CN116670821A - 密封用树脂组合物和半导体装置 - Google Patents

密封用树脂组合物和半导体装置 Download PDF

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Publication number
CN116670821A
CN116670821A CN202180081746.8A CN202180081746A CN116670821A CN 116670821 A CN116670821 A CN 116670821A CN 202180081746 A CN202180081746 A CN 202180081746A CN 116670821 A CN116670821 A CN 116670821A
Authority
CN
China
Prior art keywords
resin composition
sealing resin
sealing
mass
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180081746.8A
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English (en)
Chinese (zh)
Inventor
河村信哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN116670821A publication Critical patent/CN116670821A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180081746.8A 2020-12-03 2021-11-26 密封用树脂组合物和半导体装置 Pending CN116670821A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-200901 2020-12-03
JP2020200901 2020-12-03
PCT/JP2021/043352 WO2022118749A1 (ja) 2020-12-03 2021-11-26 封止用樹脂組成物および半導体装置

Publications (1)

Publication Number Publication Date
CN116670821A true CN116670821A (zh) 2023-08-29

Family

ID=81853884

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180081746.8A Pending CN116670821A (zh) 2020-12-03 2021-11-26 密封用树脂组合物和半导体装置

Country Status (5)

Country Link
JP (2) JP7681032B2 (https=)
KR (1) KR20230112671A (https=)
CN (1) CN116670821A (https=)
TW (1) TW202231767A (https=)
WO (1) WO2022118749A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010065160A (ja) * 2008-09-11 2010-03-25 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2015067618A (ja) * 2013-09-26 2015-04-13 株式会社日本触媒 硬化性樹脂組成物及びその用途
CN105308119A (zh) * 2013-06-21 2016-02-03 住友电木株式会社 半导体密封用树脂组合物和半导体装置
JP2017110051A (ja) * 2015-12-14 2017-06-22 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
CN111423618A (zh) * 2020-05-20 2020-07-17 中国科学技术大学 一种氮杂环芳香胺-金属离子络合物阻燃剂及其在制备阻燃环氧树脂中的应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225118A (ja) 1985-07-25 1987-02-03 Toshiba Chem Corp 封止用樹脂組成物
US8502399B2 (en) * 2009-06-22 2013-08-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor and semiconductor device
MY157584A (en) * 2009-10-20 2016-06-30 Sumitomo Bakelite Co Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent
KR101748897B1 (ko) * 2009-11-24 2017-06-19 스미토모 베이클리트 컴퍼니 리미티드 유동 특성 측정용 금형, 유동 특성 측정 방법, 반도체 봉지용 수지 조성물 및 반도체 장치의 제조 방법
JP5301597B2 (ja) * 2011-03-14 2013-09-25 株式会社日本触媒 硬化性樹脂組成物およびこれを用いた半導体装置
WO2019131379A1 (ja) * 2017-12-25 2019-07-04 住友ベークライト株式会社 電子装置の製造方法
CN110437764B (zh) * 2019-08-16 2021-06-29 石家庄正旭环保建材有限公司 一种树脂改性淀粉粘合剂及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010065160A (ja) * 2008-09-11 2010-03-25 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
CN105308119A (zh) * 2013-06-21 2016-02-03 住友电木株式会社 半导体密封用树脂组合物和半导体装置
JP2015067618A (ja) * 2013-09-26 2015-04-13 株式会社日本触媒 硬化性樹脂組成物及びその用途
JP2017110051A (ja) * 2015-12-14 2017-06-22 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
CN111423618A (zh) * 2020-05-20 2020-07-17 中国科学技术大学 一种氮杂环芳香胺-金属离子络合物阻燃剂及其在制备阻燃环氧树脂中的应用

Also Published As

Publication number Publication date
JP2023116574A (ja) 2023-08-22
JPWO2022118749A1 (https=) 2022-06-09
TW202231767A (zh) 2022-08-16
KR20230112671A (ko) 2023-07-27
JP7681032B2 (ja) 2025-05-21
WO2022118749A1 (ja) 2022-06-09

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