JP7112884B2 - LIQUID TREATMENT APPARATUS, LIQUID TREATMENT METHOD, AND COMPUTER-READABLE RECORDING MEDIUM - Google Patents

Description

The present disclosure relates to a liquid processing apparatus, a liquid processing method, and a computer-readable recording medium.

Japanese Patent Application Laid-Open No. 2002-200000 describes a substrate holding part configured to hold a substrate in a cup body, a nozzle configured to supply a processing liquid to the substrate, and a processing liquid dripping from the nozzle outside the cup body. and a liquid collector configured to remove droplets of the liquid. According to the apparatus disclosed in Patent Document 1, the liquid collecting portion wipes the lower end surface of the nozzle while being in contact with the lower end surface of the nozzle, thereby preventing the processing liquid from unexpectedly dropping from the nozzle.

JP 2010-186974 A

The present disclosure describes a liquid processing apparatus, a liquid processing method, and a computer-readable recording medium capable of suppressing adhesion of the processing liquid to the lower end surface of the nozzle.

A liquid processing apparatus according to one aspect of the present disclosure includes a processing liquid supply unit configured to supply a processing liquid from a nozzle positioned on the surface side of a substrate to the surface, and a flow of the processing liquid discharged from the nozzle. A guide member configured to guide and a controller. The nozzle includes a flat lower end surface provided with an ejection port through which the processing liquid is ejected. The control unit controls the processing liquid supply unit so that the processing liquid is actually discharged from the ejection port to the surface with the lower end face close to the surface, and the ejection is performed while the guide member is in the vicinity of the ejection port. and controlling the processing liquid supply unit so as to dummy-discharge the processing liquid from the outlet toward the guide member.

According to the liquid processing apparatus, the liquid processing method, and the computer-readable recording medium according to the present disclosure, it is possible to suppress adhesion of the processing liquid to the lower end surface of the nozzle.

FIG. 1 is a schematic configuration diagram showing an example of a liquid processing apparatus. FIG. 2 is a schematic cross section mainly showing the liquid receiver and the guide member in FIG. FIG. 3 is a block diagram showing the functional configuration of the controller. FIG. 4 is a block diagram showing the hardware configuration of the controller. FIG. 5 is a flow chart showing an example of a liquid processing procedure. FIG. 6 is a diagram for explaining an example of the liquid processing procedure. FIG. 7(a) is a schematic cross section showing another example of the guide member, and FIG. 7(b) is a top view of the guide member in FIG. 7(a). FIG. 8 is a diagram for explaining another example of the liquid processing method. FIG. 9 is a diagram for explaining another example of the liquid processing method. FIG. 10 is a surface showing another example of the guide member. FIG. 11 is a surface showing another example of the guide member. FIG. 12 is a surface showing another example of the guide member. FIG. 13 is a surface showing another example of the guide member. FIG. 14 is a diagram showing another example of nozzles. FIG. 15 is a diagram for explaining another example of the liquid processing method.

An example of an embodiment according to the present disclosure will be described below in more detail with reference to the drawings. In the following description, the same reference numerals will be used for the same elements or elements having the same functions, and redundant description will be omitted.

[Liquid processing equipment]
The configuration of the liquid processing apparatus 1 will be described with reference to FIGS. 1 and 2. FIG. The liquid processing apparatus 1, as shown in FIG. 1, is configured to supply a processing liquid L1 to a surface Wa of a wafer W (substrate). The treatment liquid L1 may be any of various liquids that can be applied to the surface Wa of the wafer W, such as a photosensitive resist liquid that forms a photosensitive resist film, a non-photosensitive resist liquid that forms a non-photosensitive resist film, and the like. There may be.

The wafer W may have a disk shape, or may have a plate shape such as a polygonal shape other than a circular shape. The wafer W may have a cutout portion that is partially cut out. The notch may be, for example, a notch (a U-shaped, V-shaped groove, etc.) or a linear portion extending linearly (so-called orientation flat). The wafer W may be, for example, a semiconductor substrate, a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or other various substrates. The diameter of the wafer W may be, for example, approximately 200 mm to 450 mm.

The liquid processing apparatus 1 includes a rotary holding unit 10, a cup 20, a processing liquid supply unit 30, a liquid receiving unit 40, a solvent supply unit 50, a gas supply unit 60, and a controller Ctr (control unit). .

The rotation holding portion 10 has a rotating portion 11 , a shaft 12 and a holding portion 13 . The rotating part 11 operates based on an operation signal from the controller Ctr to rotate the shaft 12 . The rotating part 11 is, for example, a power source such as an electric motor. The holding portion 13 is provided at the tip of the shaft 12 . A wafer W can be placed on the holding portion 13 . The holding unit 13 is a suction chuck configured to hold the wafer W substantially horizontally by suction or the like, for example.

That is, the rotation holding unit 10 has a function of rotating the wafer W around an axis (rotation axis) perpendicular to the front surface Wa of the wafer W, with the attitude of the wafer W being substantially horizontal. In this embodiment, the rotation axis passes through the center of the circular wafer W, so it is also the central axis.

The cup 20 is provided around the rotation holding portion 10 . The cup 20 functions as a liquid collecting container that receives liquid supplied to the wafer W for processing the wafer W. As shown in FIG. The cup 20 may be made of, for example, polypropylene (PP), polyvinyl chloride (PVC), polyphenylene sulfide (PPS) resin, or the like.

The processing liquid supply unit 30 is configured to supply the processing liquid L1 to the surface Wa of the wafer W. As shown in FIG. The processing liquid supply unit 30 has a liquid source 31, a pump 32, a valve 33, a nozzle N, a pipe 34, and a driving mechanism 35 (driving unit).

