TW202344713A - 鈀觸媒液 - Google Patents

鈀觸媒液 Download PDF

Info

Publication number
TW202344713A
TW202344713A TW112108981A TW112108981A TW202344713A TW 202344713 A TW202344713 A TW 202344713A TW 112108981 A TW112108981 A TW 112108981A TW 112108981 A TW112108981 A TW 112108981A TW 202344713 A TW202344713 A TW 202344713A
Authority
TW
Taiwan
Prior art keywords
palladium
palladium catalyst
chloride
catalyst liquid
acid
Prior art date
Application number
TW112108981A
Other languages
English (en)
Chinese (zh)
Inventor
津野勇輝
橋爪佳
田中克幸
Original Assignee
日商奧野製藥工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商奧野製藥工業股份有限公司 filed Critical 日商奧野製藥工業股份有限公司
Publication of TW202344713A publication Critical patent/TW202344713A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
TW112108981A 2022-05-10 2023-03-10 鈀觸媒液 TW202344713A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-077399 2022-05-10
JP2022077399 2022-05-10

Publications (1)

Publication Number Publication Date
TW202344713A true TW202344713A (zh) 2023-11-16

Family

ID=88729907

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112108981A TW202344713A (zh) 2022-05-10 2023-03-10 鈀觸媒液

Country Status (4)

Country Link
JP (1) JP7809383B2 (https=)
CN (1) CN119173651A (https=)
TW (1) TW202344713A (https=)
WO (1) WO2023218728A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1107840B (it) * 1978-07-25 1985-12-02 Alfachimici Spa Soluzione catalitica per la deposizione anelettrica di metalli
JPS59500870A (ja) * 1982-05-26 1984-05-17 マツクダ−ミツド　インコ−ポレ−テツド 非伝導性基板活性化触媒溶液および無電解メツキ方法
JPH06145994A (ja) * 1992-11-09 1994-05-27 Hitachi Chem Co Ltd 選択的無電解ニッケルめっき用触媒溶液及びこの溶液を用いた無電解ニッケルめっき方法
JPH11124680A (ja) * 1997-10-21 1999-05-11 Ebara Udylite Kk 無電解めっき用触媒液
JP4624615B2 (ja) 2001-09-26 2011-02-02 京セラ株式会社 無電解めっき用触媒液
US9783890B2 (en) * 2012-10-26 2017-10-10 Rohm And Haas Electronic Materials Llc Process for electroless plating and a solution used for the same

Also Published As

Publication number Publication date
CN119173651A (zh) 2024-12-20
WO2023218728A1 (ja) 2023-11-16
JP7809383B2 (ja) 2026-02-02
JPWO2023218728A1 (https=) 2023-11-16

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