TW202324463A - 電子零件之製造方法及電子零件之製造裝置 - Google Patents
電子零件之製造方法及電子零件之製造裝置 Download PDFInfo
- Publication number
- TW202324463A TW202324463A TW111138984A TW111138984A TW202324463A TW 202324463 A TW202324463 A TW 202324463A TW 111138984 A TW111138984 A TW 111138984A TW 111138984 A TW111138984 A TW 111138984A TW 202324463 A TW202324463 A TW 202324463A
- Authority
- TW
- Taiwan
- Prior art keywords
- holes
- electronic components
- plate
- mentioned
- flat plate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 67
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 164
- 238000007747 plating Methods 0.000 description 20
- 239000003985 ceramic capacitor Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 238000010304 firing Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-181477 | 2021-11-05 | ||
JP2021181477A JP7435578B2 (ja) | 2021-11-05 | 2021-11-05 | 電子部品の製造方法、および、電子部品の製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202324463A true TW202324463A (zh) | 2023-06-16 |
Family
ID=86208936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111138984A TW202324463A (zh) | 2021-11-05 | 2022-10-14 | 電子零件之製造方法及電子零件之製造裝置 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP7435578B2 (ja) |
KR (2) | KR102663731B1 (ja) |
CN (1) | CN116092827A (ja) |
TW (1) | TW202324463A (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09232113A (ja) * | 1996-02-21 | 1997-09-05 | Taiyo Yuden Co Ltd | 電子部品の外部電極形成方法及び電子部品整列装置 |
JP3653630B2 (ja) | 2001-06-25 | 2005-06-02 | Tdk株式会社 | チップ部品の向き整列方法 |
JP4337498B2 (ja) * | 2003-10-23 | 2009-09-30 | 株式会社村田製作所 | 導電性ペーストの塗布方法および導電性ペーストの塗布装置 |
JP4462218B2 (ja) | 2006-03-28 | 2010-05-12 | Tdk株式会社 | チップ状電子部品の外部電極形成方法および外部電極形成装置 |
JP5327959B2 (ja) | 2009-02-05 | 2013-10-30 | 信越ポリマー株式会社 | 保持治具及び小型部品の取扱装置 |
JP4636196B2 (ja) * | 2009-05-27 | 2011-02-23 | 株式会社村田製作所 | 部品整列装置及び電子部品の製造方法 |
JP7122135B2 (ja) * | 2018-03-27 | 2022-08-19 | 太陽誘電株式会社 | チップ部品の整列方法 |
-
2021
- 2021-11-05 JP JP2021181477A patent/JP7435578B2/ja active Active
-
2022
- 2022-08-29 KR KR1020220108085A patent/KR102663731B1/ko active IP Right Grant
- 2022-09-29 CN CN202211204965.3A patent/CN116092827A/zh active Pending
- 2022-10-14 TW TW111138984A patent/TW202324463A/zh unknown
-
2024
- 2024-01-31 JP JP2024012464A patent/JP2024032906A/ja active Pending
- 2024-04-30 KR KR1020240057735A patent/KR20240064614A/ko active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR102663731B1 (ko) | 2024-05-14 |
JP2024032906A (ja) | 2024-03-12 |
JP2023069552A (ja) | 2023-05-18 |
CN116092827A (zh) | 2023-05-09 |
KR20230065882A (ko) | 2023-05-12 |
KR20240064614A (ko) | 2024-05-13 |
JP7435578B2 (ja) | 2024-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9491849B2 (en) | Electronic component | |
US6542352B1 (en) | Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias | |
US11688555B2 (en) | Chip electronic component | |
JP2017157805A (ja) | 電子部品の実装構造及びその電子部品の製造方法 | |
JP2015050452A (ja) | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 | |
US20180350524A1 (en) | Multilayer ceramic electronic component | |
JP6714840B2 (ja) | 積層セラミック電子部品およびその製造方法 | |
JP2017108057A (ja) | 積層セラミックコンデンサ | |
JP2016034047A (ja) | 実装構造 | |
KR102454829B1 (ko) | 칩형 전자부품, 전자부품의 실장 구조체 및 전자부품 집합체 | |
KR101859098B1 (ko) | 적층 세라믹 전자부품 | |
US9613755B2 (en) | Multi layer ceramic capacitor, embedded board using multi layer ceramic capacitor and manufacturing method thereof | |
TW202324463A (zh) | 電子零件之製造方法及電子零件之製造裝置 | |
JP5347350B2 (ja) | 積層型電子部品の製造方法 | |
JP2020021821A (ja) | 電子部品 | |
JPH01152712A (ja) | 積層セラミックコンデンサの外部電極の形成方法 | |
JPH0554245B2 (ja) | ||
CN216015095U (zh) | 层叠陶瓷电容器 | |
US20230360854A1 (en) | Multilayer ceramic capacitor | |
JP7156320B2 (ja) | 積層セラミックコンデンサ | |
WO2023238552A1 (ja) | 積層セラミックコンデンサ | |
JP7172927B2 (ja) | 積層セラミック電子部品、およびその製造方法 | |
WO2023189718A1 (ja) | 積層セラミックコンデンサ | |
JP2022064121A (ja) | 積層セラミック電子部品 | |
JP2642754B2 (ja) | Lc複合ネットワーク部品及びその製造方法 |