The liquid source 31 functions as a supply source of the treatment liquid L1. The pump 32 operates based on an operation signal from the controller Ctr, sucks the processing liquid L1 from the liquid source 31, and sends the processing liquid L1 to the nozzle N through the pipe 34 and the valve 33. FIG. The valve 33 operates based on an operation signal from the controller Ctr to open and close the pipe 34 before and after the valve 33 .

A pipe 34 connects the liquid source 31, the pump 32, the valve 33, and the nozzle N in order from the upstream side. The drive mechanism 35 operates based on an operation signal from the controller Ctr to move the nozzle N horizontally or vertically. The drive mechanism 35 is, for example, a servomotor with an encoder, and may control the moving speed and moving position of the nozzle N.

The nozzle N is movable between the upper side of the wafer W (above the cup 20) and the liquid receiver 40 by the driving mechanism 35 so that the ejection port Na (see FIG. 2) faces the surface Wa of the wafer W. As shown in FIG. The nozzle N has a function of discharging the processing liquid L1 sent from the pump 32 downward from the discharge port Na. The discharge port Na is provided on the flat lower end surface S of the nozzle N. As shown in FIG.

The liquid receiver 40 functions as a liquid collecting container that receives the processing liquid L1 and the solvent L2 during dummy ejection. The liquid receiver 40 includes a housing 41, a nozzle 42, a drain pipe 43, and a guide member 70, as shown in FIGS. The housing 41 is a bottomed cylinder with an open top. The housing 41 is arranged at a position (outside the cup 20) that does not overlap the cup 20 in the vertical direction. The nozzle 42 is provided on the side wall surface of the housing and configured to discharge the solvent L2 into the housing 41 . The drain pipe 43 is configured to drain the processing liquid L1 and the solvent L2 discharged into the housing 41 .

The guide member 70 is a rod-shaped body extending along the vertical direction. The guiding member 70 may be, for example, a cylinder or a polygonal cylinder. The guide member 70 is fixed inside the housing 41 .

The solvent supply unit 50 is configured to supply the solvent L2 into the housing 41 . Solvent L2 may be various organic solvents (for example, thinner). The solvent supply unit 50 has a liquid source 51 , a pump 52 , a valve 53 and a pipe 54 .

The liquid source 51 functions as a supply source of the solvent L2. The pump 52 operates based on an operation signal from the controller Ctr, sucks the solvent L2 from the liquid source 51, and delivers the solvent L2 to the nozzle 42 via the pipe 54 and the valve 53. The valve 53 operates based on an operation signal from the controller Ctr to open and close the pipe 54 before and after the valve 53 . The pipe 54 connects the liquid source 51, the pump 52, the valve 53 and the nozzle 42 in order from the upstream side.

The gas supply unit 60 is configured to supply gas toward the lower end of the nozzle N. As shown in FIG. The gas G may be various inert gases, such as nitrogen gas ( _N2 gas). The gas supply unit 60 has a gas source 61 , a pump 62 , a valve 63 , a pipe 64 and a nozzle 65 .

The gas source 61 functions as a gas G supply source. The pump 62 operates based on an operation signal from the controller Ctr, sucks the gas G from the gas source 61 , and sends the gas G to the nozzle 65 through the pipe 64 and the valve 63 . The valve 63 operates based on an operation signal from the controller Ctr to open and close the pipe 64 before and after the valve 63 .

A pipe 64 connects the gas source 61, the pump 62, the valve 63 and the nozzle 65 in order from the upstream side. The nozzle 65 is fixed in the housing 41 so that the discharge port at the tip faces obliquely downward. The nozzle 65 has a function of discharging the gas G sent from the pump 62 obliquely downward from the discharge port.

As shown in FIG. 3, the controller Ctr has, as functional modules, a reading unit M1, a storage unit M2, a processing liquid supply control unit M3, a solvent supply control unit M4, and a gas supply control unit M5. These functional modules are simply the functions of the controller Ctr divided into a plurality of modules for convenience, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being realized by executing a program, but is realized by a dedicated electric circuit (for example, a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates this. may

The reading unit M1 has a function of reading a program from a computer-readable recording medium RM. The recording medium RM records a program for operating each part of the liquid processing apparatus 1 . The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk.

The storage unit M2 has a function of storing various data. The storage unit M2 stores, for example, programs read from the recording medium RM by the reading unit M1, various data (so-called processing recipes) for processing the wafer W, and input from an operator via an external input device (not shown). Stores setting data, etc.

The processing liquid supply controller M3 has a function of controlling the processing liquid supply section 30 to discharge the processing liquid L1 from the nozzle N onto the surface Wa of the wafer W. FIG. The ejection operation of the treatment liquid L1 at this time is also called "main ejection". The processing liquid supply controller M3 has a function of controlling the processing liquid supply section 30 to discharge the processing liquid L1 from the nozzle N into the housing 41 . The ejection operation of the treatment liquid L1 at this time is also called "dummy ejection". The processing liquid supply controller M3 has a function of controlling the processing liquid supply section 30 so that the nozzle N is moved between the upper side of the wafer W and the liquid receiving section 40 by the drive mechanism 35 .

The solvent supply control unit M4 has a function of controlling the solvent supply unit 50 so as to discharge the solvent L2 from the nozzle 42 into the housing 41 . The gas supply control unit M5 has a function of controlling the gas supply unit 60 to discharge the gas G from the nozzle 65 into the housing 41 .

