TW202108663A - 聚醯亞胺膜、覆金屬積層板及柔性電路基板 - Google Patents

聚醯亞胺膜、覆金屬積層板及柔性電路基板 Download PDF

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Publication number
TW202108663A
TW202108663A TW109121023A TW109121023A TW202108663A TW 202108663 A TW202108663 A TW 202108663A TW 109121023 A TW109121023 A TW 109121023A TW 109121023 A TW109121023 A TW 109121023A TW 202108663 A TW202108663 A TW 202108663A
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TW
Taiwan
Prior art keywords
layer
polyimide
fpc
polyimide film
axis direction
Prior art date
Application number
TW109121023A
Other languages
English (en)
Chinese (zh)
Inventor
向井大揮
松井弘貴
庄司直幸
Original Assignee
日商日鐵化學材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日鐵化學材料股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW202108663A publication Critical patent/TW202108663A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW109121023A 2019-06-28 2020-06-22 聚醯亞胺膜、覆金屬積層板及柔性電路基板 TW202108663A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019122330 2019-06-28
JP2019-122330 2019-06-28

Publications (1)

Publication Number Publication Date
TW202108663A true TW202108663A (zh) 2021-03-01

Family

ID=73891141

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109121023A TW202108663A (zh) 2019-06-28 2020-06-22 聚醯亞胺膜、覆金屬積層板及柔性電路基板

Country Status (4)

Country Link
JP (1) JP2021009997A (ja)
KR (1) KR20210001986A (ja)
CN (1) CN112153807A (ja)
TW (1) TW202108663A (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858915B2 (ja) 2010-08-09 2016-02-10 新日鉄住金化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話
TWI599277B (zh) 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 可撓性覆銅積層板
JP2019012098A (ja) 2017-06-29 2019-01-24 株式会社ジャパンディスプレイ 表示装置
JP6509294B2 (ja) 2017-09-28 2019-05-08 株式会社Ｎｓｃ フレキシブルデバイス

Also Published As

Publication number Publication date
KR20210001986A (ko) 2021-01-06
CN112153807A (zh) 2020-12-29
JP2021009997A (ja) 2021-01-28

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