TW202131578A - Inspection socket comprising signal terminals received in a receiving part of a first casing and an insulation portion insulating between the signal terminals and the first casing - Google Patents
Inspection socket comprising signal terminals received in a receiving part of a first casing and an insulation portion insulating between the signal terminals and the first casing Download PDFInfo
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- TW202131578A TW202131578A TW110103011A TW110103011A TW202131578A TW 202131578 A TW202131578 A TW 202131578A TW 110103011 A TW110103011 A TW 110103011A TW 110103011 A TW110103011 A TW 110103011A TW 202131578 A TW202131578 A TW 202131578A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2844—Fault-finding or characterising using test interfaces, e.g. adapters, test boxes, switches, PIN drivers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Abstract
Description
本揭示是有關於一種檢查插座(socket)。This disclosure is about a check socket (socket).
於相機(camera)或液晶面板(panel)等電子零件模組(module)中,通常於其製造步驟中,進行導通檢查及動作特性檢查等。該些檢查是藉由使用檢查插座,將用於與設置於電子零件模組的本體基板連接的端子、和檢查裝置的端子加以連接來進行。In electronic component modules such as cameras or liquid crystal panels, continuity inspections and operating characteristics inspections are usually performed in the manufacturing steps. These inspections are performed by using an inspection socket to connect the terminals for connecting to the main body substrate provided in the electronic component module and the terminals of the inspection device.
作為此種檢查插座,有專利文獻1所記載的檢查插座。所述檢查插座包括:絕緣性的插座本體、以及收容於插座本體的多個電極部。
[現有技術文獻]
[專利文獻]As such an inspection socket, there is an inspection socket described in
[專利文獻1]日本專利特開2002-134202號公報[Patent Document 1] Japanese Patent Laid-Open No. 2002-134202
[發明所欲解決之課題][The problem to be solved by the invention]
近年來,隨著在電子零件模組間發送/接收的資訊量的增大等,對於用於電子零件模組的檢查的檢查插座亦要求應對高頻區域的訊號。然而,於專利文獻1的檢查插座中,不可謂一定能夠充分地應對高頻區域的訊號,而在檢查電子零件模組時存在高頻區域的訊號的傳輸損失變大的情況。In recent years, with the increase in the amount of information sent/received between electronic component modules, etc., inspection sockets used for inspection of electronic component modules are also required to cope with signals in the high-frequency region. However, the inspection socket of
本揭示的目的在於提供一種能夠減小高頻區域的訊號的傳輸損失的檢查插座。 [解決課題之手段]The purpose of the present disclosure is to provide an inspection socket that can reduce the transmission loss of signals in the high-frequency region. [Means to solve the problem]
本揭示的一例的檢查插座包括: 導電性且為板狀的訊號端子,於兩端分別具有第一接點部; 導電性的第一殼體,於內部具有以所述第一接點部露出至外部的狀態收容所述訊號端子的第一收容部;以及 絕緣部,配置於所述第一收容部而將所述訊號端子與所述第一殼體之間予以絕緣。 [發明的效果]The inspection socket of an example of this disclosure includes: Conductive and plate-shaped signal terminals with first contact points at both ends respectively; The conductive first housing has a first accommodating portion for accommodating the signal terminal in a state where the first contact portion is exposed to the outside; and The insulating part is arranged in the first receiving part to insulate the signal terminal and the first housing. [Effects of the invention]
根據所述檢查插座,包括:板狀的訊號端子;導電性的第一殼體,於內部具有收容訊號端子的第一收容部;以及絕緣部,將訊號端子與第一殼體之間予以絕緣。藉由此種結構,可實現一種能夠減小高頻區域的訊號的傳輸損失的檢查插座。According to the inspection socket, the inspection socket includes: a plate-shaped signal terminal; a conductive first housing having a first receiving portion for accommodating the signal terminal inside; and an insulating portion to insulate the signal terminal from the first housing . With this structure, it is possible to realize an inspection socket that can reduce the transmission loss of signals in the high-frequency region.
