TW202116482A - 切割裝置之卡盤台 - Google Patents

切割裝置之卡盤台 Download PDF

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Publication number
TW202116482A
TW202116482A TW109136572A TW109136572A TW202116482A TW 202116482 A TW202116482 A TW 202116482A TW 109136572 A TW109136572 A TW 109136572A TW 109136572 A TW109136572 A TW 109136572A TW 202116482 A TW202116482 A TW 202116482A
Authority
TW
Taiwan
Prior art keywords
chuck table
cutting
workpiece
main body
plate
Prior art date
Application number
TW109136572A
Other languages
English (en)
Chinese (zh)
Inventor
金子智洋
有福法久
斎藤博
伏田正康
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202116482A publication Critical patent/TW202116482A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW109136572A 2019-10-24 2020-10-21 切割裝置之卡盤台 TW202116482A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-193653 2019-10-24
JP2019193653A JP7390855B2 (ja) 2019-10-24 2019-10-24 切削装置のチャックテーブル

Publications (1)

Publication Number Publication Date
TW202116482A true TW202116482A (zh) 2021-05-01

Family

ID=75637566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109136572A TW202116482A (zh) 2019-10-24 2020-10-21 切割裝置之卡盤台

Country Status (5)

Country Link
JP (1) JP7390855B2 (ja)
KR (1) KR20210048983A (ja)
PH (1) PH12020050367A1 (ja)
SG (1) SG10202010109VA (ja)
TW (1) TW202116482A (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6004725B2 (ja) 2012-04-24 2016-10-12 株式会社ディスコ 加工装置のチャックテーブル機構
JP6173173B2 (ja) 2013-11-11 2017-08-02 株式会社ディスコ 切削装置
JP6301147B2 (ja) 2014-02-13 2018-03-28 株式会社ディスコ 保持治具
JP6382039B2 (ja) 2014-09-04 2018-08-29 Ｔｏｗａ株式会社 切断装置並びに吸着機構及びこれを用いる装置

Also Published As

Publication number Publication date
KR20210048983A (ko) 2021-05-04
JP7390855B2 (ja) 2023-12-04
SG10202010109VA (en) 2021-05-28
PH12020050367A1 (en) 2021-05-10
JP2021068824A (ja) 2021-04-30

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