WO2014203781A1 - 半導体封止用樹脂組成物および半導体装置 - Google Patents
半導体封止用樹脂組成物および半導体装置 Download PDFInfo
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- WO2014203781A1 WO2014203781A1 PCT/JP2014/065461 JP2014065461W WO2014203781A1 WO 2014203781 A1 WO2014203781 A1 WO 2014203781A1 JP 2014065461 W JP2014065461 W JP 2014065461W WO 2014203781 A1 WO2014203781 A1 WO 2014203781A1
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Images
Classifications
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Abstract
Description
本願は、2013年6月21日に日本に出願された特願2013-131198号に基づき優先権を主張し、その内容をここに援用する。
(1) 下記一般式(1)で表されるマレイミド系化合物と、
下記一般式(2-1)および下記一般式(2-2)で表されるベンゾオキサジン系化合物のうちの少なくとも1種と、
硬化触媒と、
無機充填材とを含有することを特徴とする半導体封止用樹脂組成物。
図1は、本発明の半導体封止用樹脂組成物を用いた半導体装置の一例を示す縦断面図である。なお、以下の説明では、図1中の上側を「上」、下側を「下」と言う。
このリード40のダイパッド30と反対側の端部は、モールド部50から突出(露出)している。
この接着層60は、特に限定されないが、例えば、エポキシ系接着剤、アクリル系接着剤、ポリイミド系接着剤およびシアネート系接着剤等の各種接着剤を用いて形成される。
本発明の半導体封止用樹脂組成物(ポリベンゾオキサジン変性マレイミド樹脂組成物)は、下記一般式(1)で表されるマレイミド系化合物と、下記一般式(2-1)および下記一般式(2-2)で表されるベンゾオキサジン系化合物のうちの少なくとも1種と、硬化触媒と、無機充填材とを含有するものである。
マレイミド系化合物は、前記一般式(1)で表される化合物(以下、単に「化合物(1)」と言うこともある。)で構成されるものであり、樹脂組成物に含まれる主材料のうちの1つである。
ベンゾオキサジン系化合物は、前記一般式(2-1)で表される化合物(以下、単に「化合物(2-1)」と言うこともある。)および前記一般式(2-2)で表される化合物(以下、単に「化合物(2-2)」と言うこともある。)のうちの少なくとも1種で構成されるものであり、樹脂組成物に含まれる主材料のうちの1つである。
硬化触媒は、樹脂組成物に含まれる主材料のうちの1つであり、前記一般式(1)で表されるマレイミド系化合物と、前記一般式(2-1)および前記一般式(2-2)で表されるベンゾオキサジン系化合物のうちの少なくとも1種との重合反応を促進する触媒(硬化促進剤)としての機能を有するものである。
無機充填材は、樹脂組成物に含まれる主材料のうちの1つであり、樹脂組成物の吸湿量の増加や、強度の低下を低減する機能を有するものである。
また、樹脂組成物中の無機充填材の量の上限値は、樹脂組成物の全質量に対して、好ましくは93質量%以下であり、より好ましくは91質量%以下であり、さらに好ましくは90質量%以下である。上限値が上記範囲内であると、得られる樹脂組成物は良好な流動性を有するとともに、良好な成形性を備える。
これらの中でも、無機充填材の量は、樹脂組成物の全質量に対して、65質量%以上93質量%以下であることが好ましく、70質量%以上90質量%以下であることがより好ましい。
また、本発明の半導体封止用樹脂組成物には、上記一般式(1)で表されるマレイミド系化合物と、上記一般式(2-1)および上記一般式(2-2)で表されるベンゾオキサジン系化合物のうちの少なくとも1種と、硬化触媒と、無機充填材の他に、更に必要に応じて、以下に示すようなその他の成分が含まれていてもよい。
密着助剤は、樹脂組成物を硬化させることにより得られる硬化物で構成されるモールド部50と、半導体装置10におけるモールド部50以外の他の部材との密着性を向上させる機能を有するものである。
カップリング剤は、樹脂組成物中に含まれる樹脂成分と無機充填材との密着性を向上させ機能を有するものであり、例えば、シランカップリング剤等が用いられる。
<半導体封止用樹脂組成物の製造方法>
図2は、半導体封止用樹脂組成物の製造方法の一例を示す工程概略図である。
(混練工程)