The hardware of the controller Ctr is composed of, for example, one or more control computers. The controller Ctr has, for example, a circuit Ctr1 shown in FIG. 4 as a hardware configuration. The circuit Ctr1 may be composed of electrical circuitry. The circuit Ctr1 specifically has a processor Ctr2, a memory Ctr3 (storage section), a storage Ctr4 (storage section), and an input/output port Ctr5. The processor Ctr2 cooperates with at least one of the memory Ctr3 and the storage Ctr4 to execute a program and input/output signals via the input/output port Ctr5, thereby configuring each functional module described above.

Although the liquid processing apparatus 1 includes one controller Ctr in this embodiment, it may include a controller group (control unit) composed of a plurality of controllers Ctr. When the liquid processing apparatus 1 includes a controller group, each of the above functional modules may be realized by one controller Ctr, or may be realized by a combination of two or more controllers Ctr. . When the controller Ctr is composed of a plurality of computers (circuit Ctr1), each of the above functional modules may be realized by one computer (circuit Ctr1), or may be realized by two or more computers (circuit Ctr1 ) may be realized by a combination of The controller Ctr may have multiple processors Ctr2. In this case, each of the above functional modules may be implemented by one processor Ctr2, or may be implemented by a combination of two or more processors Ctr2.

[Liquid treatment method]
Next, a liquid processing method using the liquid processing apparatus 1 will be described with reference to FIGS. 5 and 6. FIG.

First, the controller Ctr controls the processing liquid supply unit 30 so that the processing liquid L1 is actually discharged from the nozzle N toward the surface Wa of the wafer W (see step S1 in FIG. 5). As a result, the surface Wa of the wafer W is supplied with the processing liquid supply unit 30 . (See FIG. 6(a)).

At this time, the treatment liquid L1 may adhere to the lower end surface S of the nozzle N. As shown in FIG. In particular, when the processing liquid L1 is discharged onto the surface Wa of the wafer W while the lower end surface S of the nozzle N is in proximity to the surface Wa of the wafer W, the processing liquid L1 tends to adhere to the lower end surface S (see FIG. 6A). ). In addition, "proximity" means the state in which the lower end surface S is not in contact with the surface Wa and is slightly separated from the surface Wa. The gap between the lower end surface S and the surface Wa may be, for example, approximately 0.1 mm to 2.0 mm, or may be approximately 1.0 mm.

When the supply of the processing liquid L1 to the surface Wa of the wafer W is completed, the controller Ctr controls the processing liquid supply section 30 so as to move the nozzle N after the main discharge to the liquid receiving section 40 (step S2). As a result, the nozzle N after the main ejection is arranged inside the housing 41 .

Subsequently, the controller Ctr controls the solvent supply section 50 so as to supply the solvent L2 to the lower end of the nozzle N (see step S3 in FIG. 5). As a result, the processing liquid L1 adhering to the lower end surface S (especially around the ejection port Na) is removed by the solvent L2 (see FIG. 6B). The processing liquid L1 removed from the lower end surface S and the solvent L2 supplied to the nozzle N are received by the housing 41 and discharged to the outside of the housing 41 through the drain pipe 43 . On the other hand, the solvent L2 supplied to the lower end of the nozzle N may slightly enter the interior of the nozzle N from the discharge port Na, or may remain on the lower end surface S (see the same).

Subsequently, the controller Ctr controls the gas supply section 60 to supply the gas G to the lower end of the nozzle N (see step S4 in FIG. 5). As a result, the solvent L2 adhering to the lower end surface S is blown off by the gas G, and the solvent L2 is removed from the lower end surface S (FIG. 6(c)). However, the solvent L2 that has entered the interior of the nozzle N may still remain (see the same reference).

Subsequently, the controller Ctr controls the processing liquid supply unit 30 so that the processing liquid L1 is dummy-discharged from the nozzle N toward the guidance member 70 while the guidance member 70 is positioned directly below the discharge port Na ( (see step S5 in FIG. 5). As a result, the solvent L2 remaining inside the nozzle N is discharged from the nozzle N together with the treatment liquid L1. At this time, the treatment liquid L1 comes into contact with the guide member 70 immediately after being ejected from the ejection port Na, spreads over the surface of the guide member 70 due to the surface tension of the guide member 70, and flows down along the surface (FIG. 6). (d)). That is, the treatment liquid L1 ejected from the ejection port Na is not guided to the lower end surface S but to the guide member 70 side.

When stopping the dummy ejection, the controller Ctr may control the processing liquid supply section 30 to suck the processing liquid L1 in the nozzle N (also called "suck back"). This suppresses the retention of the processing liquid L1 near the ejection port Na of the nozzle N (see FIG. 6E).

Preparations for ejecting the treatment liquid L1 from the nozzle N onto the next wafer W are thus completed. After that, the controller Ctr controls the processing liquid supply unit 30 so as to move the nozzle N after the dummy discharge to above the wafer W held by the rotation holding unit 10 in the cup 20, and also controls the processing liquid supply unit 30 after step S1. can be run again.

[Action]
In the above embodiment, the treatment liquid L1 is dummy-discharged toward the guide member 70 from the discharge port Na while the guide member 70 is in the vicinity of the discharge port Na. Therefore, the treatment liquid L1 ejected from the ejection port Na flows along the surface of the guide member 70 and is less likely to spread around. Therefore, it becomes difficult for the processing liquid to adhere to the lower end surface S of the nozzle N after the dummy ejection. As a result, it is possible to prevent the processing liquid L1 from adhering to the lower end surface S of the nozzle N only by performing the dummy ejection without requiring the trouble of removing the processing liquid L1 from the lower end surface S of the nozzle N after the dummy ejection. becomes.

