JP7681032B2 - 封止用樹脂組成物および半導体装置 - Google Patents

封止用樹脂組成物および半導体装置 Download PDF

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Publication number
JP7681032B2
JP7681032B2 JP2022549774A JP2022549774A JP7681032B2 JP 7681032 B2 JP7681032 B2 JP 7681032B2 JP 2022549774 A JP2022549774 A JP 2022549774A JP 2022549774 A JP2022549774 A JP 2022549774A JP 7681032 B2 JP7681032 B2 JP 7681032B2
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Prior art keywords
resin composition
encapsulating resin
epoxy resins
composition according
encapsulating
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Japanese (ja)
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JPWO2022118749A1 (https=
JPWO2022118749A5 (https=
Inventor
信哉 河村
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority to JP2023091529A priority Critical patent/JP2023116574A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022549774A 2020-12-03 2021-11-26 封止用樹脂組成物および半導体装置 Active JP7681032B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023091529A JP2023116574A (ja) 2020-12-03 2023-06-02 封止用樹脂組成物および半導体装置

Applications Claiming Priority (3)

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JP2020200901 2020-12-03
JP2020200901 2020-12-03
PCT/JP2021/043352 WO2022118749A1 (ja) 2020-12-03 2021-11-26 封止用樹脂組成物および半導体装置

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JP2023091529A Division JP2023116574A (ja) 2020-12-03 2023-06-02 封止用樹脂組成物および半導体装置

Publications (3)

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JPWO2022118749A1 JPWO2022118749A1 (https=) 2022-06-09
JPWO2022118749A5 JPWO2022118749A5 (https=) 2022-11-16
JP7681032B2 true JP7681032B2 (ja) 2025-05-21

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JP2022549774A Active JP7681032B2 (ja) 2020-12-03 2021-11-26 封止用樹脂組成物および半導体装置
JP2023091529A Pending JP2023116574A (ja) 2020-12-03 2023-06-02 封止用樹脂組成物および半導体装置

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JP2023091529A Pending JP2023116574A (ja) 2020-12-03 2023-06-02 封止用樹脂組成物および半導体装置

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Country Link
JP (2) JP7681032B2 (https=)
KR (1) KR20230112671A (https=)
CN (1) CN116670821A (https=)
TW (1) TW202231767A (https=)
WO (1) WO2022118749A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012188629A (ja) 2011-03-14 2012-10-04 Nippon Shokubai Co Ltd 硬化性樹脂組成物およびこれを用いた半導体装置
JP2017110051A (ja) 2015-12-14 2017-06-22 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225118A (ja) 1985-07-25 1987-02-03 Toshiba Chem Corp 封止用樹脂組成物
JP5250801B2 (ja) 2008-09-11 2013-07-31 日東電工株式会社 半導体封止用樹脂組成物およびそれを用いた半導体装置
US8502399B2 (en) * 2009-06-22 2013-08-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor and semiconductor device
MY157584A (en) * 2009-10-20 2016-06-30 Sumitomo Bakelite Co Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent
KR101748897B1 (ko) * 2009-11-24 2017-06-19 스미토모 베이클리트 컴퍼니 리미티드 유동 특성 측정용 금형, 유동 특성 측정 방법, 반도체 봉지용 수지 조성물 및 반도체 장치의 제조 방법
WO2014203781A1 (ja) * 2013-06-21 2014-12-24 住友ベークライト株式会社 半導体封止用樹脂組成物および半導体装置
JP6227954B2 (ja) * 2013-09-26 2017-11-08 株式会社日本触媒 硬化性樹脂組成物及びその用途
WO2019131379A1 (ja) * 2017-12-25 2019-07-04 住友ベークライト株式会社 電子装置の製造方法
CN110437764B (zh) * 2019-08-16 2021-06-29 石家庄正旭环保建材有限公司 一种树脂改性淀粉粘合剂及其制备方法
CN111423618B (zh) * 2020-05-20 2021-07-06 中国科学技术大学 一种氮杂环芳香胺-金属离子络合物阻燃剂及其在制备阻燃环氧树脂中的应用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012188629A (ja) 2011-03-14 2012-10-04 Nippon Shokubai Co Ltd 硬化性樹脂組成物およびこれを用いた半導体装置
JP2017110051A (ja) 2015-12-14 2017-06-22 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット

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Publication number Publication date
JP2023116574A (ja) 2023-08-22
JPWO2022118749A1 (https=) 2022-06-09
TW202231767A (zh) 2022-08-16
KR20230112671A (ko) 2023-07-27
CN116670821A (zh) 2023-08-29
WO2022118749A1 (ja) 2022-06-09

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