本工程は、上記一般式(1)で表されるマレイミド系化合物と、上記一般式(2-1)および上記一般式(2-2)で表されるベンゾオキサジン系化合物のうちの少なくとも1種と、硬化触媒と、無機充填材と、必要に応じてその他の化合物とを混合(分散混合)、加熱溶融、混練することにより混練物を得る工程である。
<1> まず、上述した樹脂組成物の構成材料、すなわち、上記一般式(1)で表されるマレイミド系化合物と、上記一般式(2-1)および上記一般式(2-2)で表されるベンゾオキサジン系化合物のうちの少なくとも1種と、硬化触媒と、無機充填材とについて所定量秤量し、これらを配合することで組成分を調製する。そして、この組成分を、例えば、ミキサー、ジェットミルおよびボールミル等を用いて常温で均一に粉砕、混合(分散混合)する。
本工程は、混練工程で得られた前記混練物を粉砕することにより、粉体で構成される樹脂組成物(粉砕物とされた混練物)を得る工程である。
本工程は、粉砕工程で得られた粉体で構成される樹脂組成物を成形(樹脂成形体成形)してタブレット状とすることにより、タブレット(樹脂成形体)で構成される樹脂組成物を得る工程である。
半導体装置の製造方法には、上述した樹脂組成物で構成される粉体およびタブレットのうちの何れをも用いることができる。
なお、本発明はこれらの実施例の記載に何ら限定されるものではない。
1.原材料の準備
まず、各実施例および比較例の樹脂組成物で用いた原材料を以下に示す。
なお、特に記載しない限り、各成分の配合量は、質量部とする。
マレイミド系化合物(BMI)1として、前記式(1a)で表される化合物を用意した。なお、かかる化合物のn1が平均で1.6、質量平均分子量は654、マレイミド当量は182g/eqである。
マレイミド系化合物(BMI)2として、下記式(1a')で表される化合物を用意した。なお、かかる化合物の分子量は358、マレイミド当量は179g/eqである。
ベンゾオキサジン系化合物(P-d型ベンゾオキサジン)1として、前記式(2-1a)で表される化合物を用意した。なお、かかる化合物の分子量は434、ベンゾオキサジン当量は217g/eqである。
ベンゾオキサジン系化合物(F-a型ベンゾオキサジン)2として、下記式(4)で表される化合物を用意した。なお、かかる化合物の分子量は436、ベンゾオキサジン当量は218g/eqである。
エポキシ系化合物1として、テトラメチルビフェニル型エポキシ樹脂(三菱化学(株)製、YX4000K、エポキシ当量185g/eq)を用意した。
フェノール系化合物1として、フェノールノボラック型フェノール樹脂(住友ベークライト(株)製、PR-51714、水酸基当量104g/eq)を用意した。
イミダゾール系化合物1として、2-メチルイミダゾールを用意した。
イミダゾール系化合物2として、2-ウンデシルイミダゾールを用意した。
密着助剤1として、3-アミノ-5-メルカプト-1,2,4-トリアゾールを用意した。
密着助剤2として、4-アミノ-1,2,3-トリアゾールを用意した。
無機充填材1として、溶融球状シリカ(平均粒径30μm)を用意した。
シランカップリング剤1として、γ-メルカプトプロピルトリメトキシシランを用意した。
[実施例1]
まず、マレイミド系化合物1(71.43質量部)、ベンゾオキサジン系化合物1(28.57質量部)と、イミダゾール系化合物1(1.00質量部)、無機充填材1(365.00質量部)、密着助剤1(1.00質量部)、シランカップリング剤1(0.50質量部)をそれぞれ秤量し、これらをミキサーを用いて混合した後、ロールを用いて100℃、5分混練することにより混練物を得た。次いで、この混練物を、冷却後粉砕することで、粉体で構成される実施例1の樹脂組成物を得た。
マレイミド系化合物、ベンゾオキサジン系化合物、硬化触媒、密着助剤、無機充填材、シランカップリング剤の種類および秤量する量を第1表に示すように変更したこと以外は前記実施例1と同様にして、実施例2~10、比較例1、2の樹脂組成物を得た。
マレイミド系化合物1(71.43質量部)およびベンゾオキサジン系化合物1(28.57質量部)に代えて、エポキシ系化合物1(64.00質量部)、フェノール系化合物1(36.00質量部)を添加するようにしたこと以外は前記実施例1と同様にして、比較例3の樹脂組成物を得た。
無機充填材1(365.00質量部)の添加を省略するようにしたこと以外は前記実施例1と同様にして、比較例4の樹脂組成物を得た。
得られた各実施例および比較例の樹脂組成物を、以下の方法で評価した。
3-1.弾性率の評価
低圧トランスファー成形機(コータキ精機社製、「KTS-30」)を用いて、金型温度200℃、注入圧力9.8MPa、硬化時間120sの条件で、各実施例および比較例の樹脂組成物を注入成形して、10mm×55mm、厚さ1.6mmに成形し、250℃で4時間硬化させることで各実施例および比較例の試験片を作製した。
