TW202231767A - 密封用樹脂組成物及半導體裝置 - Google Patents

密封用樹脂組成物及半導體裝置 Download PDF

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Publication number
TW202231767A
TW202231767A TW110144835A TW110144835A TW202231767A TW 202231767 A TW202231767 A TW 202231767A TW 110144835 A TW110144835 A TW 110144835A TW 110144835 A TW110144835 A TW 110144835A TW 202231767 A TW202231767 A TW 202231767A
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TW
Taiwan
Prior art keywords
resin composition
sealing
mass
mpa
sealing resin
Prior art date
Application number
TW110144835A
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English (en)
Chinese (zh)
Inventor
河村信哉
Original Assignee
日商住友電木股份有限公司
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Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202231767A publication Critical patent/TW202231767A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110144835A 2020-12-03 2021-12-01 密封用樹脂組成物及半導體裝置 TW202231767A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020200901 2020-12-03
JPJP2020-200901 2020-12-03

Publications (1)

Publication Number Publication Date
TW202231767A true TW202231767A (zh) 2022-08-16

Family

ID=81853884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110144835A TW202231767A (zh) 2020-12-03 2021-12-01 密封用樹脂組成物及半導體裝置

Country Status (5)

Country Link
JP (2) JP7681032B2 (https=)
KR (1) KR20230112671A (https=)
CN (1) CN116670821A (https=)
TW (1) TW202231767A (https=)
WO (1) WO2022118749A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225118A (ja) 1985-07-25 1987-02-03 Toshiba Chem Corp 封止用樹脂組成物
JP5250801B2 (ja) 2008-09-11 2013-07-31 日東電工株式会社 半導体封止用樹脂組成物およびそれを用いた半導体装置
US8502399B2 (en) * 2009-06-22 2013-08-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor and semiconductor device
MY157584A (en) * 2009-10-20 2016-06-30 Sumitomo Bakelite Co Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent
KR101748897B1 (ko) * 2009-11-24 2017-06-19 스미토모 베이클리트 컴퍼니 리미티드 유동 특성 측정용 금형, 유동 특성 측정 방법, 반도체 봉지용 수지 조성물 및 반도체 장치의 제조 방법
JP5301597B2 (ja) * 2011-03-14 2013-09-25 株式会社日本触媒 硬化性樹脂組成物およびこれを用いた半導体装置
WO2014203781A1 (ja) * 2013-06-21 2014-12-24 住友ベークライト株式会社 半導体封止用樹脂組成物および半導体装置
JP6227954B2 (ja) * 2013-09-26 2017-11-08 株式会社日本触媒 硬化性樹脂組成物及びその用途
JP6794626B2 (ja) * 2015-12-14 2020-12-02 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
WO2019131379A1 (ja) * 2017-12-25 2019-07-04 住友ベークライト株式会社 電子装置の製造方法
CN110437764B (zh) * 2019-08-16 2021-06-29 石家庄正旭环保建材有限公司 一种树脂改性淀粉粘合剂及其制备方法
CN111423618B (zh) * 2020-05-20 2021-07-06 中国科学技术大学 一种氮杂环芳香胺-金属离子络合物阻燃剂及其在制备阻燃环氧树脂中的应用

Also Published As

Publication number Publication date
JP2023116574A (ja) 2023-08-22
JPWO2022118749A1 (https=) 2022-06-09
KR20230112671A (ko) 2023-07-27
CN116670821A (zh) 2023-08-29
JP7681032B2 (ja) 2025-05-21
WO2022118749A1 (ja) 2022-06-09

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