In the above embodiment, the treatment liquid L1 is dummy-discharged toward the guide member 70 from the discharge port Na in a state where the guide member 70 is directly below the discharge port Na. Therefore, the treatment liquid L1 flows more easily along the surface of the guide member 70 .

[Modification]
It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The embodiments described above may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

(1) As shown in FIG. 7 , the liquid receiver 40 may further include a drive mechanism 80 (drive section) configured to drive the guide member 70 . The drive mechanism 80 includes a support arm 81 that supports the guide member 70 between itself and the inner wall surface of the housing 41, and a moving rail 82 that vertically moves the support arm 81 up and down. As the support arm 81 moves vertically on the moving rail 82, the guide member 70 connected to the support arm 81 also moves vertically.

Dummy ejection may be performed while moving the guide member 70 using such a drive mechanism 80 . Specifically, as shown in FIG. 8A, at the beginning of the dummy ejection, the nozzle N and the guide member 70 are arranged so that the guide member 70 is positioned directly below the ejection port Na. The treatment liquid L1 is discharged from the . Then, as shown in FIG. 8B, after the treatment liquid L1 reaches the guide member 70, the controller Ctr controls the drive mechanism 80 so that the guide member 70 moves downward.

By the way, the flow of the treatment liquid L1 ejected from the ejection port Na is most likely to be disturbed immediately after ejection, and once the ejection of the treatment liquid L1 from the ejection port Na is started, the flow of the treatment liquid L1 tends to become stable. be. Therefore, by moving the guide member 70 by the driving mechanism 80 so that the guide member 70 descends with respect to the ejection port Na, the treatment liquid L1 is ejected by the guide member 70 immediately after the treatment liquid L1 is ejected from the ejection port Na. While being guided, the treatment liquid L1 that collides with the guide member 70 and splashes thereafter becomes less likely to adhere to the lower end surface S of the nozzle. Therefore, it is possible to further suppress the adhesion of the processing liquid L1 to the lower end surface S of the nozzle N.

A similar effect can be obtained by moving the nozzle N by the drive mechanism 35 so that the nozzle N rises with respect to the guide member 70 . That is, at least one of the nozzle N and the guide member 70 may be configured to be movable such that the guide member 70 is relatively lowered with respect to the discharge port Na.

(2) At the end of the dummy ejection or just before the end of the dummy ejection, while sucking (sucking back) the processing liquid L1 in the nozzle N, the nozzle N is moved so that the guide member 70 descends relative to the ejection port Na. and at least one of the guide member 70 may be moved. In this case, the processing liquid L1 in the nozzle N is pulled toward the inner side of the nozzle N by the suction operation, while the processing liquid L1 flowing on the surface of the guide member 70 moves toward the guide member 70 as the guide member 70 moves relative to the guide member 70. be pulled. Therefore, when the dummy ejection is completed, the treatment liquid L1 is divided satisfactorily at the ejection port Na of the nozzle N. Therefore, the liquid surface of the processing liquid L1 in the nozzle N after the dummy ejection is likely to be aligned at a constant height position for each dummy ejection process. As a result, it becomes possible to form a film having a more uniform thickness on the surface Wa of the wafer W. FIG.

(3) The drive mechanism 80 (rotation drive section) may further have a function of rotating the guide member 70 around a vertical axis passing through the center of the guide member 70 . In this case, dummy ejection may be performed while rotating the guide member 70 . Specifically, as shown in FIG. 9A, at the beginning of dummy ejection, the nozzle N and the guide member 70 are arranged so that the guide member 70 is positioned directly below the ejection port Na. The treatment liquid L1 is discharged from the . Then, as shown in FIG. 9B, after the treatment liquid L1 reaches the guide member 70, the controller Ctr controls the drive mechanism 80 so that the guide member 70 rotates. In this way, the processing liquid L1 is discharged from the discharge port Na toward the rotating guide member 70, so that the processing liquid L1 tends to be easily caught on the surface of the guide member . Therefore, the processing liquid L1 ejected from the ejection port Na is more difficult to spread around. Therefore, it is possible to further suppress the adhesion of the treatment liquid L1 to the lower end surface S of the nozzle N.

(4) At least the upper end portion of the guide member 70 may have an uneven shape. For example, as shown in FIG. 10( a ), a plurality of projections may be provided on the upper end surface of the guide member 70 . As shown in FIG. 10(b), a plurality of cantilever pieces may be provided on the upper edge of the guide member 70. As shown in FIG. As shown in FIG. 10(c), the upper end portion of the guide member 70 may be provided with a plurality of grooves extending along the vertical direction. In these cases, the surface area of the upper end of the guide member 70 increases. Therefore, a larger amount of the treatment liquid comes into contact with the guide member 70, and the surface tension of the guide member 70 tends to act on the treatment liquid L1. Therefore, the treatment liquid L1 can flow along the surface of the guide member 70 more easily.

(5) The guide member 70 may have a tubular shape. As shown in FIG. 11, the treatment liquid L1 may be ejected from the nozzle N in a state in which the cylindrical guide member 70 is directly below the ejection port Na. Also in this case, the surface area of the guide member 70 is increased, so that the treatment liquid L1 flows along the surface of the guide member 70 more easily.

As shown in FIG. 12A, the treatment liquid L1 may be discharged from the nozzle N in a state in which the upper end of the cylindrical guide member 70 is in contact with the lower end surface S. As shown in FIG. At this time, the inner diameter of the guide member 70 may be set to the same extent as the opening diameter of the discharge port Na. Since the processing liquid L1 discharged from the nozzle N flows inside the guide member 70 and is discharged from the lower end of the guide member 70, it does not spread over the lower end surface S. Therefore, it is possible to prevent the processing liquid L1 from adhering to the lower end surface S of the nozzle N. Also in this case, it becomes easier for the treatment liquid L1 to flow along the surface (inner peripheral surface) of the guide member 70 .

