TW202249543A - 用於嵌入式積體電路總成之總成及其用途與製造方法 - Google Patents

用於嵌入式積體電路總成之總成及其用途與製造方法 Download PDF

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Publication number
TW202249543A
TW202249543A TW111112787A TW111112787A TW202249543A TW 202249543 A TW202249543 A TW 202249543A TW 111112787 A TW111112787 A TW 111112787A TW 111112787 A TW111112787 A TW 111112787A TW 202249543 A TW202249543 A TW 202249543A
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TW
Taiwan
Prior art keywords
components
assembly
amalgam
release layer
ppm
Prior art date
Application number
TW111112787A
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English (en)
Chinese (zh)
Inventor
傑納 希慈
Original Assignee
美商泰瑞賽克斯公司
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Publication date
Application filed by 美商泰瑞賽克斯公司 filed Critical 美商泰瑞賽克斯公司
Publication of TW202249543A publication Critical patent/TW202249543A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Powder Metallurgy (AREA)
TW111112787A 2021-04-01 2022-04-01 用於嵌入式積體電路總成之總成及其用途與製造方法 TW202249543A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163169658P 2021-04-01 2021-04-01
US63/169,658 2021-04-01

Publications (1)

Publication Number Publication Date
TW202249543A true TW202249543A (zh) 2022-12-16

Family

ID=81585417

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111112787A TW202249543A (zh) 2021-04-01 2022-04-01 用於嵌入式積體電路總成之總成及其用途與製造方法

Country Status (7)

Country Link
US (1) US20220319829A1 (cg-RX-API-DMAC7.html)
EP (1) EP4315414A2 (cg-RX-API-DMAC7.html)
JP (1) JP2024512805A (cg-RX-API-DMAC7.html)
KR (1) KR20230164117A (cg-RX-API-DMAC7.html)
CN (1) CN117242568A (cg-RX-API-DMAC7.html)
TW (1) TW202249543A (cg-RX-API-DMAC7.html)
WO (1) WO2022212492A2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12596306B2 (en) * 2021-11-11 2026-04-07 Terecircuits Corporation Photochemical and thermal release layer processes and uses in device manufacturing
US12611840B1 (en) * 2022-09-14 2026-04-28 Apple Inc. Electronic devices with modified covers

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053195A (en) 1989-07-19 1991-10-01 Microelectronics And Computer Technology Corp. Bonding amalgam and method of making
US6132676A (en) 1997-06-30 2000-10-17 Massachusetts Institute Of Technology Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite
US6358567B2 (en) 1998-12-23 2002-03-19 The Regents Of The University Of California Colloidal spray method for low cost thin coating deposition
US7141348B2 (en) 2003-05-23 2006-11-28 Intelleflex Corporation Lamination and delamination technique for thin film processing
US6946178B2 (en) 2003-05-23 2005-09-20 James Sheats Lamination and delamination technique for thin film processing
US7300824B2 (en) 2005-08-18 2007-11-27 James Sheats Method of packaging and interconnection of integrated circuits
US7759167B2 (en) * 2005-11-23 2010-07-20 Imec Method for embedding dies
US20100078496A1 (en) 2008-09-29 2010-04-01 Sono-Tek Corporation Methods and systems for ultrasonic spray shaping
US8922021B2 (en) 2011-12-30 2014-12-30 Deca Technologies Inc. Die up fully molded fan-out wafer level packaging
US9455160B2 (en) * 2013-01-14 2016-09-27 Infineon Technologies Ag Method for fabricating a semiconductor chip panel
TWI622142B (zh) * 2016-11-07 2018-04-21 Industrial Technology Research Institute 晶片封裝體以及晶片封裝方法
US11024608B2 (en) * 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
TWI734175B (zh) * 2019-08-21 2021-07-21 矽品精密工業股份有限公司 電子封裝件及其製法與電子封裝模組

Also Published As

Publication number Publication date
WO2022212492A3 (en) 2022-11-10
CN117242568A (zh) 2023-12-15
JP2024512805A (ja) 2024-03-19
WO2022212492A2 (en) 2022-10-06
EP4315414A2 (en) 2024-02-07
US20220319829A1 (en) 2022-10-06
KR20230164117A (ko) 2023-12-01

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