以下,按照隨附圖式對本揭示的一例進行說明。再者,於以下的說明中,視需要使用表示特定的方向或位置的用語(例如包含「上」、「下」、「右」、「左」的用語),但該些用語的使用是為了容易理解參照圖式的本揭示,本揭示的技術範圍並不由該些用語的含義來限定。另外,以下的說明本質上只不過是例示,並不意圖限制本揭示、其適用物、或其用途。進而,圖式是示意性的圖,各尺寸的比率等未必與現實者一致。Hereinafter, an example of the present disclosure will be described in accordance with the accompanying drawings. Furthermore, in the following description, terms that indicate specific directions or positions (for example, terms including "up", "down", "right", and "left") are used as necessary, but these terms are used for It is easy to understand the present disclosure with reference to the drawings, and the technical scope of the present disclosure is not limited by the meaning of these terms. In addition, the following description is merely an illustration in nature, and is not intended to limit the present disclosure, its application, or its use. Furthermore, the drawing is a schematic drawing, and the ratio of each size, etc., does not necessarily match the actual one.
如圖1所示,本揭示的一實施方式的檢查插座1包括:導電性的第一殼體10、以及收容於第一殼體10的導電性的訊號端子20。又,如圖2所示,檢查插座1包括絕緣部40,所述絕緣部40於第一殼體10的內部將訊號端子20與第一殼體10之間予以絕緣。於所述實施方式中,檢查插座1作為一例而包括多個訊號端子20。各訊號端子20為利用電鑄法形成的板狀,且以板厚方向相互一致的方式配置。又,於所述實施方式中,將第一殼體10用作接地(Ground,GND)。As shown in FIG. 1, the
如圖1所示,第一殼體10為大致長方體形狀,如圖2所示,於其內部具有多個第一收容部11。於各第一收容部11,以藉由絕緣部40相對於第一殼體10電性獨立的狀態收容有一個訊號端子20,後文所述的第一接點部23經由開口部13而露出至外部。As shown in FIG. 1, the
又,如圖1及圖2所示,第一殼體10於其厚度方向的兩面的大致中央部具有多個大致圓形形狀的開口部13。各第一收容部11於第一殼體10的厚度方向(例如,圖2的上下方向。以下稱為第一方向X)上延伸,並具有配置於第一方向X的兩端的第一部分111、及配置於第一部分111之間的第二部分112。各第一部分111與開口部13連接。於構成第一部分111的各第一收容部11的內表面與訊號端子20之間,於第二方向Y上形成有間隙。第二方向Y是與第一方向X及訊號端子20的板厚方向交叉的方向。第二部分112在與第一方向X交叉的第二方向Y上的尺寸大於各第一部分111,而收容有絕緣部40。各訊號端子20經由絕緣部40而保持於第一收容部11內。In addition, as shown in FIGS. 1 and 2, the
各訊號端子20例如構成為與設置於未圖示的檢查對象物或檢查裝置的訊號線連接,而能夠傳輸高頻訊號。於所述實施方式中,如圖3所示,各訊號端子20具有:彈性部21,沿著第一方向X伸縮;以及接觸部22,分別設置於彈性部21的第一方向X的兩端。彈性部21及接觸部22沿著第一方向X串聯地配置且構成為一體。Each
彈性部21作為一例而具有蛇行形狀。具體而言,彈性部21具有:多個直線狀部211,沿著第二方向Y延伸、且於第一方向X上空開間隔地配置;以及彎曲狀部212,兩端分別與鄰接的直線狀部211的一端連接。The