As shown in FIG. 12(b), a suction pump 90 (suction portion) may be connected to the cylindrical guide member 70. As shown in FIG. At this time, the treatment liquid L1 may be discharged from the nozzle N while the upper end of the tubular guide member 70 is in contact with the lower end surface S while the suction pump 90 is performing the suction operation. In this case, the treatment liquid L1 ejected from the ejection port Na is sucked by the suction pump 90 through the cylindrical guide member 70. As shown in FIG. Therefore, the treatment liquid L1 ejected from the ejection port Na is more difficult to spread around. Therefore, it is possible to further suppress the adhesion of the processing liquid L1 to the lower end surface S of the nozzle N. Although FIG. 12B shows that the upper end of the guide member 70 is in contact with the lower end surface S, the guide member 70 may be positioned directly below the discharge port Na.

(6) As shown in FIG. 13, a dummy discharge may be performed in a state in which a guide member 70 having an outer diameter smaller than that of the discharge port Na is inserted into the discharge port Na. In this case, it becomes easier for the treatment liquid L1 to flow along the surface (inner peripheral surface) of the guide member 70 .

(7) The surface of the guide member 70 may be subjected to a surface treatment that enhances the wettability of the surface. For example, the surface of the induction member 70 may be made hydrophilic by plasma treatment, or a hydrophilic coating may be formed on the surface of the induction member 70 . In this case, it becomes easier for the processing liquid L1 to flow along the surface of the guide member 70 .

(8) The shape of the nozzle N is not particularly limited as long as the nozzle N has a flat lower end surface S and the discharge port Na is formed in the lower end surface S. For example, as shown in FIGS. 14(a) and 14(b), the tip of the nozzle N may be partially notched. As shown in FIG. 14(c), the flow path in the nozzle N may be enlarged in the vicinity of the discharge port Na. As shown in FIG. 14(d), the nozzle N may be a long nozzle extending linearly in the horizontal direction. In this case, the guide member 70 may also have a flat plate shape corresponding to the slit-shaped discharge port Na of the nozzle N.

(9) As shown in FIG. 15(a), the guide member 70 may be arranged directly below the ejection port Na even when the solvent L2 is supplied to the lower end of the nozzle N after the main ejection. In this case, as shown in FIG. 15B, the solvent L2 is more likely to be guided by the guide member 70 to the vicinity of the discharge port Na of the nozzle N. As shown in FIG. Therefore, the treatment liquid L1 adhering to the lower end surface S of the nozzle N can be removed more effectively.

(10) In the above embodiment, the solvent L2 is supplied to the lower end of the nozzle N after the processing liquid L1 is actually discharged from the nozzle N toward the surface Wa of the wafer W (step S3 in FIG. 5). ), the supply of the solvent L2 to the nozzle N may be performed before the main ejection. Alternatively, the solvent L2 may not be supplied to the nozzle N.

[Example]
Example 1. A liquid processing apparatus according to an example of the present disclosure includes a processing liquid supply unit configured to supply a processing liquid from a nozzle positioned on the surface side of a substrate to the surface, and a flow of the processing liquid discharged from the nozzle. A guide member configured to guide and a controller. The nozzle includes a flat lower end surface provided with an ejection port through which the processing liquid is ejected. The control unit controls the processing liquid supply unit so that the processing liquid is actually discharged from the ejection port to the surface with the lower end face close to the surface, and the ejection is performed while the guide member is in the vicinity of the ejection port. and controlling the processing liquid supply unit so as to dummy-discharge the processing liquid from the outlet toward the guide member.

In the apparatus of Example 1, the treatment liquid is dummy-ejected from the ejection port toward the guide member while the guide member is in the vicinity of the ejection port. Therefore, the treatment liquid ejected from the ejection port flows along the surface of the guide member and is less likely to spread around. Therefore, it becomes difficult for the processing liquid to adhere to the lower end surface of the nozzle after the dummy ejection. As a result, it is possible to suppress adhesion of the treatment liquid to the lower end surface of the nozzles by performing dummy ejection without requiring the trouble of removing the treatment liquid from the lower end surfaces of the nozzles after the dummy ejection.

Example 2. In the apparatus of Example 1, controlling the processing liquid supply section so as to dummy-eject the processing liquid from the ejection port means that the processing liquid is directed from the ejection port toward the guide member in a state where the guide member is directly below the ejection port. Controlling the processing liquid supply unit to perform dummy ejection, and dummy-ejecting the processing liquid from the ejection port toward the guide member in a state where the cylindrical guide member is in contact with the lower end surface so as to communicate with the ejection port. Alternatively, the treatment liquid supply unit is controlled so as to dummy-eject the treatment liquid from the ejection port toward the guide member while the guide member is inserted into the ejection port. may include In this case, it becomes easier for the treatment liquid to flow along the surface of the guide member.

