TW202244105A - 硬化性樹脂組成物 - Google Patents
硬化性樹脂組成物 Download PDFInfo
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- TW202244105A TW202244105A TW111105503A TW111105503A TW202244105A TW 202244105 A TW202244105 A TW 202244105A TW 111105503 A TW111105503 A TW 111105503A TW 111105503 A TW111105503 A TW 111105503A TW 202244105 A TW202244105 A TW 202244105A
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Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/502—Polyalkylene polyamines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
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Abstract
本發明關於一種環氧樹脂組成物,其低溫硬化性優異,且對於狹窄部的間隙有優異的滲透性。本發明的環氧樹脂組成物,包含下列之(A)~(C)成分:
(A)成分:具有2個以上環氧基之化合物;
(B)成分:經苯基胺基矽烷處理之二氧化矽;以及
(C)成分:使(A)成分硬化之化合物。
Description
本發明關於一種具有低溫硬化性,且對於狹窄部的間隙有良好的滲透性之硬化性樹脂組成物。
傳統以來使用環氧樹脂之組成物,因具有優異的耐熱性或耐藥性而被廣泛運用於各種領域中。並且,依據近年來各式各樣的部件的小型化或輕量化之觀點,為了能夠抑制熱對於部材的影響,目前極期望能有一種具有低溫硬化性的接著劑或密封劑。特別是小型的電子部件因熱導致的影響較大,故120℃以下之低溫硬化性非常重要。進一步,小型部件近年來構造越發複雜化,使樹脂滲透至500μm以下之狹窄部的間隙並接著、密封已成為基本要求。(日本特開第2019-199511號公報)對於如此之小型部件之間隙,若接著劑或密封劑的滲透性較差,則接著面積會降低,接著強度或耐久性降低,導致無法充分發揮原本接著劑或密封劑所擁有的機能。
為了提升滲透性,最簡單的手段是添加溶劑來降低黏度,增加流動性的手段。由於溶劑為揮發性,故優點在於揮發後不會影響樹脂組成物之性能。然而,會有溶劑在狹小間隙之中難以揮發,硬化後仍會殘留於硬化物中,降低作為接著劑或密封劑的性能之問題。
本案發明人為了解決上述課題而深入研究的結果,發現一種具有低溫硬化性,且不須使用溶劑即可提升滲透性之硬化性樹脂組成物,從而完成本發明。
下列說明本發明之主旨。
[1]一種硬化性樹脂組成物,包含下列之(A)~(C)成分,且在25℃之黏度為10Pa・s以下:
(A)成分:具有2個以上環氧基之化合物;
(B)成分:經苯基胺基矽烷處理之二氧化矽;以及
(C)成分:使(A)成分硬化之化合物。
[2]如[1]所述之硬化性樹脂組成物,其中,前述(A)成分為具有雙酚骨架之化合物。
[3]如[1]或[2]所述之硬化性樹脂組成物,其中,前述(C)成分為胺加成物系潛在性硬化劑。
[4]如[1]至[3]中任一項所述之硬化性樹脂組成物,其中,前述(C)成分之軟化點或熔點為150℃以下。
[5]如[1]至[4]中任一項所述之硬化性樹脂組成物,進一步包含反應性稀釋劑作為(D)成分。
[6]如[5]所述之硬化性樹脂組成物,其中,前述反應性稀釋劑為具有芳香環之環氧化合物。
[7]如[1]至[6]中任一項所述之硬化性樹脂組成物,進一步包含硫醇硬化劑作為(E)成分。
[8]如[7]所述之硬化性樹脂組成物,其中,前述硫醇硬化劑為不含酯鍵之硫醇硬化劑。
[9]如[1]至[8]中任一項所述之硬化性樹脂組成物,係用於包含鎳之被著體。
[10]一種硬化物,係如[1]至[9]中任一項所述之硬化性樹脂組成物之硬化物。
下列詳細說明本發明。又,本說明書中,「X~Y」係包含將其前後所記載之數值(X及Y)作為下限值及上限值的意義來使用,意旨「X以上且Y以下」。
本發明之一形態,係一種硬化性樹脂組成,其包含下列之(A)~(C)成分,且在25℃之黏度為10Pa・s以下:
(A)成分:具有2個以上環氧基之化合物;
(B)成分:經苯基胺基矽烷處理之二氧化矽;以及
(C)成分:使(A)成分硬化之化合物。
本發明之硬化性樹脂組成物具有低溫硬化性,對於小型電子部件等之狹小間隙的滲透性優異,故非常有用。
本發明使用之(A)成分只要為1分子中具有2個以上環氧基之化合物即可,並無特別限定。作為(A)成分,無特別限定,可列舉例如:雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚AD型環氧樹脂、萘型環氧樹脂、聯苯基型環氧樹脂、苯酚酚醛清漆型環氧樹脂、溴化雙酚A型環氧樹脂、氫化雙酚A型環氧樹脂、縮水甘油胺型環氧樹脂、二環戊二烯型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、脂環式環氧樹脂等,惟不受限於此等。此等可僅使用1種,亦可將2種類以上混合使用。(A)成分之中,依據滲透性優異的觀點,以雙酚A型環氧樹脂或雙酚F型環氧樹脂為佳,雙酚A型環氧樹脂與雙酚F型環氧樹脂之混合物更佳。
依據低溫硬化性之觀點,前述(A)成分之環氧當量係50~400g/eq為佳,100~300g/eq更佳。依據滲透性之觀點,(A)成分之黏度,係在25℃時未達0.5~100Pa・s為佳,0.7~50Pa・s更佳,未達1~10Pa・s最佳。
作為前述(A)成分之市售品,可列舉例如:jER828、1001、806、807、152、604、630、871、YX8000、YX8034、YX4000(三菱化學股份有限公司製)、EPICLON 830、EXA-830LVP、EXA-850CRP、EXA-835LV、HP4032D、HP4700、HP820(DIC股份有限公司製)、EP-4100、EP-4100G、EP-4100E、EP-4100TX、EP-4300E、EP-4000、EP-4000G、EP-4000E、EP-4000TX、EP-4005、EP-4400、EP-4520S、EP-4530、EP-4901、EP-4901EP-4080、EP-4085、EP-4088、EP-5100-75X、EP-7001、EP-4080E、EPU-6、EPU-7N、EPU-11F、EPU-15F、EPU-1395、EPU-73B、EPU-17、EPU-17、EPU-17T-6、EPU-80、EPR-1415-1、EPR-2000、EPR-2007、EPR-1630、EP-49-10N、EP-49-10P2、EPR4023、EPR2007(ADEKA股份有限公司製)、DENACOL EX-612、EX-614、EX-622、EX-314、EX-412、EX-521、EX-411(Nagase ChemteX股份有限公司製)、TEPIC、TEPIC-S、TEPIC-VL(日產化學工業股份有限公司製)、SY-35M、SR-NPG、SR-TMP(坂本藥品工業股份有限公司製)等,但不受限於此等。此等可個別單獨使用,亦可將二種以上混合使用。
本發明所使用的(B)成分係經苯基胺基矽烷進行表面處理的二氧化矽。可藉由使存在於二氧化矽粒子之表面之羥基與苯基胺基矽烷進行反應而得。本發明所述之苯基胺基矽烷,係意旨具有苯基胺基之烷氧基矽烷。可列舉例如:N-苯基-γ-胺基丙基三甲氧基矽烷、N-苯基-γ-胺基丙基三乙氧基矽烷、3-苯基胺基丙基三甲氧基矽烷、3-苯基胺基丙基三乙氧基矽烷等,其中,依據滲透性之觀點,係N-苯基-γ-胺基丙基三甲氧基矽烷、N-苯基-γ-胺基丙基三乙氧基矽烷為佳,N-苯基-γ-胺基丙基三甲氧基矽烷更佳。藉由添加(B)成分,可提升對於狹窄部的滲透性。依據滲透性之觀點,(B)成分之形狀係球狀為佳。進一步依據能夠降低對於滲透性的影響之觀點,50%平均粒徑係0.1~5μm為佳,0.1~3μm更佳,0.1~1μm最佳。又,就50%平均粒徑的確認方法而言,可列舉如:雷射繞射散射式或微型分選控制方式之粒度-形狀分布測定器、光學顯微鏡、電子顯微鏡等之影像解析。本發明係使用雷射繞射散射式。
相對於(A)成分100質量份,係含有0.1~200質量份之前述(B)成分為佳,含有1~120質量份較佳,含有10~80質量份最佳。0.1以上時,可提升滲透性,200質量份以下則不會有降低滲透性之虞。
本發明所使用之(C)成分,係能夠使(A)硬化的化合物(惟排除(E)成分)。依據低溫硬化性與保存穩定性之觀點,在25℃呈固體為佳。作為(C)成分,可列舉如:熱硬化劑、光硬化劑。作為熱硬化劑,可列舉如:潛在性硬化劑、熱陽離子聚合起始劑,作為光硬化劑,可列舉如:光陽離子聚合起始劑、光鹼產生劑等。其中,依據即使非玻璃等之透過性部材仍可硬化之觀點,係潛在性硬化劑、熱陽離子聚合起始劑等之熱硬化劑為佳,在更低溫時亦能夠硬化之潛在性硬化劑較佳。
