JP7399021B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP7399021B2 JP7399021B2 JP2020067029A JP2020067029A JP7399021B2 JP 7399021 B2 JP7399021 B2 JP 7399021B2 JP 2020067029 A JP2020067029 A JP 2020067029A JP 2020067029 A JP2020067029 A JP 2020067029A JP 7399021 B2 JP7399021 B2 JP 7399021B2
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- JP
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- Prior art keywords
- holding table
- workpiece
- cutting
- fixed
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims description 91
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- 238000004140 cleaning Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
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- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2703/00—Work clamping
- B23Q2703/02—Work clamping means
- B23Q2703/04—Work clamping means using fluid means or a vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明の実施形態に係る切削装置1について、図面に基づいて説明する。まず、実施形態に係る切削装置1の全体構成及び加工対象の被加工物100の構成について説明する。図1は、実施形態に係る切削装置1の構成例を示す斜視図である。図2は、図1に示された切削装置1の加工対象の被加工物100の一例の外観を示す斜視図である。図3は、図2に示された被加工物100を別の方向から視た外観を示す斜視図である。以下の説明において、X軸方向は、水平面における一方向である。Y軸方向は、水平面において、X軸方向に直交する方向である。Z軸方向は、X軸方向及びY軸方向に直交する方向である。実施形態の切削装置1は、加工送り方向がX軸方向であり、割り出し送り方向がY軸方向であり、切り込み送り方向がZ軸方向である。
10 保持テーブル
10-1 第1保持テーブル
10-2 第2保持テーブル
20 硬質板
30 ラバープレート
31 保持面
32 逃げ溝
33 吸引穴
40 テーブルベース
41 支持面
42 負圧伝達室
43 吸引口
44 固定ブロック
50 切削ユニット
51 切削ブレード
100 被加工物
100-1 第1の被加工物
100-2 第2の被加工物
114 分割予定ライン
120 デバイスチップ(デバイス)
140 チップ
Claims (3)
- 互いに交差する複数の分割予定ラインに区画された領域にデバイスが形成された板状の被加工物を吸引保持する保持テーブルと、
該保持テーブルに保持された被加工物を切削して複数のチップに分割する切削ブレードを備える切削ユニットと、
該保持テーブルが着脱自在に固定されるテーブルベースと、
を備える切削装置であって、
該保持テーブルは、
該分割予定ラインに対応する逃げ溝と該デバイスに対応する吸引穴とが形成された保持面を備える板状物であり、
第1の被加工物に対応する第1保持テーブルと、該第1の被加工物と異なる大きさの第2の被加工物に対応する第2保持テーブルとから選択され、
該テーブルベースは、
該保持テーブルの下面を支持する支持面と、
該保持テーブルに対応する位置に開口し、該保持テーブルの該吸引穴から負圧を作用させる吸引口と、
該支持面に着脱自在に固定され、該支持面に支持される該保持テーブルを側方から挟持する固定ブロックと、
を有し、
該固定ブロックの位置を調整し、該第1保持テーブル及び該第2保持テーブルのいずれも該支持面に固定可能である
ことを特徴とする切削装置。 - 該固定ブロックは、該保持テーブルの少なくとも1つの角部の側方が突き当たる突き当てブロックを備える
ことを特徴とする請求項1に記載の切削装置。 - 該保持テーブルは、通気性を有する硬質板と、該硬質板の表面側に固定され該逃げ溝と該吸引穴を備えるラバープレートと、を有する
ことを特徴とする請求項1又は2に記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020067029A JP7399021B2 (ja) | 2020-04-02 | 2020-04-02 | 切削装置 |
TW110109400A TW202138120A (zh) | 2020-04-02 | 2021-03-16 | 切削裝置 |
KR1020210037969A KR20210123212A (ko) | 2020-04-02 | 2021-03-24 | 절삭 장치 |
CN202110325133.6A CN113492466A (zh) | 2020-04-02 | 2021-03-26 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020067029A JP7399021B2 (ja) | 2020-04-02 | 2020-04-02 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021163930A JP2021163930A (ja) | 2021-10-11 |
JP7399021B2 true JP7399021B2 (ja) | 2023-12-15 |
Family
ID=77997450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020067029A Active JP7399021B2 (ja) | 2020-04-02 | 2020-04-02 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7399021B2 (ja) |
KR (1) | KR20210123212A (ja) |
CN (1) | CN113492466A (ja) |
TW (1) | TW202138120A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109551653A (zh) * | 2018-12-11 | 2019-04-02 | 江苏建筑职业技术学院 | 一种便于固定的建筑施工用混凝土空心板湿切装置 |
EP4219076A1 (en) * | 2022-01-28 | 2023-08-02 | Vestel Elektronik Sanayi ve Ticaret A.S. | Holding tool for holding a panel |
CN114434021A (zh) * | 2022-02-28 | 2022-05-06 | 江苏宇辉光伏科技有限公司 | 光伏电池切片装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014175602A (ja) | 2013-03-12 | 2014-09-22 | Disco Abrasive Syst Ltd | 保持治具 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6173173B2 (ja) | 2013-11-11 | 2017-08-02 | 株式会社ディスコ | 切削装置 |
-
2020
- 2020-04-02 JP JP2020067029A patent/JP7399021B2/ja active Active
-
2021
- 2021-03-16 TW TW110109400A patent/TW202138120A/zh unknown
- 2021-03-24 KR KR1020210037969A patent/KR20210123212A/ko active Search and Examination
- 2021-03-26 CN CN202110325133.6A patent/CN113492466A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014175602A (ja) | 2013-03-12 | 2014-09-22 | Disco Abrasive Syst Ltd | 保持治具 |
Also Published As
Publication number | Publication date |
---|---|
TW202138120A (zh) | 2021-10-16 |
CN113492466A (zh) | 2021-10-12 |
JP2021163930A (ja) | 2021-10-11 |
KR20210123212A (ko) | 2021-10-13 |
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