Example 3. The apparatus of Example 1 or Example 2 further comprises a drive unit configured to move the nozzle or the guide member, and controlling the treatment liquid supply unit to dummy-eject the treatment liquid from the ejection port is performed by the guide member. At least one of the nozzle and the guide member is moved so that the guide member descends relative to the ejection port from a state in which is in the vicinity of the ejection port, and the treatment liquid is dummy ejected from the ejection port toward the guide member. It may also include controlling the processing liquid supply unit and the drive unit such that: By the way, the flow of the treatment liquid ejected from the ejection port is most likely to be disturbed immediately after ejection, and once the ejection of the treatment liquid from the ejection port starts, the flow of the treatment liquid tends to be stabilized. Therefore, as in the apparatus of Example 3, by moving at least one of the nozzle and the guide member so that the guide member descends relative to the ejection port, the processing liquid immediately after ejection from the ejection port can be processed. While the liquid is being guided by the guide member, the processing liquid that collides with the guide member and splashes after that is less likely to adhere to the lower end face of the nozzle. Therefore, it is possible to further suppress adhesion of the processing liquid to the lower end surface of the nozzle.

Example 4. The apparatus according to any one of Examples 1 to 3 further includes a rotation driving section configured to rotate the induction member, and controlling the processing liquid supply section to dummy-discharge the processing liquid from the discharge port, Controlling the processing liquid supply unit and the rotation driving unit so that the processing liquid is dummy discharged from the discharge port toward the guide member while the guide member is in the vicinity of the discharge port and the guide member is rotated. It's okay. In this case, since the processing liquid is discharged from the discharge port toward the rotating guide member, the processing liquid tends to be easily caught on the surface of the guide member. Therefore, the processing liquid ejected from the ejection port is more difficult to spread around. Therefore, it is possible to further suppress adhesion of the processing liquid to the lower end surface of the nozzle.

Example 5. The apparatus according to any one of Examples 1 to 4 further includes a suction unit configured to suck the fluid from the interior of the cylindrical guide member, and supplies the processing liquid so as to dummy-discharge the processing liquid from the discharge port. By controlling the portion, in a state in which the induction member is in the vicinity of the ejection port and the suction portion is performing a suction operation, the processing liquid is supplied so as to dummy-eject the processing liquid from the ejection port toward the induction member. may include controlling the unit and the suction unit. In this case, at least part of the treatment liquid ejected from the ejection port is sucked through the tubular guide member. Therefore, the processing liquid ejected from the ejection port is more difficult to spread around. Therefore, it is possible to further prevent the processing liquid from adhering to the lower end surface of the nozzle.

Example 6. In the apparatus of any one of Examples 1-5, the surface of the guide member may be subjected to a surface treatment that enhances the wettability of the surface. In this case, it becomes easier for the treatment liquid to flow along the surface of the guide member.

Example 7. In the device of any one of Examples 1-6, at least the upper end of the guide member may have an uneven shape. In this case, the surface area of the upper end of the guide member is increased. Therefore, more processing liquid comes into contact with the guide member, and the surface tension of the guide member tends to act on the processing liquid. Therefore, it becomes easier for the processing liquid to flow along the surface of the guide member.

Example 8. The apparatus of any one of Examples 1 to 7 further includes a solvent supply unit configured to supply a solvent to the nozzle, and the control unit supplies the solvent around the ejection port before or after the main ejection. Controlling the solvent supply to supply may further be performed. By the way, when the solvent is supplied to the nozzle, the solvent may enter the inside of the nozzle to some extent from the discharge port of the nozzle. If the treatment liquid is directly discharged from the nozzle toward the substrate, the thickness of the film formed on the surface of the substrate may be uneven. Therefore, usually, before the next main discharge, the processing liquid is dummy discharged from the nozzle into, for example, a waste liquid container or the like, thereby discharging the solvent from the inside of the nozzle. However, even during dummy ejection, the flow of the treatment liquid ejected from the ejection port may be disturbed, the treatment liquid may spread around the ejection port, and the treatment liquid may adhere to the lower end surface of the nozzle. However, according to Example 8, the treatment liquid ejected from the ejection port is less likely to flow along the surface of the guide member and spread to the surroundings. Therefore, it becomes more difficult for the processing liquid to adhere to the lower end surface of the nozzle after the dummy ejection.

Example 9. In the apparatus of Example 8, controlling the solvent supply unit means controlling the solvent supply unit so as to supply the solvent around the ejection port after the main ejection in a state where the guide member is directly below the ejection port. may contain. In this case, when the solvent is supplied to the nozzle, the guide member is located directly below the ejection port, so the solvent is easily guided to the vicinity of the ejection port of the nozzle by the guide member. Therefore, it is possible to more effectively remove the processing liquid adhering to the lower end surface of the nozzle.

Example 10. The apparatus of any of Examples 1-9 further comprises a drive section configured to move the nozzle or the guide member, the control section moving the nozzle to move the guide member downward relative to the outlet. and at least one of the induction member and controlling the processing liquid supply unit and the driving unit so as to suck the processing liquid in the nozzle at the end of the dummy ejection or immediately before the end of the dummy ejection. In this case, the processing liquid in the nozzle is pulled to the back side of the nozzle by the suction operation, while the processing liquid flowing on the surface of the guide member is pulled by the guide member as the guide member moves relative to each other. Therefore, at the end of the dummy ejection, the treatment liquid is well divided at the ejection openings of the nozzles. Therefore, the liquid surface of the processing liquid in the nozzle after dummy ejection is easily aligned at a constant height position for each dummy ejection process. As a result, it becomes possible to form a film having a more uniform thickness on the surface of the substrate.

Example 11. In a liquid processing method according to another example of the present disclosure, in a state in which the flat lower end surface of the nozzle is in close proximity to the surface of the substrate, the processing liquid is actually discharged onto the surface from an ejection port provided in the lower end surface, and the induction is performed. Dummy ejection of the processing liquid from the ejection port toward the guide member while the member is in the vicinity of the ejection port. In this case, the same effects as those of the device of Example 1 are obtained.