作為前述潛在性硬化劑,可列舉如:脂肪族及芳香族胺化合物、咪唑及其衍生物、酸酐化合物、聚醯胺化合物、醯肼化合物、酚醛清漆、甲酚酚醛清漆等之酚醛清漆樹脂、胺加成物系化合物、尿素加合物化合物、咪唑加合物化合物、雙氰胺及其衍生物等。此等可單獨使用1種,亦可將2種以上併用。其中,依據低溫硬化性與保存穩定性之觀點,係胺加成物系潛在性硬化劑為佳,該胺加成物系潛在性硬化劑係藉由對於咪唑及其衍生物或環氧樹脂添加三級胺使其反應,在反應途中停止,再將得到的胺加成物系化合物粉碎從而獲得者,胺加成物系潛在性硬化劑較佳,改性脂肪族聚胺加成物系、改性脂環式聚胺加成物系最佳。使用胺加成物系潛在性硬化劑作為(C)成分時,依據低溫硬化性之觀點,胺價係80~200為佳,90~150更佳。
作為前述潛在性硬化劑之市售品,可列舉如:AMICURE PN-23、PN-23J、PN-31、PN-31J、PN-40J、PN-H、PN-R、MY-24、MY-R(味之素Fine Techno股份有限公司製)、Fujicure FXE-1000、Fujicure FXR-1030、Fujicure FXR-1081(T&K TOKA股份有限公司製)、Curesol SIZ、2MZ-H、C11Z、C17Z、2PZ、2PZ-PW、2P4MZ(四國化成工業股份有限公司製)等。
作為前述熱陽離子聚合起始劑,可列舉如:包含六氟銻酸鹽陰離子以及陽離子所成鹽類之熱陽離子聚合起始劑、包含六氟磷酸鹽陰離子以及陽離子所成鹽類之熱陽離子聚合起始劑、四(五氟苯基)硼酸鹽陰離子以及陽離子所成鹽類之熱陽離子聚合起始劑等,此等之中,依據優異的低溫硬化性,係包含四(五氟苯基)硼酸鹽陰離子以及陽離子所成鹽類之熱陽離子聚合起始劑為佳。作為陽離子,可列舉例如:4級銨陽離子、硫原子鍵結的3個基中至少1個為碳數1~8之烷基之鋶離子等。包含四(五氟苯基)硼酸鹽陰離子以及陽離子所成鹽之熱陽離子聚合起始劑,較佳地,依據低溫硬化性與良好滲透性之觀點,可列舉如:包含四(五氟苯基)硼酸鹽陰離子以及4級銨陽離子所成鹽之熱陽離子聚合起始劑等。此等可單獨使用1種,亦可將2種以上併用。
作為前述熱陽離子聚合起始劑之市售品,可列舉如:SI-60L、SI-80L、SI-100L(三新化學工業股份有限公司製)、SI-110L、SI-180L、SI-B2A、SI-B3A(三新化學工業股份有限公司製)、CXC-1821(King Industries公司製)等。
作為前述光陽離子聚合起始劑,可列舉如:芳香族鋶系光陽離子聚合起始劑、芳香族碘鎓系光陽離子聚合起始劑。此等可單獨使用1種,亦可將2種以上併用。
作為前述芳香族鋶系光陽離子聚合起始劑之具體例,可列舉例如:三苯基鋶六氟磷酸鹽、三苯基鋶六氟銻酸鹽、三苯基鋶四(五氟苯基)硼酸鹽、4,4’-雙〔二苯基巰〕二苯基硫醚-雙六氟磷酸鹽、4,4’-雙〔二(β-羥基乙氧基)苯基鋶〕二苯基硫醚-雙六氟銻酸鹽、4,4’-雙〔二(β-羥基乙氧基)苯基鋶〕二苯基硫醚-雙六氟磷酸鹽、7-〔二(對甲苯甲基)鋶〕-2-異丙基噻噸酮六氟銻酸鹽、7-〔二(對甲苯甲基)鋶〕-2-異丙基噻噸酮四(五氟苯基)硼酸鹽、4-苯基羰基-4’-二苯基鋶-二苯基硫醚-六氟磷酸鹽、4-(對第三丁基苯基羰基)-4’-二苯基鋶-二苯基硫醚-六氟銻酸鹽、4-(對第三丁基苯基羰基)-4’-二(對甲苯甲基)鋶-二苯基硫醚-四(五氟苯基)硼酸鹽等。芳香族鋶系光陽離子聚合起始劑不受限於此等。此等芳香族鋶系光陽離子聚合起始劑可單獨使用或混合使用。作為前述芳香族碘鎓系光陽離子聚合起始劑,可列舉例如:二苯基碘鎓四(五氟苯基)硼酸鹽、二苯基碘鎓六氟磷酸鹽、二苯基碘鎓六氟銻酸鹽、二(4-壬基苯基)碘鎓六氟磷酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基碘鎓四(五氟苯基)硼酸鹽等。此等可單獨使用1種,亦可將2種以上併用。
作為前述光陽離子聚合起始劑之市售品,可列舉如:SP-150、SP-170、SP-172(ADEKA股份有限公司製)、CPI-100P、CPI-101A、CPI-110B、CPI-200K、CPI-210S(San-Apro股份有限公司製)、T1608、T1609、T2041、T2042(東京化成工業股份有限公司製)、UVI-6990、UVI-6974(美國聯合碳化物公司製)、DTS-200(MIDORI KAGAKU CO. LTD.製)、Irgacure
