KR20210044718A - 다이싱 테이프용 용액 유연형 기재 필름 및 다이싱 테이프 - Google Patents

다이싱 테이프용 용액 유연형 기재 필름 및 다이싱 테이프 Download PDF

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Publication number
KR20210044718A
KR20210044718A KR1020200132883A KR20200132883A KR20210044718A KR 20210044718 A KR20210044718 A KR 20210044718A KR 1020200132883 A KR1020200132883 A KR 1020200132883A KR 20200132883 A KR20200132883 A KR 20200132883A KR 20210044718 A KR20210044718 A KR 20210044718A
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KR
South Korea
Prior art keywords
base film
solution
mass
dicing tape
yield point
Prior art date
Application number
KR1020200132883A
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English (en)
Korean (ko)
Inventor
신이치 하야노
무네히로 모리모토
다카히로 사카이
Original Assignee
맥셀 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 맥셀 홀딩스 가부시키가이샤 filed Critical 맥셀 홀딩스 가부시키가이샤
Publication of KR20210044718A publication Critical patent/KR20210044718A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020200132883A 2019-10-15 2020-10-14 다이싱 테이프용 용액 유연형 기재 필름 및 다이싱 테이프 KR20210044718A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019188805 2019-10-15
JPJP-P-2019-188805 2019-10-15
JP2020131886A JP7474146B2 (ja) 2019-10-15 2020-08-03 ダイシングテープ用溶液流延型基材フィルム及びダイシングテープ
JPJP-P-2020-131886 2020-08-03

Publications (1)

Publication Number Publication Date
KR20210044718A true KR20210044718A (ko) 2021-04-23

Family

ID=75486556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200132883A KR20210044718A (ko) 2019-10-15 2020-10-14 다이싱 테이프용 용액 유연형 기재 필름 및 다이싱 테이프

Country Status (3)

Country Link
JP (1) JP7474146B2 (ja)
KR (1) KR20210044718A (ja)
TW (1) TW202124627A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7111213B1 (ja) 2021-04-22 2022-08-02 大日本印刷株式会社 半導体加工用粘着テープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006290958A (ja) 2005-04-07 2006-10-26 Lonseal Corp 帯電防止性アクリル系樹脂組成物およびフィルム、シート
JP2014152241A (ja) 2013-02-08 2014-08-25 Nitto Denko Corp 粘着テープ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5783540B2 (ja) 2009-06-15 2015-09-24 エルジー・ケム・リミテッド ウェーハ加工用基材
JP5603757B2 (ja) 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
CN103238205B (zh) 2010-12-06 2016-05-18 木本股份有限公司 激光切割用辅助片
WO2013146617A1 (ja) 2012-03-30 2013-10-03 株式会社 きもと 易剥離性粘着フィルム及び金属板の加工方法
JP2015220377A (ja) 2014-05-19 2015-12-07 古河電気工業株式会社 粘接着フィルム一体型表面保護テープおよび粘接着フィルム一体型表面保護テープを用いた半導体チップの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006290958A (ja) 2005-04-07 2006-10-26 Lonseal Corp 帯電防止性アクリル系樹脂組成物およびフィルム、シート
JP2014152241A (ja) 2013-02-08 2014-08-25 Nitto Denko Corp 粘着テープ

Also Published As

Publication number Publication date
TW202124627A (zh) 2021-07-01
JP7474146B2 (ja) 2024-04-24
JP2021064775A (ja) 2021-04-22

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