TW202107189A - 攝像頭裝置及移動終端 - Google Patents

攝像頭裝置及移動終端 Download PDF

Info

Publication number
TW202107189A
TW202107189A TW108129368A TW108129368A TW202107189A TW 202107189 A TW202107189 A TW 202107189A TW 108129368 A TW108129368 A TW 108129368A TW 108129368 A TW108129368 A TW 108129368A TW 202107189 A TW202107189 A TW 202107189A
Authority
TW
Taiwan
Prior art keywords
circuit board
camera device
electrical connection
driver
photosensitive chip
Prior art date
Application number
TW108129368A
Other languages
English (en)
Other versions
TWI736954B (zh
Inventor
陳信文
張龍飛
李堃
馬曉梅
Original Assignee
新煒科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新煒科技有限公司 filed Critical 新煒科技有限公司
Publication of TW202107189A publication Critical patent/TW202107189A/zh
Application granted granted Critical
Publication of TWI736954B publication Critical patent/TWI736954B/zh

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/291Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48153Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/48155Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48475Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/48479Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/83801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8385Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/8388Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/922Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222Sequential connecting processes
    • H01L2224/92242Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12043Photo diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09072Hole or recess under component or special relationship between hole and component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Blocking Light For Cameras (AREA)

Abstract

一種攝像頭裝置,包括鏡頭組件、驅動器和感光組件,所述驅動器用於驅動所述鏡頭組件。所感光組件包括濾波片、感光芯片、第一電路板和第二電路板。所述第一電路板上開設收容所述感光芯片的通槽。所述濾波片覆蓋所述通槽。所述感光芯片通過所述第二電路板與所述第一電路板電連接。上述攝像頭裝置通過將感光芯片設置在第一電路板上的通槽內,使得所述濾波片可以直接設置於所述第一電路板上,消除所述濾波片與所述第一電路板之間的距離,減少攝像頭裝置的厚度尺寸。本申請還提供一種具有上述攝像頭裝置的移動終端。