®250(BASF公司製)、PI-2074(RHODIA公司製)、B2380、B2381、D2238、D2248、D2253、I0591(東京化成工業股份有限公司製)、WPI-113、WPI-116、WPI-169、WPI-170、WPI-124(和光純藥工業股份有限公司製)等。
作為前述光鹼產生劑,可列舉如:二氮雜二環辛烷系四苯基硼酸鹽或四丁基銨丁基三苯基硼酸鹽、二第三丁基甲基鏻四苯基硼酸鹽、N,N-二甲基苯胺四(五氟苯基)硼酸鹽、4-異丙基-4’-甲基二苯基碘鎓四(五氟苯基)硼酸鹽等。
作為前述光鹼產生劑之市售品,可列舉如:U-CAT5002(San-Apro股份有限公司製)、P3B、BP3B、N3B、MN3B(昭和電工股份有限公司製)等。
前述(C)成分為熱硬化劑時的軟化點或熔點,依據低溫硬化性與保存穩定性之觀點,係70~150℃之範圍為佳,80~140℃更佳,90~130℃最佳。前述(C)成分為胺加成物系化合物時的胺價,依據低溫硬化性之觀點,係70~200為佳,90~150較佳,100~130最佳。
前述(C)成分之50%平均粒徑,依據滲透性、低溫硬化性以及保存穩定性之觀點,係0.1~50μm為佳,1~30μm更佳,2~20μm特佳。若為0.1μm以上,由於(A)成分容易分散,故不會有沉降等問題,作為硬化性樹脂組成物有優異的穩定性。若為50μm以下,則不會影響滲透性,且難以發生毛細管現象,故可得到更穩定之硬化物。又,作為50%平均粒徑之確認方法,可列舉如:雷射繞射散射式或微型分選控制方式之粒度-形狀分布測定器、光學顯微鏡、電子顯微鏡等之影像解析。本發明係使用雷射繞射散射式。
相對於(A)成分100質量份,前述(C)成分係0.1~50質量份為佳,1~40質量份較佳,5~30質量份最佳。若為0.1~50質量份,能夠不降低保存穩定性,維持穩定的硬化性。
本發明所使用之前述(D)成分為反應性稀釋劑。本發明所述之反應性稀釋劑係意旨能夠降低(A)成分之黏度,且藉由(C)成分進行反應之化合物。藉由添加(D)成分,在不降低硬化性的情況下能夠提升滲透性。依據滲透性之觀點,具有1個或2個反應性官能基之化合物為佳,具有1個化合物更佳。依據與(A)成分的相溶性及與(C)成分的反應性之觀點,係具有環氧丙基作為反應性官能基之化合物為佳。其中,依據不降低硬化物物性中的接著力或對於高溫高濕等之耐久性,係具有包含直鏈或支鏈的脂肪族縮水甘油醚或芳香環的縮水甘油醚為佳,具有芳香環之縮水甘油醚較佳,具有碳數1~10之烷基之苯基縮水甘油醚最佳。碳數1~10之烷基係與苯基直接鍵結。作為(D)成分之具體例,可列舉如:甲基苯基縮水甘油醚、乙基苯基縮水甘油醚、丙基苯基縮水甘油醚、丁基苯基縮水甘油醚、戊基苯基縮水甘油醚、己基苯基縮水甘油醚、戊基苯基縮水甘油醚、辛基苯基縮水甘油醚、壬基苯基縮水甘油醚、癸基苯基縮水甘油醚等,依據與其他成分之相溶性之觀點,具有碳數1~6之烷基者為佳,4-第三丁基苯基縮水甘油醚、4-第二丁基苯基縮水甘油醚較佳,4-第三丁基苯基縮水甘油醚最佳。此等可單獨使用1種,亦可將2種以上併用。
作為前述(D)成分之市售品,可列舉如:ED-502、ED-502S、ED-509E、ED-509S、ED-529、ED-503、ED-503G、ED-506、ED-523T(ADEKA股份有限公司製)或DENACOL EX-810、EX-811、EX-850、EX-851、EX-821、EX-830、EX-832、EX-841、EX-861、EX-920、EX-931、EX-141、EX-145、EX-146、EX-147、EX-192、EX-201、EX-211、EX-212(Nagase ChemteX股份有限公司製)等。
前述(D)成分之黏度,依據滲透性之觀點,在25℃係0.0001~0.5Pa・s為佳,0.001~0.2Pa・s較佳,0.01~0.1Pa・s最佳。
前述(D)成分之環氧當量,依據低溫硬化性之觀點,係10~1000g/eq為佳,50~500g/eq較佳,100~400g/eq最佳。
相對於前述(A)成分100質量份,前述(D)成分係1~100質量份為佳,5~80質量份更佳,10~70質量份最佳。若為1質量份以上,可提升滲透性,只要100質量份以下,就不會有影響硬化物物性之虞。
本發明所使用之(E)成分為硫醇硬化劑。只要SH基為1以上即可,並無特別限定,依據硬化性之觀點,係具有2以上之SH基的化合物為佳。
