TW202124627A - 切割膠帶用溶液澆鑄型基材薄膜及切割膠帶 - Google Patents

切割膠帶用溶液澆鑄型基材薄膜及切割膠帶 Download PDF

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Publication number
TW202124627A
TW202124627A TW109130360A TW109130360A TW202124627A TW 202124627 A TW202124627 A TW 202124627A TW 109130360 A TW109130360 A TW 109130360A TW 109130360 A TW109130360 A TW 109130360A TW 202124627 A TW202124627 A TW 202124627A
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TW
Taiwan
Prior art keywords
base film
solution
dicing tape
mass
acrylic resin
Prior art date
Application number
TW109130360A
Other languages
English (en)
Chinese (zh)
Inventor
早野慎一
守本宗弘
酒井貴広
Original Assignee
日商麥克賽爾控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商麥克賽爾控股股份有限公司 filed Critical 日商麥克賽爾控股股份有限公司
Publication of TW202124627A publication Critical patent/TW202124627A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW109130360A 2019-10-15 2020-09-04 切割膠帶用溶液澆鑄型基材薄膜及切割膠帶 TW202124627A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-188805 2019-10-15
JP2019188805 2019-10-15
JP2020-131886 2020-08-03
JP2020131886A JP7474146B2 (ja) 2019-10-15 2020-08-03 ダイシングテープ用溶液流延型基材フィルム及びダイシングテープ

Publications (1)

Publication Number Publication Date
TW202124627A true TW202124627A (zh) 2021-07-01

Family

ID=75486556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109130360A TW202124627A (zh) 2019-10-15 2020-09-04 切割膠帶用溶液澆鑄型基材薄膜及切割膠帶

Country Status (3)

Country Link
JP (1) JP7474146B2 (ja)
KR (1) KR20210044718A (ja)
TW (1) TW202124627A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7111213B1 (ja) 2021-04-22 2022-08-02 大日本印刷株式会社 半導体加工用粘着テープ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878124B2 (ja) 2005-04-07 2012-02-15 ロンシール工業株式会社 帯電防止性アクリル系樹脂組成物より形成されるフィルム、シート
JP5783540B2 (ja) 2009-06-15 2015-09-24 エルジー・ケム・リミテッド ウェーハ加工用基材
JP5603757B2 (ja) 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
CN103238205B (zh) 2010-12-06 2016-05-18 木本股份有限公司 激光切割用辅助片
WO2013146617A1 (ja) 2012-03-30 2013-10-03 株式会社 きもと 易剥離性粘着フィルム及び金属板の加工方法
JP6211771B2 (ja) 2013-02-08 2017-10-11 日東電工株式会社 粘着テープ
JP2015220377A (ja) 2014-05-19 2015-12-07 古河電気工業株式会社 粘接着フィルム一体型表面保護テープおよび粘接着フィルム一体型表面保護テープを用いた半導体チップの製造方法

Also Published As

Publication number Publication date
JP7474146B2 (ja) 2024-04-24
KR20210044718A (ko) 2021-04-23
JP2021064775A (ja) 2021-04-22

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