Example 12. In the method of Example 11, dummy ejection of the treatment liquid from the ejection port means dummy ejection of the treatment liquid from the ejection port toward the guide member in a state where the guide member is directly below the ejection port. Dummy ejection of the treatment liquid from the ejection port toward the guide member while the tubular guide member is in contact with the lower end surface, or in a state where the guide member is inserted into the ejection port, A dummy ejection of the treatment liquid from the ejection port toward the guide member may be included. In this case, the same effects as those of the device of Example 2 are obtained.

Example 13. In the method of Example 11 or Example 12, dummy ejection of the treatment liquid from the ejection port is performed by moving the nozzle and the guide member so that the guide member descends relative to the ejection port from a state in which the guide member is in the vicinity of the ejection port. It may include dummy-ejecting the treatment liquid from the ejection port toward the guide member while moving at least one of the members. In this case, the same effects as those of the device of Example 3 are obtained.

Example 14. In any one of the methods of Examples 11 to 13, the dummy ejection of the treatment liquid from the ejection port is performed by ejecting the treatment liquid from the ejection port while the induction member is in the vicinity of the ejection port and the induction member is rotated. A dummy dispense towards the guide member may be included. In this case, the same effects as those of the device of Example 4 are obtained.

Example 15. In any one of the methods of Examples 11 to 14, the dummy ejection of the treatment liquid from the ejection port is performed in a state in which the cylindrical guide member is in the vicinity of the ejection port and the fluid is sucked from the inside of the guide member. It may include dummy ejection of the treatment liquid from the ejection port toward the guide member while in operation. In this case, the same effects as those of the device of Example 5 are obtained.

Example 16. In any of the methods of Examples 11-15, the surface of the induction member may be subjected to a surface treatment that enhances the wettability of the surface. In this case, the same effects as those of the device of Example 6 are obtained.

Example 17. In the method of any one of Examples 11-16, at least the upper end portion of the guide member may have an uneven shape. In this case, the same effects as those of the device of Example 7 are obtained.

Example 18. The method of any of Examples 11-17 may further comprise supplying a solvent around the discharge port before or after the main discharge. In this case, the same effects as those of the device of Example 8 are obtained.

Example 19. In the method of Example 18, applying the solvent may include applying the solvent around the outlet after the main discharge with the guide member directly below the outlet. In this case, the same effects as those of the device of Example 8 are obtained.

Example 20. In the method of Example 19, at least one of the nozzle and the guide member is moved so that the guide member descends relative to the ejection port, and the processing liquid in the nozzle is sucked at or immediately before the completion of the dummy ejection. may further include In this case, the same effects as those of the device of Example 9 are obtained.

Example 21. An example of a computer-readable recording medium records a program for causing a liquid processing apparatus to execute any one of the liquid processing methods of Examples 11-20. In this case, the same effect as any of the methods of Examples 11 to 20 can be obtained. As used herein, computer-readable recording media include non-transitory computer recording media (e.g., various main storage devices or auxiliary storage devices) and transitory computer recording media. ) (eg, a data signal that can be provided over a network).

REFERENCE SIGNS LIST 1 liquid processing apparatus 30 processing liquid supply unit 35 drive mechanism (drive unit) 40 liquid receiving unit 50 solvent supply unit 70 guide member 80 drive mechanism (drive unit; rotation drive unit ), 90... Suction pump (suction part), Ctr... Controller (control part), N... Nozzle, S... Lower end surface, W... Wafer (substrate), Wa... Surface.

Claims (13)