各接觸部22具有於第一方向X上延伸的大致矩形板狀的本體部221。於各接觸部22在第一方向X上的靠近彈性部21的端部,設置有寬度(換言之為第二方向Y的尺寸)大於本體部221的中間部222。於本體部221與中間部222的邊界部分,設置有自本體部221沿著第二方向Y相互朝相反方向延伸的一對肩部223。又,於各接觸部22在第一方向X上的遠離彈性部21的端部(換言之為訊號端子20的第一方向X的兩端部),分別設置有第一接點部23。於所述實施方式中,各第一接點部23構成為具有於第一方向X上朝向彈性部21凹入的彎曲形狀,而能夠與未圖示的檢查裝置或檢查對象物的端子接觸。Each
如圖4所示,絕緣部40作為一例而包含絕緣性的第二殼體41。如圖2所示,第二殼體41具有大致圓柱形狀,於其內部具有:第三收容部411,能夠收容保持訊號端子20;以及開口部412、開口部413,分別設置於第一方向X的兩端,且分別與第三收容部411連接。其中一個開口部412具有能夠插入訊號端子20的彈性部21的大小。另一個開口部413小於其中一個開口部412,具有能夠插入訊號端子20的接觸部22的大小。於第三收容部411,收容有訊號端子20的彈性部21及各接觸部22的中間部222,其中一個接觸部22的肩部223與構成第三收容部411的第二殼體41的內表面接觸。又,訊號端子20的各接觸部22的本體部221的一部分經由開口部412、開口部413而露出至第二殼體41的外部。換言之,第二殼體41以第一接點部23經由開口部13而露出至外部的狀態將訊號端子20收容於內部。As shown in FIG. 4, the
根據檢查插座1,可發揮如下所述的效果。According to the
檢查插座1包括:板狀的訊號端子20;導電性的第一殼體10,於內部具有收容訊號端子20的第一收容部11;以及絕緣部40,將訊號端子20與第一殼體10之間予以絕緣。藉由此種結構,可將訊號端子20與用作接地的第一殼體10之間的距離保持為一定,因此可容易地進行阻抗(impedance)匹配。又,訊號端子20收容於導電性的第一殼體10的內部,因此可藉由屏蔽效果而抑制雜訊(noise)。其結果為,可實現能夠減小高頻區域的訊號的傳輸損失的檢查插座1。The
絕緣部40包含絕緣性的第二殼體41,所述第二殼體41以第一接點部23露出至外部的狀態將訊號端子20收容於內部。藉由此種結構,可容易地實現能夠減小高頻區域的訊號的傳輸損失的檢查插座1。The insulating
檢查插座1亦可如下述般構成。The
檢查插座1並不限定於包括多個訊號端子20的情況,只要至少包括一個訊號端子20即可。The
如圖5~圖10所示,檢查插座1可更包括至少一個接地端子30。As shown in FIGS. 5 to 10, the
於圖5~圖10中,示出包括多個檢查插座1的檢查單元2。檢查單元2包括:一對檢查插座1;基座殼體(base housing)3,收容一對檢查插座1;以及擺動構件4,以相對於配置在基座殼體3的內部的一對檢查插座1可擺動的狀態由基座殼體3予以支持。In FIGS. 5 to 10, the
如圖6所示,各檢查插座1包括第一殼體10、以及分別收容於第一殼體10的四個訊號端子20及兩個接地端子30。於各檢查插座1中,各訊號端子20及各接地端子30的板厚方向的面相互相向且於板厚方向上空開間隔地配置,四個訊號端子20位於兩個接地端子30之間。As shown in FIG. 6, each
如圖6所示,第一殼體10具有大致長方體的箱狀,如圖8所示,於第一方向X的兩端分別具有第二方向Y上的大小不同的開口部13。其中一個開口部13(例如,圖8的下側的開口部13)具有能夠插入訊號端子20及接地端子30的彈性部21、彈性部31的大小。另一個開口部13(例如,圖8的上側的開口部13)小於其中一個開口部13,具有能夠插入訊號端子20及接地端子30的接觸部22、接觸部32的大小。於各第一收容部11,收容有一個訊號端子20,一對絕緣構件42的安裝於位於第一方向X的一端的彈性部21的直線狀部211的部分421,與構成第三收容部411的第二殼體41的內表面接觸。又,雖未圖示,但於各第二收容部12,收容有一個接地端子30,位於第一方向X的一端的彈性部31的直線狀部與第二殼體41的內表面接觸。再者,如圖8所示,第一收容部11及第二收容部12於第二方向Y上具有大致相同的尺寸(於圖8僅示出第一收容部11)。As shown in FIG. 6, the
擺動構件4為絕緣性,且如圖5所示般包括連接部5,所述連接部5露出至第一殼體10的外部而能夠與接觸對象物(例如,檢查對象物或檢查裝置)連接。於所述連接部5,設置有將連接部5於其擺動方向(例如,第一方向X)上貫通的貫通孔6。如圖7所示,於貫通孔6收容有各訊號端子20的其中一個第一接點部23及各接地端子30的其中一個第二接點部33。又,如圖7所示,擺動構件4藉由配置於第一殼體10的內部的多個螺旋彈簧8而沿著第一方向X自第一殼體10的內部向外部施力。The
