JPWO2021235389A1 - - Google Patents

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Publication number
JPWO2021235389A1
JPWO2021235389A1 JP2022524459A JP2022524459A JPWO2021235389A1 JP WO2021235389 A1 JPWO2021235389 A1 JP WO2021235389A1 JP 2022524459 A JP2022524459 A JP 2022524459A JP 2022524459 A JP2022524459 A JP 2022524459A JP WO2021235389 A1 JPWO2021235389 A1 JP WO2021235389A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022524459A
Other versions
JP7464706B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021235389A1 publication Critical patent/JPWO2021235389A1/ja
Application granted granted Critical
Publication of JP7464706B2 publication Critical patent/JP7464706B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
JP2022524459A 2020-05-22 2021-05-17 電子装置の製造方法 Active JP7464706B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020089610 2020-05-22
JP2020089610 2020-05-22
PCT/JP2021/018599 WO2021235389A1 (ja) 2020-05-22 2021-05-17 粘着性積層フィルムおよび電子装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021235389A1 true JPWO2021235389A1 (ja) 2021-11-25
JP7464706B2 JP7464706B2 (ja) 2024-04-09

Family

ID=78708528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524459A Active JP7464706B2 (ja) 2020-05-22 2021-05-17 電子装置の製造方法

Country Status (5)

Country Link
JP (1) JP7464706B2 (ja)
KR (1) KR20220152328A (ja)
CN (1) CN115605556B (ja)
TW (1) TW202144519A (ja)
WO (1) WO2021235389A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022224900A1 (ja) * 2021-04-20 2022-10-27

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017061132A1 (ja) * 2015-10-05 2017-04-13 リンテック株式会社 半導体加工用シート
WO2017169958A1 (ja) * 2016-03-31 2017-10-05 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム
JP2018006540A (ja) * 2016-06-30 2018-01-11 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム
WO2019017226A1 (ja) * 2017-07-20 2019-01-24 三井化学東セロ株式会社 電子装置の製造方法
WO2019017225A1 (ja) * 2017-07-20 2019-01-24 三井化学東セロ株式会社 電子装置の製造方法
JP2019161031A (ja) * 2018-03-14 2019-09-19 マクセルホールディングス株式会社 バックグラインド用粘着テープ
KR20200024591A (ko) * 2018-08-28 2020-03-09 주식회사 엘지화학 백 그라인딩 테이프
WO2020059572A1 (ja) * 2018-09-20 2020-03-26 三井化学東セロ株式会社 電子装置の製造方法
WO2020175364A1 (ja) * 2019-02-26 2020-09-03 株式会社ディスコ 裏面研削用粘着シート及び半導体ウエハの製造方法
WO2020203089A1 (ja) * 2019-03-29 2020-10-08 三井化学東セロ株式会社 電子装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5318435B2 (ja) * 2008-02-29 2013-10-16 日東電工株式会社 半導体ウエハの裏面研削用粘着シート及びこの裏面研削用粘着シートを用いる半導体ウエハの裏面研削方法
WO2011129167A1 (ja) * 2010-04-13 2011-10-20 東レフィルム加工株式会社 表面保護フィルム
MY165350A (en) * 2010-06-02 2018-03-21 Mitsui Chemicals Tohcello Inc Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
JP2012054431A (ja) * 2010-09-01 2012-03-15 Nitto Denko Corp 半導体ウエハ保護用粘着シート
US9475962B2 (en) * 2013-03-26 2016-10-25 Mitsui Chemicals Tohcello, Inc. Production method for laminate film, laminate film, and production method for semiconductor device employing same
JPWO2015064574A1 (ja) * 2013-10-30 2017-03-09 リンテック株式会社 半導体接合用接着シートおよび半導体装置の製造方法
JP6571398B2 (ja) 2015-06-04 2019-09-04 リンテック株式会社 半導体用保護フィルム、半導体装置及び複合シート
JP7049797B2 (ja) * 2017-09-29 2022-04-07 三井化学東セロ株式会社 粘着性フィルム
KR102498684B1 (ko) * 2018-04-24 2023-02-09 미쓰이 가가쿠 토세로 가부시키가이샤 점착성 필름 및 전자 장치의 제조 방법

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017061132A1 (ja) * 2015-10-05 2017-04-13 リンテック株式会社 半導体加工用シート
WO2017169958A1 (ja) * 2016-03-31 2017-10-05 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム
JP2018006540A (ja) * 2016-06-30 2018-01-11 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム
WO2019017226A1 (ja) * 2017-07-20 2019-01-24 三井化学東セロ株式会社 電子装置の製造方法
WO2019017225A1 (ja) * 2017-07-20 2019-01-24 三井化学東セロ株式会社 電子装置の製造方法
JP2019161031A (ja) * 2018-03-14 2019-09-19 マクセルホールディングス株式会社 バックグラインド用粘着テープ
KR20200024591A (ko) * 2018-08-28 2020-03-09 주식회사 엘지화학 백 그라인딩 테이프
WO2020059572A1 (ja) * 2018-09-20 2020-03-26 三井化学東セロ株式会社 電子装置の製造方法
WO2020175364A1 (ja) * 2019-02-26 2020-09-03 株式会社ディスコ 裏面研削用粘着シート及び半導体ウエハの製造方法
WO2020203089A1 (ja) * 2019-03-29 2020-10-08 三井化学東セロ株式会社 電子装置の製造方法

Also Published As

Publication number Publication date
JP7464706B2 (ja) 2024-04-09
CN115605556A (zh) 2023-01-13
TW202144519A (zh) 2021-12-01
WO2021235389A1 (ja) 2021-11-25
KR20220152328A (ko) 2022-11-15
CN115605556B (zh) 2024-03-12

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