TW202130484A - 基板夾持機構以及基板加工裝置 - Google Patents

基板夾持機構以及基板加工裝置 Download PDF

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Publication number
TW202130484A
TW202130484A TW109145470A TW109145470A TW202130484A TW 202130484 A TW202130484 A TW 202130484A TW 109145470 A TW109145470 A TW 109145470A TW 109145470 A TW109145470 A TW 109145470A TW 202130484 A TW202130484 A TW 202130484A
Authority
TW
Taiwan
Prior art keywords
substrate
clamping
claw
upper claw
clamping mechanism
Prior art date
Application number
TW109145470A
Other languages
English (en)
Chinese (zh)
Inventor
成尾徹
三浦三雄
得永直
土屋智章
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW202130484A publication Critical patent/TW202130484A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B7/00—Moulds; Cores; Mandrels
    • B28B7/02—Moulds with adjustable parts specially for modifying at will the dimensions or form of the moulded article
    • B28B7/04—Moulds with adjustable parts specially for modifying at will the dimensions or form of the moulded article one or more of the parts being pivotally mounted
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW109145470A 2020-01-23 2020-12-22 基板夾持機構以及基板加工裝置 TW202130484A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020009193A JP7098172B2 (ja) 2020-01-23 2020-01-23 基板把持機構および基板加工装置
JP2020-009193 2020-01-23

Publications (1)

Publication Number Publication Date
TW202130484A true TW202130484A (zh) 2021-08-16

Family

ID=76878181

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109145470A TW202130484A (zh) 2020-01-23 2020-12-22 基板夾持機構以及基板加工裝置

Country Status (4)

Country Link
JP (1) JP7098172B2 (ja)
KR (1) KR20210095557A (ja)
CN (1) CN113146871A (ja)
TW (1) TW202130484A (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1640256A (en) * 1925-09-11 1927-08-23 Shirley E Small Tool
US7770500B2 (en) 2004-03-15 2010-08-10 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
JP2006297521A (ja) 2005-04-19 2006-11-02 Kawamura Seiki Kk 板材の溝加工装置
JP2008166348A (ja) 2006-12-27 2008-07-17 Olympus Corp 基板搬送装置
JP5471111B2 (ja) 2009-07-21 2014-04-16 株式会社ニコン 反転装置および基板貼り合わせ装置
JP2011073875A (ja) 2009-10-02 2011-04-14 Sharp Corp 搬送方法
JP6439379B2 (ja) 2014-10-24 2018-12-19 三星ダイヤモンド工業株式会社 基板加工装置
JP2019064118A (ja) 2017-09-29 2019-04-25 三星ダイヤモンド工業株式会社 基板加工装置
KR20190109841A (ko) 2018-03-19 2019-09-27 한국미쯔보시다이아몬드공업(주) 자동 두께 제어 척

Also Published As

Publication number Publication date
JP7098172B2 (ja) 2022-07-11
JP2021115723A (ja) 2021-08-10
KR20210095557A (ko) 2021-08-02
CN113146871A (zh) 2021-07-23

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