JP7809383B2 - パラジウム触媒液 - Google Patents

パラジウム触媒液

Info

Publication number
JP7809383B2
JP7809383B2 JP2024520264A JP2024520264A JP7809383B2 JP 7809383 B2 JP7809383 B2 JP 7809383B2 JP 2024520264 A JP2024520264 A JP 2024520264A JP 2024520264 A JP2024520264 A JP 2024520264A JP 7809383 B2 JP7809383 B2 JP 7809383B2
Authority
JP
Japan
Prior art keywords
palladium
catalyst solution
palladium catalyst
chloride
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024520264A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023218728A5 (https=
JPWO2023218728A1 (https=
Inventor
勇輝 津野
佳 橋爪
克幸 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okuno Chemical Industries Co Ltd
Original Assignee
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chemical Industries Co Ltd filed Critical Okuno Chemical Industries Co Ltd
Publication of JPWO2023218728A1 publication Critical patent/JPWO2023218728A1/ja
Publication of JPWO2023218728A5 publication Critical patent/JPWO2023218728A5/ja
Application granted granted Critical
Publication of JP7809383B2 publication Critical patent/JP7809383B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
JP2024520264A 2022-05-10 2023-02-24 パラジウム触媒液 Active JP7809383B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022077399 2022-05-10
JP2022077399 2022-05-10
PCT/JP2023/006627 WO2023218728A1 (ja) 2022-05-10 2023-02-24 パラジウム触媒液

Publications (3)

Publication Number Publication Date
JPWO2023218728A1 JPWO2023218728A1 (https=) 2023-11-16
JPWO2023218728A5 JPWO2023218728A5 (https=) 2024-10-24
JP7809383B2 true JP7809383B2 (ja) 2026-02-02

Family

ID=88729907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024520264A Active JP7809383B2 (ja) 2022-05-10 2023-02-24 パラジウム触媒液

Country Status (4)

Country Link
JP (1) JP7809383B2 (https=)
CN (1) CN119173651A (https=)
TW (1) TW202344713A (https=)
WO (1) WO2023218728A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003105550A (ja) 2001-09-26 2003-04-09 Kyocera Corp 無電解めっき用触媒液
JP2014088618A (ja) 2012-10-26 2014-05-15 Rohm & Haas Electronic Materials Llc 無電解めっきのための方法およびそのために使用される溶液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1107840B (it) * 1978-07-25 1985-12-02 Alfachimici Spa Soluzione catalitica per la deposizione anelettrica di metalli
JPS59500870A (ja) * 1982-05-26 1984-05-17 マツクダ−ミツド　インコ−ポレ−テツド 非伝導性基板活性化触媒溶液および無電解メツキ方法
JPH06145994A (ja) * 1992-11-09 1994-05-27 Hitachi Chem Co Ltd 選択的無電解ニッケルめっき用触媒溶液及びこの溶液を用いた無電解ニッケルめっき方法
JPH11124680A (ja) * 1997-10-21 1999-05-11 Ebara Udylite Kk 無電解めっき用触媒液

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003105550A (ja) 2001-09-26 2003-04-09 Kyocera Corp 無電解めっき用触媒液
JP2014088618A (ja) 2012-10-26 2014-05-15 Rohm & Haas Electronic Materials Llc 無電解めっきのための方法およびそのために使用される溶液

Also Published As

Publication number Publication date
TW202344713A (zh) 2023-11-16
CN119173651A (zh) 2024-12-20
WO2023218728A1 (ja) 2023-11-16
JPWO2023218728A1 (https=) 2023-11-16

Similar Documents

Publication Publication Date Title
US4232060A (en) Method of preparing substrate surface for electroless plating and products produced thereby
TWI687545B (zh) 無電解鎳觸擊鍍液及鎳鍍膜的形成方法
JP2009500527A (ja) スズ・ウィスカ成長を最小化する特性又は特徴を有するスズの電着
CN110325665A (zh) 无电解镀敷工艺
JPH02197580A (ja) 無電解ハンダめっき浴
JP7809383B2 (ja) パラジウム触媒液
JP3800213B2 (ja) 無電解ニッケルめっき液
CN102677037A (zh) 一种化学锡后处理溶液组合物
CN114703520A (zh) 无氰电镀金液及其制备方法和应用、镀金件及其制备方法
JP7407644B2 (ja) パラジウムめっき液及びめっき方法
HK40115958A (zh) 钯催化剂液
CN118814174A (zh) 一种应用于细线路的后浸酸洗剂及使用方法
JP6719437B2 (ja) 無電解ニッケルめっき浴
KR20150135446A (ko) 무전해 도금하기 위한 구리 표면을 활성화하는 방법
JP5296115B2 (ja) 無電解金属メッキの前処理剤およびこれを用いた回路基板の製造方法
JP4616886B2 (ja) アンチモン化合物を含有する基板にスズおよびスズ合金をコーティングするための方法
CN114901867A (zh) 无电解镀敷工艺及双层镀膜
CN118946690B (zh) Pr脉冲电解用镀铜液和利用pr脉冲电解法的镀铜方法
TWI905315B (zh) 錫合金鍍敷液
JP7573322B1 (ja) 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法
JP7557627B2 (ja) 錫－銀めっき液及びそれを用いた錫－銀はんだバンプの形成方法
CA1169304A (en) Preparing substrate surface for electroless plating
JP5066691B2 (ja) 無電解金めっき浴を安定化させる方法
CA1176118A (en) Preparing substrate surface for electroless plating and products produced thereby
JP2013144835A (ja) 無電解Ｎｉ−Ｐ−Ｓｎめっき液

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A5211

Effective date: 20240708

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240708

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250826

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251022

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260106

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260114

R150 Certificate of patent or registration of utility model

Ref document number: 7809383

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150