作為前述(E)成分之具體例,可列舉如:三羥甲基丙烷三(3-巰基丙酸酯)、三-[(3-巰基丙醯氧氧基)-乙基]-異氰脲酸酯、新戊四醇四(3-巰基丙酸酯)、四乙二醇雙(3-巰基丙酸酯)、二新戊四醇六(3-巰基丙酸酯)、新戊四醇四(3-巰基丁酸酯)、1,4-雙(3-巰基丁醯氧基)丁烷、1,3,5-三(3-巰基丁醯氧基乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮、三羥甲基丙烷三(3-巰基丁酸酯)、三羥甲基乙烷三(3-巰基丁酸酯)、三羥甲基丙烷三(3-巰基丁酸酯)、三羥甲基乙烷三(3-巰基丁酸酯)、3-甲氧基丁基3-巰基丙酸酯、2-乙基己基-3-巰基丙酸酯、十三烷基-3-巰基丙酸酯、三羥甲基丙烷三硫代丙酸酯、新戊四醇四硫丙酸酯、甲基硫甘醇酸酯、2-乙基己基硫甘醇酸酯、乙二醇雙硫甘醇酸酯、1,4-丁二醇雙硫甘醇酸酯、三羥甲基丙烷三硫甘醇酸酯、新戊四醇四硫甘醇酸酯、二(2-巰基乙基)醚,1-丁烷硫醇,1-己烷硫醇,環己基硫醇、1,4-丁烷二硫醇、3-巰基-2-丁醇、γ-巰基丙基三甲氧基矽烷,苯硫醇、苯甲基硫醇、1,3,5-三巰基甲基苯、1,3,5-三巰基甲基-2,4,6-三甲基苯、末端含有硫醇基之聚醚、末端含有硫醇基之聚硫醚、藉由環氧化合物與硫化氫進行反應而得的硫醇化合物、藉由聚硫醇化合物與環氧化合物進行反應而得的末端具有硫醇基之硫醇化合物等。此外,電子部件常無法在高溼度環境,故係以在高溫高濕下水解性低者為佳,無酯鍵者較佳。此外,依據對於金屬部材之潮濕性及滲透性之觀點,係具有二硫醚鍵結之硫醇或末端含有硫醇基之聚醚為佳。此等可單獨使用1種,亦可將2種以上併用。
依據低溫硬化性之觀點,前述(E)成分之重量平均分子量係100~3000g/mol為佳,200~2000g/mol更佳,300~1500g/mol最佳。本發明之重量平均分子量係藉由將聚乙二醇作為標準物質之凝膠滲透層析法(Gel Permeation Chromatography,GPC)所測定之值。依據低溫硬化性之觀點,前述(E)成分之硫醇當量係0.5~1000g/eq為佳,1~700g/eq更佳,10~500g/eq最佳。
作為前述(E)成分之市售品,可列舉如:BMPA、MPA-80、EHMP、NOMP、MBMP、STMP、TMMP、TEMPIC、PEMP、EGMP-4、DPMP(SC有機股份有限公司製)或Karenz MTPE1、BD1、NR1、TPMB(昭和電工股份有限公司製)、Thiokol LP-33、LP-3、LP-980、LP-23、LP-56、LP-55、LP-12、LP-32、LP-2,LP-31(東麗精細化工股份有限公司製),TS-G,C3TS-G(四國化成工業股份有限公司製)等,但不受限於此等。
前述(E)成分,相對於(A)成分100質量份,係10~300質量份為佳,20~200質量份較佳,50~150質量份最佳。若為10質量份以上,可提升滲透性及硬化性,而在300質量份以下則不會有接著強度等之硬化物物性大幅降低之虞。
前述(A)成分與前述(E)成分之官能基當量比(A)/(E),係0.05~2.0為佳,0.1~0.8更佳。若在0.05~2.0,則硬化性不會降低。
進一步,在不損害本發明之特性的範圍內,亦可進一步包含適量的(B)成分以外之無機填充劑、有機填充劑、顏料、染料、矽烷偶合劑、均染劑、流變調整劑、保存穩定劑等添加劑。
作為前述(B)成分以外之無機填充劑,可列舉如:氧化鋁粉、碳酸鈣粉、滑石粉、二氧化矽粉、氣相二氧化矽粉、銀粉、鎳粉、鈀粉、碳粉、鎢粉、電鍍粉等,但不受限於此。就無機填充劑之配合量的理想範圍而言,相對於(A)成分100質量份,係1~50質量份為佳,5~30質量份更佳。依據滲透性之觀點,平均粒徑係0.05~10μm較佳。
作為前述有機填充劑,只要為由橡膠、彈性體、塑膠、聚合物(或共聚物)等構成之有機物的粉體即可。此外,亦可為具有芯殼型等之多層構造的有機填料。作為有機填料之平均粒徑,係0.05~10μm之範圍為佳。依據提升耐久試驗中之特性之觀點,係包含丙烯酸酸酯以及/或(甲基)丙烯酸酸酯之聚合體或共聚合體所成填料、或苯乙烯化合物之聚合體或共聚合體所成填料為佳。有機填充劑之理想的配合量,相對於(A)100質量份,係1~50質量份為佳,5~30質量份更佳。
