TW202319405A - 紫外線固化性樹脂組合物、黏著劑、密封劑、絕緣保護劑和電子電路板 - Google Patents

紫外線固化性樹脂組合物、黏著劑、密封劑、絕緣保護劑和電子電路板 Download PDF

Info

Publication number
TW202319405A
TW202319405A TW111133862A TW111133862A TW202319405A TW 202319405 A TW202319405 A TW 202319405A TW 111133862 A TW111133862 A TW 111133862A TW 111133862 A TW111133862 A TW 111133862A TW 202319405 A TW202319405 A TW 202319405A
Authority
TW
Taiwan
Prior art keywords
meth
acrylate
resin composition
mass
curable resin
Prior art date
Application number
TW111133862A
Other languages
English (en)
Chinese (zh)
Inventor
木村和毅
安永登史宏
Original Assignee
日商荒川化學工業股份有限公司
日商朋諾股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荒川化學工業股份有限公司, 日商朋諾股份有限公司 filed Critical 日商荒川化學工業股份有限公司
Publication of TW202319405A publication Critical patent/TW202319405A/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45—Heterocyclic compounds having sulfur in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45—Heterocyclic compounds having sulfur in the ring
    • C08K5/46—Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
TW111133862A 2021-09-10 2022-09-07 紫外線固化性樹脂組合物、黏著劑、密封劑、絕緣保護劑和電子電路板 TW202319405A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021147512 2021-09-10
JP2021-147512 2021-09-10
PCT/JP2022/033258 WO2023038003A1 (ja) 2021-09-10 2022-09-05 紫外線硬化性樹脂組成物、接着剤、封止剤、絶縁保護剤及び電子回路基板
WOPCT/JP2022/33258 2022-09-05

Publications (1)

Publication Number Publication Date
TW202319405A true TW202319405A (zh) 2023-05-16

Family

ID=85507621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111133862A TW202319405A (zh) 2021-09-10 2022-09-07 紫外線固化性樹脂組合物、黏著劑、密封劑、絕緣保護劑和電子電路板

Country Status (5)

Country Link
JP (1) JPWO2023038003A1 (https=)
KR (1) KR20240055730A (https=)
CN (1) CN117916290A (https=)
TW (1) TW202319405A (https=)
WO (1) WO2023038003A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140320770A1 (en) 2012-01-13 2014-10-30 Nippon Kayaku Kabushikikaisha Optical member and ultraviolet-curable adhesive to be used for producing the same
JP2016117832A (ja) * 2014-12-22 2016-06-30 昭和電工株式会社 光硬化性組成物およびその用途
JP6460901B2 (ja) * 2015-04-28 2019-01-30 富士フイルム株式会社 硬化性組成物、硬化膜、有機ｅｌ表示装置、液晶表示装置、タッチパネル及びタッチパネル表示装置
JP6699145B2 (ja) * 2015-11-30 2020-05-27 味の素株式会社 光および熱硬化性樹脂組成物
JP2018177924A (ja) * 2017-04-11 2018-11-15 三洋化成工業株式会社 活性エネルギー線硬化性樹脂組成物
JP7236671B2 (ja) * 2018-12-25 2023-03-10 パナソニックＩｐマネジメント株式会社 発光素子封止用組成物、及び発光装置

Also Published As

Publication number Publication date
WO2023038003A1 (ja) 2023-03-16
KR20240055730A (ko) 2024-04-29
JPWO2023038003A1 (https=) 2023-03-16
CN117916290A (zh) 2024-04-19

Similar Documents

Publication Publication Date Title
TWI798395B (zh) 噴墨印刷用之硬化性組成物、其之硬化物及具有該硬化物之電子零件
EP3778805B1 (en) Curable composition for inkjet, cured product of same, and electronic component comprising said cured product
KR20170017999A (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP7112170B2 (ja) インクジェット印刷用の硬化性組成物、その硬化物及びその硬化物を有する電子部品
KR20180129867A (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
WO2016039324A1 (ja) 樹脂組成物、重合性樹脂組成物及び感光性樹脂組成物並びにそれらの硬化物
JP5076075B2 (ja) 紫外線硬化型組成物
JP2019108426A (ja) 活性エネルギー線硬化型接着剤組成物及び積層体
JP2005076005A (ja) ハードコート用感光性樹脂組成物
WO2007046292A1 (ja) ポリウレタン化合物、それを含む感光性樹脂組成物及びその硬化物とそれを有するフィルム
JP6265424B2 (ja) （メタ）アクリレート化合物及び樹脂組成物
JPH09255765A (ja) 硬化性樹脂組成物
JP5076076B2 (ja) 紫外線硬化型組成物
TW202319404A (zh) 紫外線固化性樹脂組合物、黏著劑、密封劑、絕緣保護劑和電子電路板
TW202319405A (zh) 紫外線固化性樹脂組合物、黏著劑、密封劑、絕緣保護劑和電子電路板
JP2000086713A (ja) 硬化性組成物、それを用いた硬化皮膜の形成方法および硬化物
JP7136386B1 (ja) 活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
JP7663830B2 (ja) 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
JP2005343816A (ja) （メタ）アクリレート化合物の混合物の製造方法、及びそれによって得られた混合物を含有する感光性樹脂組成物
WO2022107508A1 (ja) 酸基を有する（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
JP2002080509A (ja) マレイミドビニルエーテル誘導体及びそれを含有する光硬化性樹脂組成物
JP2022067270A (ja) 酸基を有する（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
JP7782219B2 (ja) 酸基及び重合性不飽和基を有する樹脂の製造方法
JP6774185B2 (ja) 積層構造体およびプリント配線板
JP6475571B2 (ja) （メタ）アクリレート化合物及び感光性樹脂組成物