TW202129819A - 基板處理系統之控制方法及基板處理系統 - Google Patents

基板處理系統之控制方法及基板處理系統 Download PDF

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Publication number
TW202129819A
TW202129819A TW109140081A TW109140081A TW202129819A TW 202129819 A TW202129819 A TW 202129819A TW 109140081 A TW109140081 A TW 109140081A TW 109140081 A TW109140081 A TW 109140081A TW 202129819 A TW202129819 A TW 202129819A
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TW
Taiwan
Prior art keywords
substrate
wafer
processing system
radius
sensor module
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TW109140081A
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English (en)
Chinese (zh)
Inventor
後藤亮太
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日商東京威力科創股份有限公司
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Publication of TW202129819A publication Critical patent/TW202129819A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW109140081A 2019-11-28 2020-11-17 基板處理系統之控制方法及基板處理系統 TW202129819A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019215253 2019-11-28
JP2019-215253 2019-11-28

Publications (1)

Publication Number Publication Date
TW202129819A true TW202129819A (zh) 2021-08-01

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TW109140081A TW202129819A (zh) 2019-11-28 2020-11-17 基板處理系統之控制方法及基板處理系統

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TW (1) TW202129819A (ja)
WO (1) WO2021106717A1 (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088398A (ja) * 2007-10-02 2009-04-23 Olympus Corp 円盤体の求心方法
JP5516482B2 (ja) * 2011-04-11 2014-06-11 東京エレクトロン株式会社 基板搬送方法、基板搬送装置、及び塗布現像装置
JP5582152B2 (ja) * 2012-02-03 2014-09-03 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体

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Publication number Publication date
WO2021106717A1 (ja) 2021-06-03

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