 and D5 may be set to pass through the center O of the substrate W in plan view, or may be set so as to deviate from the center O of the substrate W. Note that a configuration in which the two spray nozzles 40 are individually oscillated in the horizontal direction may be applied.

The cleaning liquid L is sent to the two spray nozzles 40 from the cleaning liquid supply section 50. In this case, the cleaning liquid L may be sent to two spray nozzles 40 from one cleaning liquid supply section 50, or the cleaning liquid L may be sent to two spray nozzles 40 from separate cleaning liquid supply sections 50. It may be. In this case, it becomes possible to spray different types of cleaning liquid L from the two spray nozzles 40. Furthermore, the timing of ejecting the cleaning liquid L from the two spray nozzles 40 and the amount of the cleaning liquid L ejected may be the same or different. The ejection directions D4 and D5 from the two spray nozzles 40 and the ejection of the cleaning liquid L are controlled by the control unit 60.

In this way, in the third embodiment as well, as in the first embodiment described above, the cleaning liquid L falls on the upper surface of the substrate W as a mist m, so that the liquid pressure on the upper surface of the substrate W can be reduced. can. Further, since the cleaning liquid L is jetted from the two spray nozzles 40, the cleaning liquid L can be widely supplied to the upper surface of the substrate W. Further, since the cleaning liquid L is jetted from the two spray nozzles 40, a predetermined amount of the cleaning liquid L can be spouted in a short time, and the substrate W can be cleaned efficiently. Note that in the third embodiment, two spray nozzles 40 are used, but three or more spray nozzles 40 may be used.

Although the embodiments have been described above, the technical scope of the present invention is not limited to the embodiments described above. It will be apparent to those skilled in the art that various changes or improvements can be made to the embodiments described above. Furthermore, forms with such changes or improvements are also included within the technical scope of the present invention. One or more of the requirements described in the embodiments above may be omitted. Further, the requirements described in the above embodiments can be combined as appropriate. Furthermore, the operations shown in the embodiments can be executed in any order as long as the result of the previous operation is not used in the subsequent operation. Further, even if the operations in the above-described embodiments are described using "first", "next", "successively", etc. for convenience, it is not essential that they be performed in this order.

10...Table 20...Accommodating section 30, 30A...Nozzle drive section 35...Arm 36...Swinging/elevating drive section 40...Spray nozzle 41...Ejection port 50... -Cleaning liquid supply unit 60...Control unit 100, 200, 300...Substrate cleaning device AX1...Central axis AX2...Rotation axis AX3...Rotation axis D, DA, DB, DC, DD, D1 , D2, D3, D4, D5...Graying direction E...Outer edge L...Cleaning liquid m...Mist O...Center W...Substrate

Claims (11)

A device that cleans a rotating substrate by supplying a cleaning liquid to the substrate,
A table on which the substrate is placed and rotates,
a spray nozzle installed with the cleaning liquid ejected in a direction away from the substrate;
A substrate cleaning apparatus, wherein a mist of the cleaning liquid ejected from the spray nozzle falls on the substrate, thereby supplying the cleaning liquid to the substrate on the table. The substrate cleaning apparatus according to claim 1, wherein the spray nozzle is arranged above the substrate placed on the table and outside the substrate in plan view. 3. The substrate cleaning apparatus according to claim 1, wherein the spray nozzle is set such that the ejection direction is downward and at an angle of 30° to 60° with respect to the vertical direction. The substrate cleaning apparatus according to claim 1 or 2, wherein the spray nozzle is provided so as to be movable in at least one of a vertical direction and a horizontal direction. The substrate cleaning apparatus according to claim 1 or 2, wherein a plurality of said spray nozzles are installed. 6. The substrate cleaning apparatus according to claim 5, wherein the plurality of spray nozzles eject the cleaning liquid in different directions. The substrate cleaning apparatus according to claim 1 or 2, wherein the spray nozzle is provided so as to be swingable around a vertical axis. 8. The substrate cleaning apparatus according to claim 7, wherein the swing range of the spray nozzle is set to a range in which the jetting direction of the cleaning liquid overlaps the substrate in plan view. 3. The substrate cleaning apparatus according to claim 1, wherein the spray nozzle is provided so as to be swingable around a horizontal axis. comprising a control unit that controls rotation of the table and ejection of the cleaning liquid from the spray nozzle,
The substrate cleaning apparatus according to claim 1 or 2, wherein the control unit jets the cleaning liquid from the spray nozzle in response to rotation of the table. A method of cleaning a substrate by spouting a cleaning liquid from a spray nozzle while rotating the substrate, the method comprising:
A method for cleaning a substrate, the method comprising: spouting the cleaning liquid from the spray nozzle in a direction away from the substrate so that droplets of the cleaning liquid fall onto the substrate, thereby supplying the cleaning liquid to the substrate.

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