TW202144519A - 黏著性積層膜及電子裝置的製造方法 - Google Patents

黏著性積層膜及電子裝置的製造方法 Download PDF

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Publication number
TW202144519A
TW202144519A TW110118193A TW110118193A TW202144519A TW 202144519 A TW202144519 A TW 202144519A TW 110118193 A TW110118193 A TW 110118193A TW 110118193 A TW110118193 A TW 110118193A TW 202144519 A TW202144519 A TW 202144519A
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TW
Taiwan
Prior art keywords
adhesive
resin layer
laminated film
ethylene
electronic component
Prior art date
Application number
TW110118193A
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English (en)
Chinese (zh)
Inventor
畦﨑崇
甲斐喬士
室伏貴信
木下仁
Original Assignee
日商三井化學東賽璐股份有限公司
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Application filed by 日商三井化學東賽璐股份有限公司 filed Critical 日商三井化學東賽璐股份有限公司
Publication of TW202144519A publication Critical patent/TW202144519A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
TW110118193A 2020-05-22 2021-05-20 黏著性積層膜及電子裝置的製造方法 TW202144519A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-089610 2020-05-22
JP2020089610 2020-05-22

Publications (1)

Publication Number Publication Date
TW202144519A true TW202144519A (zh) 2021-12-01

Family

ID=78708528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110118193A TW202144519A (zh) 2020-05-22 2021-05-20 黏著性積層膜及電子裝置的製造方法

Country Status (5)

Country Link
JP (1) JP7464706B2 (ja)
KR (1) KR20220152328A (ja)
CN (1) CN115605556B (ja)
TW (1) TW202144519A (ja)
WO (1) WO2021235389A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022224900A1 (ja) * 2021-04-20 2022-10-27

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5318435B2 (ja) * 2008-02-29 2013-10-16 日東電工株式会社 半導体ウエハの裏面研削用粘着シート及びこの裏面研削用粘着シートを用いる半導体ウエハの裏面研削方法
CN102844393B (zh) * 2010-04-13 2014-06-18 东丽薄膜先端加工股份有限公司 表面保护膜
SG182382A1 (en) * 2010-06-02 2012-08-30 Mitsui Chemicals Tohcello Inc Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
JP2012054431A (ja) * 2010-09-01 2012-03-15 Nitto Denko Corp 半導体ウエハ保護用粘着シート
US9475962B2 (en) * 2013-03-26 2016-10-25 Mitsui Chemicals Tohcello, Inc. Production method for laminate film, laminate film, and production method for semiconductor device employing same
KR20160077076A (ko) * 2013-10-30 2016-07-01 린텍 가부시키가이샤 반도체 접합용 접착 시트 및 반도체 장치의 제조 방법
JP6571398B2 (ja) 2015-06-04 2019-09-04 リンテック株式会社 半導体用保護フィルム、半導体装置及び複合シート
TWI684524B (zh) * 2015-10-05 2020-02-11 日商琳得科股份有限公司 半導體加工用薄片
KR102162905B1 (ko) * 2016-03-31 2020-10-07 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 웨이퍼 가공용 점착성 필름
JP6715109B2 (ja) * 2016-06-30 2020-07-01 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム
JP6893558B2 (ja) * 2017-07-20 2021-06-23 三井化学東セロ株式会社 電子装置の製造方法
EP3657923A4 (en) * 2017-07-20 2021-05-05 Mitsui Chemicals Tohcello, Inc. ELECTRONIC DEVICE MANUFACTURING PROCESS
JP7049797B2 (ja) * 2017-09-29 2022-04-07 三井化学東セロ株式会社 粘着性フィルム
JP7092526B2 (ja) * 2018-03-14 2022-06-28 マクセル株式会社 バックグラインド用粘着テープ
EP3786246A4 (en) * 2018-04-24 2022-01-19 Mitsui Chemicals Tohcello, Inc. SELF-ADHESIVE FILM AND ELECTRONIC DEVICE PRODUCTION METHOD
KR20200024591A (ko) * 2018-08-28 2020-03-09 주식회사 엘지화학 백 그라인딩 테이프
JP7146931B2 (ja) * 2018-09-20 2022-10-04 三井化学東セロ株式会社 電子装置の製造方法
US20220148905A1 (en) * 2019-02-26 2022-05-12 Disco Corporation Back grinding adhesive sheet, and method for manufacturing semiconductor wafer
JP6803498B1 (ja) * 2019-03-29 2020-12-23 三井化学東セロ株式会社 電子装置の製造方法

Also Published As

Publication number Publication date
CN115605556A (zh) 2023-01-13
JP7464706B2 (ja) 2024-04-09
KR20220152328A (ko) 2022-11-15
WO2021235389A1 (ja) 2021-11-25
JPWO2021235389A1 (ja) 2021-11-25
CN115605556B (zh) 2024-03-12

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