PH12020050367A1 - Chuck table for cutting apparatus - Google Patents
Chuck table for cutting apparatusInfo
- Publication number
- PH12020050367A1 PH12020050367A1 PH12020050367A PH12020050367A PH12020050367A1 PH 12020050367 A1 PH12020050367 A1 PH 12020050367A1 PH 12020050367 A PH12020050367 A PH 12020050367A PH 12020050367 A PH12020050367 A PH 12020050367A PH 12020050367 A1 PH12020050367 A1 PH 12020050367A1
- Authority
- PH
- Philippines
- Prior art keywords
- main body
- holding surface
- rubber plate
- chuck table
- cutting apparatus
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
A chuck table for use in a cutting apparatus includes a main body having an air-permeable hard plate and a rubber plate fixed to a face side of the hard plate; and a frame fitted over an outer circumference of the main body such that a holding surface of the rubber plate and a reverse side of the hard plate are exposed, the frame securing the main body detachably to a table base. The rubber plate includes the holding surface for holding the workpiece thereon, cutting blade clearance grooves corresponding to projected dicing lines on a workpiece held on the holding surface, and suction holes defined in areas demarcated by the cutting blade clearance grooves.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019193653A JP7390855B2 (en) | 2019-10-24 | 2019-10-24 | Chuck table of cutting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12020050367A1 true PH12020050367A1 (en) | 2021-05-10 |
Family
ID=75637566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12020050367A PH12020050367A1 (en) | 2019-10-24 | 2020-10-06 | Chuck table for cutting apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7390855B2 (en) |
KR (1) | KR20210048983A (en) |
PH (1) | PH12020050367A1 (en) |
SG (1) | SG10202010109VA (en) |
TW (1) | TW202116482A (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6004725B2 (en) * | 2012-04-24 | 2016-10-12 | 株式会社ディスコ | Chuck table mechanism of processing equipment |
JP6173173B2 (en) | 2013-11-11 | 2017-08-02 | 株式会社ディスコ | Cutting equipment |
JP6301147B2 (en) * | 2014-02-13 | 2018-03-28 | 株式会社ディスコ | Holding jig |
JP6382039B2 (en) * | 2014-09-04 | 2018-08-29 | Towa株式会社 | Cutting apparatus, adsorption mechanism and apparatus using the same |
-
2019
- 2019-10-24 JP JP2019193653A patent/JP7390855B2/en active Active
-
2020
- 2020-09-15 KR KR1020200118046A patent/KR20210048983A/en active Search and Examination
- 2020-10-06 PH PH12020050367A patent/PH12020050367A1/en unknown
- 2020-10-12 SG SG10202010109VA patent/SG10202010109VA/en unknown
- 2020-10-21 TW TW109136572A patent/TW202116482A/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG10202010109VA (en) | 2021-05-28 |
TW202116482A (en) | 2021-05-01 |
JP7390855B2 (en) | 2023-12-04 |
KR20210048983A (en) | 2021-05-04 |
JP2021068824A (en) | 2021-04-30 |
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