KR20230164117A - 집적 회로 조립체를 임베딩하는 데 사용되는 조립체 및 이의 용도 및 이의 제조 방법 - Google Patents

집적 회로 조립체를 임베딩하는 데 사용되는 조립체 및 이의 용도 및 이의 제조 방법 Download PDF

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Publication number
KR20230164117A
KR20230164117A KR1020237036968A KR20237036968A KR20230164117A KR 20230164117 A KR20230164117 A KR 20230164117A KR 1020237036968 A KR1020237036968 A KR 1020237036968A KR 20237036968 A KR20237036968 A KR 20237036968A KR 20230164117 A KR20230164117 A KR 20230164117A
Authority
KR
South Korea
Prior art keywords
ppm
assembly
components
amalgam
release layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237036968A
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English (en)
Korean (ko)
Inventor
제이나 쉬츠
Original Assignee
테레써킷츠 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테레써킷츠 코포레이션 filed Critical 테레써킷츠 코포레이션
Publication of KR20230164117A publication Critical patent/KR20230164117A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H01L23/3135—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
    • H01L21/568—
    • H01L23/29—
    • H01L24/96—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H01L2224/24137—
    • H01L2224/24195—
    • H01L2924/19041—
    • H01L2924/19043—
    • H01L2924/19105—
    • H01L2924/3511—
    • H01L2924/3512—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Powder Metallurgy (AREA)
KR1020237036968A 2021-04-01 2022-03-30 집적 회로 조립체를 임베딩하는 데 사용되는 조립체 및 이의 용도 및 이의 제조 방법 Pending KR20230164117A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163169658P 2021-04-01 2021-04-01
US63/169,658 2021-04-01
PCT/US2022/022532 WO2022212492A2 (en) 2021-04-01 2022-03-30 Assemblies used for embedding integrated circuit assemblies, and their uses and method of fabrication thereof

Publications (1)

Publication Number Publication Date
KR20230164117A true KR20230164117A (ko) 2023-12-01

Family

ID=81585417

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237036968A Pending KR20230164117A (ko) 2021-04-01 2022-03-30 집적 회로 조립체를 임베딩하는 데 사용되는 조립체 및 이의 용도 및 이의 제조 방법

Country Status (7)

Country Link
US (1) US20220319829A1 (cg-RX-API-DMAC7.html)
EP (1) EP4315414A2 (cg-RX-API-DMAC7.html)
JP (1) JP2024512805A (cg-RX-API-DMAC7.html)
KR (1) KR20230164117A (cg-RX-API-DMAC7.html)
CN (1) CN117242568A (cg-RX-API-DMAC7.html)
TW (1) TW202249543A (cg-RX-API-DMAC7.html)
WO (1) WO2022212492A2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12596306B2 (en) * 2021-11-11 2026-04-07 Terecircuits Corporation Photochemical and thermal release layer processes and uses in device manufacturing
US12611840B1 (en) * 2022-09-14 2026-04-28 Apple Inc. Electronic devices with modified covers

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053195A (en) 1989-07-19 1991-10-01 Microelectronics And Computer Technology Corp. Bonding amalgam and method of making
US6132676A (en) 1997-06-30 2000-10-17 Massachusetts Institute Of Technology Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite
US6358567B2 (en) 1998-12-23 2002-03-19 The Regents Of The University Of California Colloidal spray method for low cost thin coating deposition
US7141348B2 (en) 2003-05-23 2006-11-28 Intelleflex Corporation Lamination and delamination technique for thin film processing
US6946178B2 (en) 2003-05-23 2005-09-20 James Sheats Lamination and delamination technique for thin film processing
US7300824B2 (en) 2005-08-18 2007-11-27 James Sheats Method of packaging and interconnection of integrated circuits
US7759167B2 (en) * 2005-11-23 2010-07-20 Imec Method for embedding dies
US20100078496A1 (en) 2008-09-29 2010-04-01 Sono-Tek Corporation Methods and systems for ultrasonic spray shaping
US8922021B2 (en) 2011-12-30 2014-12-30 Deca Technologies Inc. Die up fully molded fan-out wafer level packaging
US9455160B2 (en) * 2013-01-14 2016-09-27 Infineon Technologies Ag Method for fabricating a semiconductor chip panel
TWI622142B (zh) * 2016-11-07 2018-04-21 Industrial Technology Research Institute 晶片封裝體以及晶片封裝方法
US11024608B2 (en) * 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
TWI734175B (zh) * 2019-08-21 2021-07-21 矽品精密工業股份有限公司 電子封裝件及其製法與電子封裝模組

Also Published As

Publication number Publication date
WO2022212492A3 (en) 2022-11-10
TW202249543A (zh) 2022-12-16
CN117242568A (zh) 2023-12-15
JP2024512805A (ja) 2024-03-19
WO2022212492A2 (en) 2022-10-06
EP4315414A2 (en) 2024-02-07
US20220319829A1 (en) 2022-10-06

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P22-X000 Classification modified

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