如圖9所示,各訊號端子20的彈性部21包含相互空開間隙26而配置的多個彈性片24、25,於各接觸部22未設置中間部222。又,各訊號端子20的各第一接點部23的形狀不同。As shown in FIG. 9, the
如圖10所示,各接地端子30作為一例而與訊號端子20同樣地為利用電鑄法形成的板狀,且具有:彈性部31,包含相互空開間隙36而配置的多個彈性片34、35;以及接觸部32,並且具有除了第二接點部33以外與訊號端子20大致相同的形狀。As shown in FIG. 10, each
於圖5~圖10的檢查單元2中,訊號端子20及接地端子30分別具有板狀,以板厚方向相互一致的方式分別收容於第一收容部11及第二收容部12。藉由此種結構,可實現能夠更確實地減小高頻區域的訊號的傳輸損失的檢查插座1。In the
訊號端子20及接地端子30分別不限於板狀,亦可為其他任意形狀。又,訊號端子20及接地端子30不限定於分別包括彈性部21、彈性部31以及接觸部22、接觸部32的情況,亦可採用於第一方向X的兩端分別具有接點部的其他任意結構。The
圖5~圖10所示的檢查單元2的絕緣部40包含一對絕緣構件42,所述一對絕緣構件42分別安裝於訊號端子20的板厚方向的兩側。即,絕緣部40不限定於包含第二殼體41的情況。The insulating
如圖8及圖9所示,各絕緣構件42分別安裝於各訊號端子20的板厚方向的兩面。各絕緣構件42為薄膜狀,且具有沿著除了彈性部21及第一接點部23以外的接觸部22的形狀。又,關於各絕緣構件42,構成為在沿著各訊號端子20的板厚方向觀察時,其外形線位於較各訊號端子20的外形線更外側。藉由此種結構,可更容易地實現能夠減小高頻區域的訊號的傳輸損失的檢查插座1。再者,絕緣構件42未安裝於接地端子30。As shown in FIGS. 8 and 9, each insulating
例如,如圖11~圖13所示,絕緣部40亦可包含絕緣層43,所述絕緣層43遍及構成第一收容部11的第一殼體10的整個內表面而設置。藉由此種結構,可更容易地實現能夠減小高頻區域的訊號的傳輸損失的檢查插座1。For example, as shown in FIGS. 11 to 13, the insulating
於圖11~圖13所示的檢查插座1中,第一殼體10於第一方向X的兩端分別具有第二方向Y上的大小不同的開口部13。其中一個開口部13(例如,圖12及圖13的上側的開口部13)具有能夠插入訊號端子20的彈性部21的大小。另一個開口部13(例如,圖12及圖13的下側的開口部13)小於其中一個開口部13,具有能夠插入訊號端子20的接觸部22的大小。於各第一收容部11,以其中一個接觸部22的肩部223與絕緣層43接觸、且另一個接觸部22的肩部223位於第一殼體10的外部的狀態收容有一個訊號端子20。In the
再者,亦可不是於整個第一收容部11而是於一部分設置絕緣層43。Furthermore, the insulating
例如,如圖14~圖16所示,絕緣部40亦可包含一對第三殼體44,所述一對第三殼體44分別覆蓋訊號端子20的第一方向X的兩端的除了第一接點部23以外的部分。For example, as shown in FIGS. 14-16, the insulating
於圖14~圖16所示的檢查插座1中,各第三殼體44具有第一圓筒狀部441、以及與第一圓筒狀部441的第一方向X的一端連接的第二圓筒狀部442。第一圓筒狀部441覆蓋各訊號端子20的各接觸部22的本體部221的一部分。第二圓筒狀部442覆蓋各訊號端子20的各接觸部22的中間部222的一部分或全部,且具有小於第一圓筒狀部441的第一方向X上的尺寸、以及大於第一圓筒狀部441的相對於第一方向X的徑向尺寸。藉由此種結構,可更容易地實現能夠減小高頻區域的訊號的傳輸損失的檢查插座1。In the
以上,參照圖式對本揭示的各種實施方式進行了詳細說明,最後對本揭示的各種形態進行說明。再者,於以下的說明中,作為一例,亦添加參照符號來進行記載。Above, various embodiments of the present disclosure have been described in detail with reference to the drawings, and finally, various forms of the present disclosure have been described. In addition, in the following description, as an example, reference signs are also added for description.
