MY152902A - Cutting and grinding apparatus - Google Patents

Cutting and grinding apparatus

Info

Publication number
MY152902A
MY152902A MYPI2010003297A MY152902A MY 152902 A MY152902 A MY 152902A MY PI2010003297 A MYPI2010003297 A MY PI2010003297A MY 152902 A MY152902 A MY 152902A
Authority
MY
Malaysia
Prior art keywords
rectangular substrate
cutting
holding
grinding
holding table
Prior art date
Application number
Inventor
Koji Nanbu
Takayuki Ono
Tadashi Kugii
Masanobu Kaneko
Soichiro Akita
Fumio Uchida
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY152902A publication Critical patent/MY152902A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A CUTTING AND GRINDING APPARATUS FOR CUTTING A RECTANGULAR SUBSTRATE (10) ALONG A PLURALITY OF PARALLEL DIVISION LINES (101) FORMED ON THE RECTANGULAR SUBSTRATE (10) AND GRINDING A CUT SURFACE OF THE RECTANGULAR SUBSTRATE (10). THE CUTTING AND GRINDING APPARATUS INCLUDES A HOLDING TABLE MECHANISM (3) FOR HOLDING THE RECTANGULAR SUBSTRATE (10) AND A PROCESSING UNIT INCLUDING A COMBINED TOOL HAVING A CUTTING BLADE FOR CUTTING THE RECTANGULAR SUBSTRATE (10) HELD BY THE HOLDING TABLE MECHANISM (3) ALONG EACH DIVISION LINE (101) AND A GRINDING WHEEL FOR GRINDING THE CUT SURFACE. THE HOLDING TABLE MECHANISM (3) INCLUDES A SUPPORTING BASE (32) AND A HOLDING TABLE (3) HAVING A HOLDING SURFACE (332) FOR HOLDING THE RECTANGULAR SUBSTRATE (10). THE HOLDING TABLE (3) IS PROVIDED WITH AN INDEX JIG (11) ADAPTED TO BE PLACED ON THE HOLDING SURFACE (332) IN THE CONDITION WHERE THE INDEX JIG (11) IS JOINED THROUGH A WAX (12) TO ONE END SURFACE OF THE RECTANGULAR SUBSTRATE (10). THE MOST ILLUSTRATIVE DRAWING IS
MYPI2010003297 2009-08-07 2010-07-12 Cutting and grinding apparatus MY152902A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009184872A JP5385049B2 (en) 2009-08-07 2009-08-07 Cutting and polishing equipment

Publications (1)

Publication Number Publication Date
MY152902A true MY152902A (en) 2014-11-28

Family

ID=43765260

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003297 MY152902A (en) 2009-08-07 2010-07-12 Cutting and grinding apparatus

Country Status (2)

Country Link
JP (1) JP5385049B2 (en)
MY (1) MY152902A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5443131B2 (en) * 2009-11-04 2014-03-19 株式会社ディスコ Cutting and polishing equipment
KR101361122B1 (en) 2011-07-29 2014-02-20 주식회사 엘지화학 Polishing Apparatus of Improved Productivity
JP6388518B2 (en) * 2014-10-10 2018-09-12 株式会社ディスコ Workpiece polishing method
JP6850569B2 (en) * 2016-09-09 2021-03-31 株式会社ディスコ Polishing method
CN106737040A (en) * 2016-12-06 2017-05-31 程金煦 A kind of deburring cutting machine
CN108398308A (en) * 2018-06-05 2018-08-14 吉林重通成飞新材料股份公司 Fibre reinforced composites compress sample end face processing device and method
CN110508654A (en) * 2019-07-15 2019-11-29 安徽中运智能科技有限公司 A kind of automobile metal bar bending and end face processing device
CN112894605A (en) * 2019-12-03 2021-06-04 泰州市天盛不锈钢制品有限公司 Drilling type port horizontal throwing mechanism after cutting of hexagonal steel bar
KR102541589B1 (en) * 2021-05-04 2023-06-12 주식회사 누리 Linear rail cutting and polishing device
CN114888704A (en) * 2022-07-13 2022-08-12 南通盛昕泽智能科技有限公司 Polishing equipment for LED production based on electronic components

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2908915B2 (en) * 1991-09-20 1999-06-23 株式会社日立製作所 Wafer cutting method and apparatus
JPH09193000A (en) * 1996-01-10 1997-07-29 Canon Inc Cutting method for thin plate material
JPH11316928A (en) * 1998-05-06 1999-11-16 Tdk Corp Method and device for manufacturing slider
JP4733805B2 (en) * 2000-04-03 2011-07-27 ソニー株式会社 Processing method and processing apparatus for forming rectangular member into rod-shaped member
JP2005041155A (en) * 2003-07-24 2005-02-17 Nachi Fujikoshi Corp Processing apparatus of thin film material

Also Published As

Publication number Publication date
JP2011036939A (en) 2011-02-24
JP5385049B2 (en) 2014-01-08

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