Description

攝像頭裝置及移動終端
本發明涉及一種攝像頭裝置和具有該攝像頭裝置的移動終端。
隨著智能電子設備的不斷發展,對智能設備中的攝像頭裝置的要求越來越高。智能電子設備,比如智能手機正朝向輕薄化發展和設計,相應地,攝像頭裝置也要求向小型化甚至微型化發展。現有的智能手機厚度已經減小到幾個毫米,比如6、7毫米,被安裝的攝像頭裝置的厚度尺寸需要小於手機厚度,如何進一步降低攝像頭裝置的厚度成為急需解決的問題。
鑒於上述狀況,本發明提供一種厚度薄的攝像頭裝置和具有該攝像頭裝置的移動終端。
一種攝像頭裝置,包括:鏡頭組件;驅動器,用於驅動所述鏡頭組件;和感光組件,設置在所述鏡頭組件的底部,所感光組件包括濾波片、感光芯片和第一電路板。所述第一電路板上開設通槽,所述感光芯片收容在所述通槽內,所述濾波片固定在所述第一電路板一側並覆蓋所述通槽,所述感光組件還包括第二電路板,所述第二電路板固定在所述第一電路板背離所述濾波片的一側並與所述第一電路板電連接,所述感光芯片與所述第二電路板電連接。
優選地,所述感光芯片通過導線與所述第二電路板電連接,所述導線收容在所述通槽內。
優選地,所述感光芯片邊緣設置第一電連接部,所述第二電路板上設置有對應所述第一電連接部的第二電連接部,所述導線的兩端分別焊接於所述第一電連接部和所述第二電連接部。
優選地,所述第一電路板與所述第二電路板通過一連接件固定並電連接。
優選地,所述連接件為導電膠。
優選地,所述攝像頭裝置包括一安裝座,所述安裝座固定設置在所述第一電路板上並架設於所述濾波片上方,所述鏡頭組件和所述驅動器設置在所述安裝座上,所述驅動器與所述第一電路板電連接。
優選地,所述安裝座上開設安裝槽,所述驅動器具有與所述安裝槽連通的內腔,所述鏡頭組件安裝在所述驅動器的內腔並可以在所述內腔和所述安裝槽組成的空間內移動。
優選地,所述攝像頭裝置還包括一電連接元件,電連接於所述第一電路板,所述電連接元件用於連接外部電源或電設備。
一種移動終端,所述移動終端包括上述任一項所述的攝像頭裝置。
上述攝像頭裝置和具有該攝像頭裝置的移動終端本通過將感光芯片設置在第一電路板上的通槽內,並利用第二電路板降低所述感光芯片與所述第一電路板的電連接位置,使得所述濾波片可以直接設置於所述第一電路板上,消除所述濾波片與所述第一電路板之間的距離,無需另外設置安裝所述濾波片的支架和預留所述感光芯片的安裝空間,從而達到減少攝像頭裝置的厚度尺寸的目的。
下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。
請參閱圖1和圖2,攝像頭裝置100包括鏡頭組件10、驅動器20和感光組件40,所述驅動器20用於驅動所述鏡頭組件10以調整所鏡頭組件10的焦距,所述感光組件40設置在所述鏡頭組件10的底部。所感光組件40包括濾波片41、感光芯片42、第一電路板43和第二電路板44。所述第一電路板43上開設通槽434,所述感光芯片42收容在所述通槽434內。所述濾波片41固定在所述第一電路板43一側並覆蓋所述通槽434。所述第二電路板44固定在所述第一電路板43背離所述濾波片41的一側並與所述第一電路板43電連接,所述感光芯片42與所述第二電路板44電連接。
所述攝像頭裝置100包括一安裝座30,所述安裝座30固定設置在所述第一電路板43上並架設於所述濾波片41上方。所述鏡頭組件10和所述驅動器20設置在所述安裝座30上,所述驅動器20與所述第一電路板43電連接。具體地,所述安裝座30的上端面設置第一固定件31,所述驅動器20通過所述第一固定件31固定安裝在所述安裝座30上。所述安裝座30的下端面通過第二固定件431固定設置所述第一電路板43上。在一實施例中,所述第一固定件31和所述第二固定件431可以是黏合膠、熱熔膠等,使所述第一電路板43、所述驅動器20和所述安裝座30之間通過黏接固定。
所述安裝座30上開設安裝槽33,所述安裝槽33貫穿所述安裝座30,所述濾波片41位於所述安裝槽33下方。所述驅動器20具有與所述安裝槽33連通的內腔21,所述鏡頭組件10與所述驅動器20傳動連接並安裝在所述驅動器20的內腔21中。所述驅動器20可以驅動所述鏡頭組件10在所述內腔21和所述安裝槽33組成的空間內上下移動。所述安裝座30的側邊還開設有凹槽32,部分第一電路板43從所述凹槽32露出。所述驅動器20下端設置有對應所述凹槽32的支腳22,所述驅動器20固定在所述安裝座上時,所述支腳22收容在所述凹槽32內並抵觸所述第一電路板43。所述驅動器20可以通過所述支腳22與所述第一電路板43電連接。
請參閱圖3和圖4,所述第一電路板43上的通槽434的邊緣設置第三固定件432,所述濾波片41通過所述第三固定件432固定設置在所述第一電路板43上並覆蓋所述通槽434。在一實施例中,所述第三固定件432可以是黏合膠、熱熔膠等,使所述第一電路板43和所述濾波片41之間通過黏接固定。所述第二電路板44大致呈方框形,通過一連接件45(見圖6)設置於所述第一電路板43的底部。在一實施例中,所述第二電路板44優選為一柔性電路板,所述連接件45為導電膠,優選為各向異性導電膠膜(Anisotropic conductive film, ACF),所述第二電路板44通過所述連接件45與所述第一電路板電連接。ACF膠只在Z方向上導電,而X,Y方向上不導電,即只在圖6視角的豎直方向上導電,不在水平方向上導電,從而避免第一電路板43與第二電路板44的側邊接觸發生短路。在另一實施例中,所述第一電路板43和所述第二電路板44通過鍍銅等技術進行電連接,所述連接件45為可以進行鍍銅或錫焊的電連接件。