本揭示的第一形態的檢查插座1包括:
導電性的訊號端子20,於兩端分別具有第一接點部23;
導電性的第一殼體10,於內部具有以所述第一接點部23露出至外部的狀態收容所述訊號端子20的第一收容部11;以及
絕緣部40,配置於所述第一收容部11而將所述訊號端子20與所述第一殼體10之間予以絕緣。The
本揭示的第二形態的檢查插座1的所述絕緣部40包括:
絕緣性的第二殼體41,以所述第一接點部23露出至外部的狀態將所述訊號端子20收容於內部。The insulating
本揭示的第三形態的檢查插座1的所述絕緣部40包括:
一對絕緣構件42,分別安裝於所述訊號端子20的板厚方向的兩側。The insulating
本揭示的第四形態的檢查插座1的所述絕緣部40包括:
絕緣層43,設置於構成所述第一收容部11的所述第一殼體10的內表面。The insulating
本揭示的第五形態的檢查插座1的所述絕緣部40包括:
一對第三殼體44,分別覆蓋所述訊號端子20的兩端的除了所述第一接點部以外的部分。The insulating
本揭示的第六形態的檢查插座1更包括:
導電性的接地端子30,於兩端分別具有第二接點部33,
所述第一殼體10於內部具有第二收容部12,以所述第二接點部33露出至外部的狀態收容所述接地端子30,
所述訊號端子20及所述接地端子30分別具有板狀,以板厚方向相互一致的方式分別收容於所述第一收容部11及所述第二收容部12。The
再者,藉由適當組合所述各種實施方式或變形例中的任意的實施方式或變形例,可發揮分別所具有的效果。另外,能夠進行實施方式彼此的組合、或實施例彼此的組合、或實施方式與實施例的組合,並且亦能夠進行不同的實施方式或實施例中的特徵彼此的組合。 [產業上之可利用性]In addition, by appropriately combining any of the various embodiments or modifications described above, the respective effects can be exerted. In addition, a combination of embodiments, a combination of embodiments, or a combination of embodiments and examples can be performed, and a combination of features in different embodiments or examples can also be performed. [Industrial availability]
本揭示的檢查插座例如可應用於包括相機模組等的企業對企業(Business-to-Business,BtoB)連接器來作為連接媒體的模組、及小型封裝(Small Outline Package,SOP)、四方扁平封裝(Quad Flat Package,QFP)、球柵陣列(Ball grid array,BGA)等半導體封裝的檢查中所使用的檢查治具。The inspection socket of the present disclosure can be applied to, for example, a business-to-business (BtoB) connector including a camera module, etc., as a module of the connection medium, and a small package (Small Outline Package, SOP), quad flat Inspection jigs used in the inspection of semiconductor packages such as Quad Flat Package (QFP) and Ball Grid Array (BGA).
1:檢查插座
2:檢查單元
3:基座殼體
4:擺動構件
5:連接部
6:貫通孔
8:螺旋彈簧
10:第一殼體
11:第一收容部
12:第二收容部
13:開口部
20:訊號端子
21:彈性部
22:接觸部
23:第一接點部
24、25:彈性片
26:間隙
30:接地端子
31:彈性部
32:接觸部
33:第二接點部
34、35:彈性片
36:間隙
40:絕緣部
41:第二殼體
42:絕緣構件
43:絕緣層
44:第三殼體
111:第一部分
112:第二部分
211:直線狀部
212:彎曲狀部
221:本體部
222:中間部
223:肩部
411:第三收容部
412、413:開口部
441:第一圓筒狀部
442:第二圓筒狀部
II-II:線
VII-VII:線
VIII-VIII:線
X:第一方向
XII-XII:線
XIII-XIII:線
XV-XV:線
Y:第二方向1: Check the socket
2: Inspection unit
3: Base shell
4: swing member
5: Connection part
6: Through hole
8: Coil spring
10: The first shell
11: First Containment Department
12: Second Containment Department
13: Opening
20: Signal terminal
21: Elastic part
22: Contact part
23: The
圖1是表示本揭示的一實施方式的檢查插座的立體圖。 圖2是沿著圖1的II-II線的剖視圖。 圖3是表示圖1的檢查插座的訊號端子的立體圖。 圖4是表示收容於第二殼體的狀態的圖3的訊號端子的立體圖。 圖5是表示包括圖1的檢查插座的第一變形例的檢查單元的立體圖。 圖6是表示圖1的檢查插座的第一變形例的立體圖。 圖7是沿著圖5的VII-VII線的剖視圖。 圖8是沿著圖6的VIII-VIII線的剖視圖。 圖9是表示圖6的檢查單元的訊號端子及一對絕緣構件的立體圖。 圖10是表示圖6的檢查單元的接地端子的立體圖。 圖11是表示圖1的檢查插座的第二變形例的立體圖。 圖12是沿著圖11的XII-XII線的剖視圖。 圖13是沿著圖11的XIII-XIII線的剖視圖。 圖14是表示圖1的檢查插座的第三變形例的立體圖。 圖15是沿著圖14的XV-XV線的剖視圖。 圖16是表示圖14的檢查插座的訊號端子及一對第三殼體的立體圖。Fig. 1 is a perspective view showing an inspection socket according to an embodiment of the present disclosure. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a perspective view showing a signal terminal of the inspection socket of Fig. 1. Fig. 4 is a perspective view of the signal terminal of Fig. 3 showing a state of being housed in a second housing. Fig. 5 is a perspective view showing an inspection unit including a first modification of the inspection socket of Fig. 1. Fig. 6 is a perspective view showing a first modification of the inspection socket of Fig. 1. Fig. 7 is a cross-sectional view taken along the line VII-VII in Fig. 5. Fig. 8 is a cross-sectional view taken along line VIII-VIII of Fig. 6. Fig. 9 is a perspective view showing a signal terminal and a pair of insulating members of the inspection unit of Fig. 6. Fig. 10 is a perspective view showing a ground terminal of the inspection unit of Fig. 6. Fig. 11 is a perspective view showing a second modification of the inspection socket of Fig. 1. Fig. 12 is a cross-sectional view taken along line XII-XII in Fig. 11. Fig. 13 is a cross-sectional view taken along the line XIII-XIII of Fig. 11. Fig. 14 is a perspective view showing a third modification of the inspection socket of Fig. 1. Fig. 15 is a cross-sectional view taken along line XV-XV in Fig. 14. Fig. 16 is a perspective view showing a signal terminal and a pair of third housings of the inspection socket of Fig. 14.