作為前述矽烷偶合劑,可列舉例如:3-丙烯醯氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷、3-環氧丙氧基丙基甲基二丙基氧基矽烷、3-環氧丙氧基丙基二甲基單甲氧基矽烷、3-環氧丙氧基丙基二甲基單乙氧基矽烷、3-環氧丙氧基丙基二甲基單丙基氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷等之含環氧丙基之矽烷偶合劑;乙烯基三(β-甲氧基乙氧基)矽烷、乙烯基三乙氧基矽烷、乙烯基三甲氧基矽烷等之乙烯基含有矽烷偶合劑;3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基二甲基單甲氧基矽烷、3-甲基丙烯醯氧基丙基二甲基單乙氧基矽烷、3-丙烯醯氧基丙基甲基二丙基氧基矽烷、3-丙烯醯氧基丙基甲基二甲氧基矽烷、3-丙烯醯氧基丙基甲基二乙氧基矽烷、3-丙烯醯氧基丙基甲基二丙基氧基矽烷、3-丙烯醯氧基丙基二甲基單丙基氧基矽烷、3-丙烯醯氧基丙基二甲基單甲氧基矽烷、3-丙烯醯氧基丙基二甲基單乙氧基矽烷、3-丙烯醯氧基丙基二甲基單丙基氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷等之(甲基)丙烯酸基含有矽烷偶合劑、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等の胺基含有矽烷偶合劑、γ-巰基丙基三甲氧基矽烷、γ-氯丙基三甲氧基矽烷等。此等之中,依據優異接著力之觀點,係含環氧丙基之矽烷偶合劑為佳。此等可單獨使用,亦可將2種以上併用。矽烷偶合劑之理想的配合量,相對於(A)成分100質量份係0.1~20質量份。
作為前述保存穩定劑,可使用硼酸酯、磷酸、烷基磷酸酯、對甲苯磺酸。作為硼酸酯,可列舉如:硼酸三丁酯、三甲氧基環硼氧烷、硼酸乙酯等,但不受限於此等。作為烷基磷酸酯,可使用磷酸三甲基、磷酸三丁基等,但不受限於此等。保存穩定劑可單獨使用亦可將複數混合使用。考慮到對於硬化收縮之影響,選自由磷酸、烷基磷酸酯、硼酸酯、三甲氧基環硼氧烷、以及對甲苯磺酸甲基構成之群組中之1種以上為佳,磷酸,硼酸酯最佳。依據維持硬化性與保存穩定性之觀點,保存穩定劑之理想配合量,相對於(A)成分100質量份係0.1~10質量份。
<塗布方法>
作為將本發明之硬化性樹脂組成物塗布於被著體之方法,係利用公知的密封劑或接著劑之方法。例如,可利用以自動塗布機進行的點膠、噴塗、噴墨、絲網印刷、凹版印刷、浸漬、旋塗等之方法。依據塗布性以及滲透性之觀點,本發明之硬化性樹脂組成物之黏度(25℃)係10Pa・s以下為佳,7Pa・s以下較佳,1Pa・s以下最佳。
<被著體之材質>
本發明之硬化性樹脂組成物可對於金屬或塑膠等各種的部材使用。作為金屬,可列舉如:鐵、鋁、不銹鋼、金、銀、銅、鎳等,作為塑膠,可列舉如:聚丙烯、聚乙烯、聚胺酯、ABS、酚醛樹脂、CFRP(碳纖維強化塑膠)、GFRP(玻璃纖維強化塑膠)、6,6-尼龍、PPS、PBT等。其中,由於本發明之硬化性樹脂組成物對於金屬表面之浸潤性優異,故可合適地用於包含金屬之部材,特別係對於鎳具有優異之浸潤性。
<硬化方法以及硬化物>
本發明之硬化性樹脂組成物藉由(C)成分的選擇,可利用加熱或照射紫外線等之活性能量線照射來進行硬化,從而得到硬化物。使用加熱硬化性之硬化劑時,硬化溫度係50~150℃為佳,較佳係60~120℃,70~100℃最佳。硬化時間並無特別限定,50~150℃之溫度時係1分鐘~3小時為佳,2分鐘~2小時更佳。使用活性能量線硬化性之硬化劑時,積算光量係0.1~50kJ/m
2為佳,1~30kJ/m
2更佳。
<用途>
本發明之環氧樹脂組成物可使用於各種用途。作為具體例,可使用於汽車用開關零件、頭燈、馬達内部零件、電裝元件、驅動引擎、剎車油箱、前引擎蓋、擋泥板、門窗等之車身面板、窗等之接著、密封、澆鑄、塗層等;在電子材料領域,可使用於平板顯示器(液晶顯示器、有機EL顯示器、發光二極體顯示裝置、場發射顯示器)、或影碟、CD、DVD、MD、拾音器鏡頭、硬碟等之接著、密封、澆鑄、塗層等;在電池領域,可使用於鋰電池、鋰離子電池、錳電池、鹼性電池、燃料電池、矽基太陽能電池、染料敏化太陽能電池、有機太陽能電池等之接著、密封、塗層等;在光學零件領域,可使用於光開關周邊、光連接器周邊之光纖材料、光被動元件、光電路零件、光電積體電路周邊之接著、密封、塗層等;在光學設備領域,可使用於攝像頭模組、鏡頭材料、取景器棱鏡、目標棱鏡、取景器蓋、受光傳感器部件、攝影鏡頭、投影電視用之投影鏡頭等之接著、密封、塗層等;在基礎設施領域,可使用於瓦斯管、水管等之接著、內襯材、密封、塗層材等。其中,由於本發明之硬化性樹脂組成物具有低溫硬化性,且對於狹窄部之滲透性優異,可適用於構成電子機器之小型部件,特別適用在對於具有500μm以下之間隙的小型電子部件之滲透接著。