a processing liquid supply unit configured to supply a processing liquid to the surface of the substrate from a nozzle positioned on the surface side of the substrate;
a guide member configured to guide the flow of the treatment liquid ejected from the nozzle;
and a control unit,
the nozzle includes a flat lower end surface provided with an ejection port through which the treatment liquid is ejected;
The control unit
controlling the processing liquid supply unit so as to main-discharge the processing liquid from the discharge port onto the surface in a state where the lower end surface is close to the surface;
controlling the treatment liquid supply unit to dummy-eject the treatment liquid from the ejection opening toward the induction member while the induction member is in the vicinity of the ejection opening ;
Controlling the processing liquid supply unit so as to dummy-eject the processing liquid from the ejection port includes:
controlling the treatment liquid supply unit so as to dummy-eject the treatment liquid from the ejection opening toward the induction member in a state where the induction member is directly below the ejection opening;
In a state where the tubular guide member is in contact with the lower end surface so as to communicate with the ejection port, the processing liquid supply unit is moved so as to dummy-eject the processing liquid from the ejection port toward the guide member. to control; or
a liquid processing apparatus comprising: controlling the processing liquid supply unit to dummy-eject the processing liquid from the ejection opening toward the induction member in a state in which the induction member is inserted into the ejection opening; . a processing liquid supply unit configured to supply a processing liquid to the surface of the substrate from a nozzle positioned on the surface side of the substrate;
a guide member configured to guide the flow of the treatment liquid ejected from the nozzle;
a drive configured to move the nozzle or the guide member ;
and a control unit,
the nozzle includes a flat lower end surface provided with an ejection port through which the treatment liquid is ejected;
The control unit
controlling the processing liquid supply unit so as to main-discharge the processing liquid from the discharge port onto the surface in a state where the lower end surface is close to the surface;
controlling the treatment liquid supply unit to dummy-eject the treatment liquid from the ejection opening toward the induction member while the induction member is in the vicinity of the ejection opening;
Controlling the processing liquid supply unit so as to dummy-eject the processing liquid from the ejection port is performed by moving the induction member relative to the ejection port from a state in which the induction member is in the vicinity of the ejection port. At least one of the nozzle and the guide member is moved downward, and the treatment liquid supply unit and the drive unit are controlled so as to dummy-eject the treatment liquid from the ejection port toward the guide member. A liquid processor , comprising: a processing liquid supply unit configured to supply a processing liquid to the surface of the substrate from a nozzle positioned on the surface side of the substrate;
a guide member configured to guide the flow of the treatment liquid ejected from the nozzle;
a rotary drive configured to rotate the guide member ;
and a control unit,
the nozzle includes a flat lower end surface provided with an ejection port through which the treatment liquid is ejected;
The control unit
controlling the processing liquid supply unit so as to main-discharge the processing liquid from the discharge port onto the surface in a state where the lower end surface is close to the surface;
controlling the treatment liquid supply unit to dummy-eject the treatment liquid from the ejection opening toward the induction member while the induction member is in the vicinity of the ejection opening;
Controlling the processing liquid supply unit so as to dummy-eject the processing liquid from the ejection port is performed in a state in which the guide member is in the vicinity of the ejection port and in a state in which the guide member is rotated. and controlling the processing liquid supply unit and the rotation driving unit so as to dummy-discharge the processing liquid from the guide member toward the guide member. a processing liquid supply unit configured to supply a processing liquid to the surface of the substrate from a nozzle positioned on the surface side of the substrate;
a guide member configured to guide the flow of the treatment liquid ejected from the nozzle;
a suction part configured to suck fluid from the inside of the guiding member having a tubular shape;
and a control unit,
the nozzle includes a flat lower end surface provided with an ejection port through which the treatment liquid is ejected;
The control unit
controlling the processing liquid supply unit so as to main-discharge the processing liquid from the discharge port onto the surface in a state where the lower end surface is close to the surface;
controlling the treatment liquid supply unit to dummy-eject the treatment liquid from the ejection opening toward the induction member while the induction member is in the vicinity of the ejection opening;
Controlling the processing liquid supply unit so as to dummy-eject the processing liquid from the ejection port is performed in a state in which the guide member is in the vicinity of the ejection port and the suction unit is performing a suction operation. and controlling the processing liquid supply section and the suction section so as to dummy-discharge the processing liquid from the discharge port toward the guide member. 5. The device according to any one of claims 1 to 4 , wherein at least the upper end of said guide member has an uneven shape. further comprising a drive configured to move the nozzle or the guide member;
The control unit moves at least one of the nozzle and the guide member such that the guide member descends relative to the ejection port, and controls the processing in the nozzle at the end of dummy ejection or immediately before the end of the dummy ejection. The apparatus according to any one of claims 1 to 5 , further comprising controlling the treatment liquid supply and the drive to aspirate liquid. main discharge of the treatment liquid onto the surface from a discharge port provided in the lower end surface of the substrate in a state where the flat lower end surface of the nozzle is in proximity to the surface of the substrate;
dummy discharging the treatment liquid from the discharge port toward the guide member in a state where the guide member is in the vicinity of the discharge port ;
Dummy ejection of the treatment liquid from the ejection port includes:
Dummy ejection of the treatment liquid from the ejection port toward the guide member in a state where the guide member is directly below the ejection port;
Dummy ejection of the treatment liquid from the ejection port toward the guide member in a state in which the cylindrical guide member is in contact with the lower end face so as to communicate with the ejection port;
A liquid processing method , comprising dummy-ejecting the processing liquid from the ejection port toward the guide member in a state in which the guide member is inserted into the interior of the ejection port . main discharge of the treatment liquid onto the surface from a discharge port provided in the lower end surface of the substrate in a state where the flat lower end surface of the nozzle is in proximity to the surface of the substrate;
dummy discharging the treatment liquid from the discharge port toward the guide member in a state where the guide member is in the vicinity of the discharge port;
Dummy ejection of the treatment liquid from the ejection port is performed by moving the nozzle and the guide member so that the guide member descends relative to the ejection port from a state in which the guide member is in the vicinity of the ejection port. and dummy-ejecting the treatment liquid from the ejection port toward the guide member while moving at least one of the two. main discharge of the treatment liquid onto the surface from a discharge port provided in the lower end surface of the substrate in a state where the flat lower end surface of the nozzle is in proximity to the surface of the substrate;
dummy discharging the treatment liquid from the discharge port toward the guide member in a state where the guide member is in the vicinity of the discharge port;
Dummy ejection of the processing liquid from the ejection port means directing the processing liquid from the ejection port to the guide member while the guide member is in the vicinity of the ejection port and the guide member is rotated. A liquid processing method, comprising: main discharge of the treatment liquid onto the surface from a discharge port provided in the lower end surface of the substrate in a state where the flat lower end surface of the nozzle is in proximity to the surface of the substrate;
dummy discharging the treatment liquid from the discharge port toward the guide member in a state where the guide member is in the vicinity of the discharge port;
Dummy ejection of the processing liquid from the ejection port is performed in a state in which the tubular induction member is in the vicinity of the ejection port and in a state in which the fluid is sucked from the inside of the induction member. 1. A liquid processing method, comprising dummy discharging the processing liquid from the discharge port toward the guide member. 11. The method according to any one of claims 7 to 10 , wherein at least the upper end of said guide member has an uneven shape. At least one of the nozzle and the guide member is moved so that the guide member descends relative to the ejection port, and the processing liquid in the nozzle is sucked at or immediately before the completion of the dummy ejection. A method according to any one of claims 7 to 11 , further comprising A computer-readable recording medium recording a program for causing a liquid processing apparatus to execute the liquid processing method according to any one of claims 7 to 12 .

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