10:第一殼體10: The first shell
11:第一收容部11: First Containment Department
13:開口部13: Opening
20:訊號端子20: Signal terminal
21:彈性部21: Elastic part
22:接觸部22: Contact part
23:第一接點部23: The first contact
40:絕緣部40: Insulation part
111:第一部分111: Part One
112:第二部分112: Part Two
221:本體部221: body part
222:中間部222: middle part
223:肩部223: Shoulder
411:第三收容部411: Third Containment Department
412、413:開口部412, 413: opening
X:第一方向X: first direction
Y:第二方向Y: second direction
Claims (6)
Applications Claiming Priority (2)
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JP2020022630A JP2021128055A (en) | 2020-02-13 | 2020-02-13 | Inspection socket |
JP2020-022630 | 2020-02-13 |
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TW202131578A true TW202131578A (en) | 2021-08-16 |
TWI811623B TWI811623B (en) | 2023-08-11 |
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JP (1) | JP2021128055A (en) |
KR (1) | KR102483145B1 (en) |
CN (1) | CN113258326B (en) |
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JP2002134202A (en) | 2000-10-27 | 2002-05-10 | Otax Co Ltd | Receptacle for electronic parts |
JP2008175700A (en) * | 2007-01-19 | 2008-07-31 | Matsushita Electric Ind Co Ltd | Inspection device or inspection method for semiconductor device |
JP5381609B2 (en) * | 2009-10-20 | 2014-01-08 | 日本電産リード株式会社 | Inspection jig and contact |
KR101051032B1 (en) * | 2010-07-23 | 2011-07-26 | 리노공업주식회사 | Test socket for semiconductor chip |
JP2012098219A (en) * | 2010-11-04 | 2012-05-24 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
JPWO2013061486A1 (en) * | 2011-10-26 | 2015-04-02 | ユニテクノ株式会社 | Contact probe and inspection socket with the same |
KR101490501B1 (en) * | 2013-11-12 | 2015-02-06 | 주식회사 아이에스시 | Electrical test socket |
KR101762836B1 (en) * | 2015-09-10 | 2017-07-28 | 리노공업주식회사 | A probe socket |
JP2017130421A (en) * | 2016-01-22 | 2017-07-27 | 山一電機株式会社 | Contact terminal, contact support, and connection device including the same |
JP6627655B2 (en) * | 2016-06-17 | 2020-01-08 | オムロン株式会社 | socket |
CN111033273B (en) * | 2018-01-11 | 2022-04-26 | 欧姆龙株式会社 | Probe, inspection tool, inspection unit, and inspection apparatus |
WO2019138505A1 (en) * | 2018-01-11 | 2019-07-18 | オムロン株式会社 | Probe pin, test jig, test unit, and test device |
JP6988920B2 (en) * | 2018-01-11 | 2022-01-05 | オムロン株式会社 | Probe pins, inspection jigs, inspection units and inspection equipment |
US20200003802A1 (en) * | 2018-07-02 | 2020-01-02 | Powertech Technology Inc. | Testing socket and testing apparatus |
KR20200080922A (en) * | 2018-12-27 | 2020-07-07 | 주식회사 아이에스시 | Contact pin for test socket and test socket comprising the same |
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KR20210103395A (en) | 2021-08-23 |
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