[實施例]
接著列舉實施例來更詳細地說明本發明,惟本發明並未受限於該等實施例。
[實施例1~3、比較例1~6、參考例1~3]
為了調製硬化性樹脂組成物而準備下述成分。又,(B)以及(B’)成分係使用作為核心的二氧化矽粒子相同,差異僅在表面處理者。
(A):雙酚A型,F型混合環氧樹脂 商品名:EPICLON EXA-835LV(DIC股份有限公司製) 環氧當量:165g/eq 黏度(25℃):2000mPa・s
(B):苯基胺基矽烷(N-苯基-γ-胺基丙基三甲氧基矽烷)處理球狀二氧化矽 商品名:SXJ2500-SXJ(Admatechs股份有限公司製) 平均粒徑:0.5μm 比表面積:6.0m
2/g
(B’-1):無處理球狀二氧化矽 商品名:SC2500-SQ 平均粒徑:0.5μm
比表面積:6.0m
2/g
(B’-2):環氧矽烷處理球狀二氧化矽(Admatechs股份有限公司製) 平均粒徑:0.5μm 比表面積:6.0m
2/g
(B’-3):苯基矽烷處理球狀二氧化矽(Admatechs股份有限公司製) 平均粒徑:0.5μm 比表面積:6.0m
2/g
(B’-4):甲基丙烯酸矽烷處理球狀二氧化矽(Admatechs股份有限公司製) 平均粒徑:0.5μm 比表面積:6.0m
2/g
(B’-5):乙烯基矽烷處理球狀二氧化矽(Admatechs股份有限公司製) 平均粒徑:0.5μm 比表面積:6.0m
2/g
(B’-6):二甲基矽烷處理球狀二氧化矽(Admatechs股份有限公司製)平均粒徑:0.5μm 比表面積:6.0m
2/g
(C):潛在性硬化劑(改性脂肪族聚胺加成物系) 商品名:FUJICURE FXR-1081(T&K TOKA股份有限公司製) 軟化點:125℃ 胺價:115 平均粒徑:6μm
(D):反應性稀釋劑(對第三丁基苯基單縮水甘油醚) 商品名:ADEKAGLYCILOL ED-509S(ADEKA股份有限公司製)黏度(25℃):20mPa・s 環氧當量:200~230g/eq
(E):硫醇硬化劑(二硫醚鍵結含有末端硫醇聚醚) 商品名:LP-3(東麗精細化工股份有限公司製) 黏度(25℃):1.8Pa・s 重量平均分子量:1000g/mol 硫醇基含有量:2.0mol%。
將(A)成分與(B)成分秤量至攪拌容器中,以攪拌器攪拌30分鐘。進一步,添加(C)成分並攪拌10分鐘。添加(D)成分或(E)成分時係與(A)成分以及(B)成分同時投入來進行。詳細之調製量依據表1以及表2,數值全部以質量份標示。任一試驗皆在25℃進行。
[低溫硬化性]
對於寬25mm×長度100mm×厚度1.6mm之鎳板滴下各硬化性樹脂組成物1g,使用熱風乾燥爐以80℃×30分進行硬化。使用玻璃棒搓硬化物,確認玻璃棒是否不會與未硬化之硬化性樹脂組成物附著。若尚未硬化則追加進行80℃×30分的硬化。
<合格基準>
○:在進行了80℃×60分的時點後玻璃棒不會附著。
◎:在進行了80℃×30分的時點後玻璃棒不會附著。
[黏度]
使用錐板式黏度計,以剪切速度10s
-1測定各硬化性樹脂組成物之黏度。
<合格基準>10Pa・s以下
下限值並無特別限定,較佳為0.01Pa・s以上。
[滲透性]
使2枚的寬25mm×長度100mm×厚度1.6mm鎳板彼此在長度方向偏移20mm並使用200μm之墊片包夾,以面前的鎳板在下方的方式重合,並使用膠帶固定來得到試驗片。使基台至試驗片為止的角度呈10°的方式傾斜並固定於治具。對於在25℃之環境下使各硬化性樹脂組成物偏移的鎳板之間隙的上部滴下1g,再使用熱風乾燥爐進行50℃×10分的加溫。加溫後,取下固定試驗片的膠帶,剝離重合的試驗片,從而測定硬化性樹脂組成物流入的最長距離(硬化性樹脂組成物從面前的鎳板上部流入的距離)。
[表1]
實施例1 | 比較例1 | 比較例2 | 比較例3 | 比較例4 | 比較例5 | 比較例6 | |||
A | EXA-835LV | 100 | 100 | 100 | 100 | 100 | 100 | 100 | |
B | 苯基胺基矽烷處理 | 62.5 | |||||||
B’-1 | 無處理 | 62.5 | |||||||
B’-2 | 環氧矽烷 | 62.5 | |||||||
B’-3 | 苯基矽烷 | 62.5 | |||||||
B’-4 | 甲基丙烯酸矽烷 | 62.5 | |||||||
