TW200947607A - Chip embedded package structure and method for fabricating the same - Google Patents

Chip embedded package structure and method for fabricating the same Download PDF

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Publication number
TW200947607A
TW200947607A TW97117544A TW97117544A TW200947607A TW 200947607 A TW200947607 A TW 200947607A TW 97117544 A TW97117544 A TW 97117544A TW 97117544 A TW97117544 A TW 97117544A TW 200947607 A TW200947607 A TW 200947607A
Authority
TW
Taiwan
Prior art keywords
package structure
fabricating
same
method
recess
Prior art date
Application number
TW97117544A
Other versions
TWI353650B (en
Inventor
Kuo-Chun Chiang
Hsien-Chieh Lin
Shih-Tsung Lin
Ming-Shien Lee
Original Assignee
Nan Ya Printed Circuit Board
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board filed Critical Nan Ya Printed Circuit Board
Priority to TW97117544A priority Critical patent/TWI353650B/en
Publication of TW200947607A publication Critical patent/TW200947607A/en
Application granted granted Critical
Publication of TWI353650B publication Critical patent/TWI353650B/en

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Abstract

The invention provides a chip embedded package structure and a method for fabricating the same. The package structure includes a metal core having a recess and a plurality of through holes. An insulting layer conformally covers the recess and the through holes. An inner circuit is formed on the insulating layer. An ink is used to fill the through holes. A semiconductor chip is mounted in the recess. A dielectric layer is formed on the semiconductor chip and the inner circuit. A build-up circuit is formed on the opposite sides of the metal core, and electrically connected to the inner circuit through a plurality of via openings.
TW97117544A 2008-05-13 2008-05-13 Chip embedded package structure and method for fab TWI353650B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97117544A TWI353650B (en) 2008-05-13 2008-05-13 Chip embedded package structure and method for fab

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97117544A TWI353650B (en) 2008-05-13 2008-05-13 Chip embedded package structure and method for fab

Publications (2)

Publication Number Publication Date
TW200947607A true TW200947607A (en) 2009-11-16
TWI353650B TWI353650B (en) 2011-12-01

Family

ID=44870373

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97117544A TWI353650B (en) 2008-05-13 2008-05-13 Chip embedded package structure and method for fab

Country Status (1)

Country Link
TW (1) TWI353650B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102117782A (en) * 2010-01-06 2011-07-06 南亚电路板股份有限公司 Composite buried element structure and manufacturing method thereof
CN102387659A (en) * 2010-09-03 2012-03-21 南亚电路板股份有限公司 Printed circuit board and production method thereof
TWI400998B (en) * 2010-08-20 2013-07-01 Nan Ya Printed Circuit Board Printed circuit board and method for fabricating the same
US9343333B2 (en) 2010-11-11 2016-05-17 Advanced Semiconductor Engineering, Inc. Wafer level semiconductor package and manufacturing methods thereof
US9349611B2 (en) 2010-03-22 2016-05-24 Advanced Semiconductor Engineering, Inc. Stackable semiconductor package and manufacturing method thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
TWI566348B (en) * 2014-09-03 2017-01-11 Siliconware Precision Industries Co Ltd Package structure and method of manufacture
TWI585918B (en) * 2014-07-18 2017-06-01 Siliconware Precision Industries Co Ltd Interposer and method of manufacture

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9324664B2 (en) 2013-02-22 2016-04-26 Unimicron Technology Corp. Embedded chip package structure
TWI572268B (en) * 2014-10-13 2017-02-21 欣興電子股份有限公司 Interposer and manufacturing method therefor
US10051742B2 (en) 2015-12-10 2018-08-14 Industrial Technology Research Institute Power module and manufacturing method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102117782A (en) * 2010-01-06 2011-07-06 南亚电路板股份有限公司 Composite buried element structure and manufacturing method thereof
US9349611B2 (en) 2010-03-22 2016-05-24 Advanced Semiconductor Engineering, Inc. Stackable semiconductor package and manufacturing method thereof
TWI400998B (en) * 2010-08-20 2013-07-01 Nan Ya Printed Circuit Board Printed circuit board and method for fabricating the same
CN102387659A (en) * 2010-09-03 2012-03-21 南亚电路板股份有限公司 Printed circuit board and production method thereof
CN102387659B (en) 2010-09-03 2013-04-10 南亚电路板股份有限公司 Printed circuit board and production method thereof
US9343333B2 (en) 2010-11-11 2016-05-17 Advanced Semiconductor Engineering, Inc. Wafer level semiconductor package and manufacturing methods thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
TWI585918B (en) * 2014-07-18 2017-06-01 Siliconware Precision Industries Co Ltd Interposer and method of manufacture
TWI566348B (en) * 2014-09-03 2017-01-11 Siliconware Precision Industries Co Ltd Package structure and method of manufacture

Also Published As

Publication number Publication date
TWI353650B (en) 2011-12-01

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