低圧トランスファー成形機(コータキ精機社製、「KTS-30」)を用いて、金型温度200℃、注入圧力9.8MPa、硬化時間120sの条件で、各実施例および比較例の樹脂組成物を注入成形して、10mm×55mm、厚さ1.6mmに成形し、250℃で4時間硬化させた後に粉砕することで各実施例および比較例の試験サンプルを作製した。
低圧トランスファー成形機(コータキ精機(株)製、KTS-15)を用いて、EMMI-1-66に準じたスパイラルフロー測定用の金型に、金型温度200℃、注入圧力6.9MPa、保圧時間120秒の条件で各実施例および比較例の封止樹脂組成物を注入、硬化させ、スパイラルフローを測定した。
硬化性の評価としてゲルタイムの評価を実施した。各実施例および比較例の樹脂組成物を表面温度200℃の熱板上においてからタックフリーになるまでの時間を測定しゲルタイムとした。
低圧トランスファー成形機(コータキ精機社製、「KTS-30」)を用いて、金型温度200℃、注入圧力9.8MPa、硬化時間120sで160ピンLQFP(パッケージサイズは24mm×24mm、厚み1.4mm、SiCチップサイズは7.0mm×7.0mm、リードフレームはCu製)を成形し、250℃で4時間硬化させることでテスト用素子を作製した。封止したテスト用素子を、-65℃~250℃で500サイクルまたは1000サイクル繰り返し、パッケージクラックや部材間剥離の有無を判定した(不良数/サンプル数)。
3-5と同様の方法で作製したテスト用素子を、250℃で500時間または1000時間連続で加熱処理をし、パッケージクラックや部材間剥離の有無を判定した(不良数/サンプル数)。
20 半導体チップ
21 電極パッド
22 ワイヤー
30 ダイパッド
40 リード
50 モールド部(半導体封止材)
60 接着層
Claims (12)
- 下記一般式(1)で表されるマレイミド系化合物と、
下記一般式(2-1)および下記一般式(2-2)で表されるベンゾオキサジン系化合物のうちの少なくとも1種と、
硬化触媒と、
無機充填材とを含有することを特徴とする半導体封止用樹脂組成物。
前記一般式(1)、(2-1)、(2-2)中、X2、X3、およびX4は、それぞれ独立に、炭素数1~10のアルキレン基、下記一般式(3)で表される基、式「-SO2-」もしくは「-CO-」で表される基、酸素原子、または単結合である。R2、R3、およびR4は、それぞれ独立に、炭素数1~6の炭化水素基である。b、dおよびeは、それぞれ独立に、0~4の整数、cは、0~3の整数である。n1は、1以上の整数である。
- 前記一般式(1)における前記n1は、1~4である請求項1に記載の半導体封止用樹脂組成物。
- 前記一般式(1)で表されるマレイミド系化合物と、前記ベンゾオキサジン系化合物との配合比率は、当量比で1:0.1~1:4である請求項1または2に記載の半導体封止用樹脂組成物。
- 前記硬化触媒は、イミダゾール系化合物である請求項1ないし3のいずれか1項に記載の半導体封止用樹脂組成物。
- 前記硬化触媒の含有量は、前記マレイミド系化合物と前記ベンゾオキサジン系化合物との合計100質量部に対して、0.1~5.0質量部である請求項1ないし4のいずれか1項に記載の半導体封止用樹脂組成物。
- 当該半導体封止用樹脂組成物を硬化させることにより得られる硬化物の25℃における弾性率をA[GPa]とし、前記硬化物の250℃における弾性率をB[GPa]としたとき、0.1≦(A-B)/A≦0.9なる関係を満足する請求項1ないし5のいずれか1項に記載の半導体封止用樹脂組成物。
- 当該半導体封止用樹脂組成物を硬化させることにより得られる硬化物は、その25℃における弾性率Aが10~50GPaである請求項1ないし6のいずれか1項に記載の半導体封止用樹脂組成物。
- 当該半導体封止用樹脂組成物を硬化させることにより得られる硬化物は、その250℃における弾性率Bが1~30GPaである請求項1ないし7のいずれか1項に記載の半導体封止用樹脂組成物。
- 当該半導体封止用樹脂組成物を硬化させることにより得られる硬化物は、その5%減量温度Td5が450℃以上である請求項1ないし8のいずれか1項に記載の半導体封止用樹脂組成物。
- 密着助剤を更に含有する請求項1ないし9のいずれか1項に記載の半導体封止用樹脂組成物。
- 請求項1ないし10のいずれか1項に記載の半導体封止用樹脂組成物の硬化物により、半導体素子を封止してなるものであることを特徴とする半導体装置。
- 前記半導体素子がSiC(炭化ケイ素)および/またはGaN(窒化ガリウム)を用いたものである請求項11に記載の半導体装置。
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