B’-5 | 乙烯基矽烷 | 62.5 | |||||||
B’-6 | 二甲基矽烷 | 62.5 | |||||||
C | FXR-1081 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | |
D | ED-509S | ||||||||
E | LP-3 | ||||||||
低溫硬化性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ||
黏度 | Pa‧s | 5.8 | 6.5 | 7.6 | 5.4 | 6.6 | 6.8 | 6.1 | |
滲透性 | mm | 30 | 10 | 6 | 16 | 8 | 7 | 8 | |
[表2]
實施例2 | 實施例3 | 參考例1 | 參考例2 | 參考例3 | |||
A | EXA-835LV | 100 | 100 | 100 | 100 | 100 | |
B | 苯基胺基矽烷處理 | 50 | 55 | ||||
B’-1 | 無處理 | ||||||
B’-2 | 環氧矽烷 | ||||||
B’-3 | 苯基矽烷 | ||||||
B’-4 | 甲基丙烯酸矽烷 | ||||||
B’-5 | 乙烯基矽烷 | ||||||
B’-6 | 二甲基矽烷 | ||||||
C | FXR-1081 | 3 | 7 | 17 | 3 | 7 | |
D | ED-509S | 10 | 60 | 10 | 60 | ||
E | LP-3 | 70 | 70 | ||||
低溫硬化性 | ○ | ◎ | ○ | ○ | ◎ | ||
黏度 | Pa‧s | 0.51 | 0.42 | 3.4 | 0.26 | 0.21 | |
滲透性 | mm | 45 | 55 | 25 | 43 | 52 | |
如表1或表2所示,可知如參考例1之不含二氧化矽的組成物或如比較例1之包含未處理的二氧化矽的組成物、以及包含經苯基胺基矽烷處理之二氧化矽的實施例1皆具有優異的滲透性。此外,可知如比較例2~6之經其他表面處理的二氧化矽則滲透性顯著地降低。此外,可知比起不含二氧化矽之參考例1,實施例1之組成物不僅黏度高,滲透性亦優異。實施例2係包含(D)成分之組成物,可之具有更優異的滲透性。實施例2與包含(D)成分但不包含(B)成分之參考例2比較時,可知表現出高黏度及優異滲透性。此外,依據低溫硬化性之觀點係包含(E)成分,可知能夠更快速地硬化。實施例3相較於包含(D)成分以及(E)成分但不包含(B)成分之參考例3,可知表現出高黏度且優異的滲透性。依據上述,本申請發明藉由包含(A)~(C)成分可得到具有低溫硬化性且優異滲透性之硬化性樹脂組成物,藉由適宜地包含(D)成分或(E)成分,可得到具有更優異滲透性及低溫硬化性之硬化性樹脂組成物。
[產業利用性]
本發明之硬化性樹脂組成物,具有低溫硬化性,且滲透性優異,故可有效地適用於作為填充小型部件之間隙所使用之接著劑、密封劑、灌封劑等各種領域中。
本申請案係依據2021年3月2日申請之日本專利申請案第2021-032251號,參照其揭示內容而作為整體引用。
Claims (10)
- 一種硬化性樹脂組成物,包含下列之(A)~(C)成分,且在25℃之黏度為10Pa・s以下: (A)成分:具有2個以上環氧基之化合物; (B)成分:經苯基胺基矽烷處理之二氧化矽;以及 (C)成分:使(A)成分硬化之化合物。
- 如請求項1所述之硬化性樹脂組成物,其中,前述(A)成分為具有雙酚骨架之化合物。
- 如請求項1或2所述之硬化性樹脂組成物,其中,前述(C)成分為胺加成物系潛在性硬化劑。
- 如請求項1至3中任一項所述之硬化性樹脂組成物,其中,前述(C)成分之軟化點或熔點為150℃以下。
- 如請求項1至4中任一項所述之硬化性樹脂組成物,進一步包含反應性稀釋劑作為(D)成分。
- 如請求項5所述之硬化性樹脂組成物,其中,前述反應性稀釋劑為具有芳香環之環氧化合物。
- 如請求項1至6中任一項所述之硬化性樹脂組成物,進一步包含硫醇硬化劑作為(E)成分。
- 如請求項7所述之硬化性樹脂組成物,其中,前述硫醇硬化劑為不含酯鍵之硫醇硬化劑。
- 如請求項1至8中任一項所述之硬化性樹脂組成物,係用於包含鎳之被著體。
- 一種硬化物,係如請求項1至9中任一項所述之硬化性樹脂組成物之硬化物。
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