所述感光芯片42邊緣設置第一電連接部422,所述第二電路板44上設置有對應所述第一電連接部422的第二電連接部441。所述感光芯片42通過至少一根導線421與所述第二電路板44電連接。所述第一電連接部422和所述第二電連接部441均包括多個電路介面,所述導線421的兩端分別焊接於所述第一電連接部422和所述第二電連接部441上對應的電路介面處。
請繼續參閱圖5和圖6,所述攝像頭裝置100還包括第一蓋板46,所述第一蓋板46固定設置在所述第二電路板44背離所述第一電路板43的一側,即所述第二電路板44的底面。收容在所述通槽434內的所述感光芯片42固定設置在所述第一蓋板46上對應所述通槽434的區域。在一實施例中,所述第一蓋板46可以是一鋼板或其他金屬板,覆蓋在所述攝像頭裝置100的底部,保護所述攝像頭裝置100的內部結構的同時,還用於散失所述感光芯片42產生的熱量。除金屬材料外,所述第一蓋板46還可以由其他高強度材料製成。所述感光芯片42可以通過熱熔膠或黏合膠等貼附於所述第一蓋板46表面,在其他實施例中,所述感光芯片42還可以通過焊接或表面貼片技術等固定設置在所述第一蓋板46上。
貼附在所述第一蓋板46上所述感光芯片42容置在所述通槽434和所述第二電路板44的中心通孔組成的空間內,所述導線421也收容在所述通槽434內。換句話說,所述感光芯片42上端面低於所述第一電路板43的上端面,所述導線421的最高點低於所述第一電路板43的上端面。在傳統技術方案中,感光芯片42和導線421直接設置在第一電路板43表面,濾波片41不得不與第一電路板43間隔設置。本申請的技術方案通過將感光芯片42和導線421設置在第一電路板43上的通槽內,再利用第二電路板44降低所述感光芯片與所述第一電路板的電連接位置以降低所述導線421的最高點,使得所述濾波片41可以直接設置於所述第一電路板43上,消除所述濾波片41與所述第一電路板43之間的距離,達到減少攝像頭裝置100的厚度尺寸的目的,無需另外設置濾波片41的支架和預留所述感光芯片42及其導線421的安裝空間,將攝像頭裝置100的厚度尺寸至少減少0.36mm。
請再次參閱圖1和圖2,所述攝像頭裝置100還包括一電連接元件50,用於連接外部電源或電設備。所述電連接元件50包括第三電路板51、第二蓋板52和電連接器53。所述第三電路板51通過一連接板433電連接於所述第一電路板43。所述第二蓋板52貼附於所述第三電路板51的一側,用於保護所述第三電路板51。所述電連接器53設置在所述第三電路板51背離所述第二蓋板52的一側,所述電連接元件50通過所述電連接器53與外部電源或電設備連接。
請參閱圖7,本申請還提供一種移動終端200,所述移動終端包括處理器201和上述攝像頭裝置100。所述處理器201電連接所述攝像頭裝置100的電連接元件50,以控制所述攝像頭裝置100。
以上實施方式僅用以說明本發明的技術方案而非限制,儘管參照以上較佳實施方式對本發明進行了詳細說明,本領域的普通技術人員應當理解,可以對本發明的技術方案進行修改或等同替換都不應脫離本發明技術方案的精神和範圍。
100:攝像頭裝置 10:鏡頭組件 20:驅動器 21:內腔 22:支腳 30:安裝座 31:第一固定件 32:凹槽 33:安裝槽 40:感光組件 41:濾波片 42:感光芯片 421:導線 422:第一電連接部 43:第一電路板 431:第二固定件 432:第三固定件 433:連接板 434:通槽 44:第二電路板 441:第二電連接部 45:連接件 46:第一蓋板 50:電連接元件 51:第三電路板 52:第二蓋板 53:電連接器 200:移動終端 201:處理器
圖1為攝像頭裝置在一實施例中的結構示意圖。
圖2為圖1攝像頭裝置的分解結構示意圖。
圖3為圖1攝像頭裝置的感光組件的結構示意圖。
圖4為圖3感光組件的分機結構示意圖。
圖5為圖1的攝像頭裝置沿V-V方向的剖面圖。
圖6為圖5中VI處的局部放大圖。
圖7為移動終端在一實施例中的結構示意圖。
100:攝像頭裝置
10:鏡頭組件
20:驅動器
21:內腔
22:支腳
30:安裝座
31:第一固定件
32:凹槽
33:安裝槽
40:感光組件
41:濾波片
42:感光芯片
421:導線
43:第一電路板
431:第二固定件
432:第三固定件
433:連接板
434:通槽
44:第二電路板
46:第一蓋板
50:電連接組件
51:第三電路板
52:第二蓋板
53:電連接器

Claims (9)

  1. 一種攝像頭裝置,包括: 鏡頭組件; 驅動器,用於驅動所述鏡頭組件;和 感光組件,設置在所鏡頭組件的底部,所述感光組件包括濾波片、感光芯片和第一電路板; 其中,所述第一電路板上開設通槽,所述感光芯片收容在所述通槽內,所述濾波片固定在所述第一電路板一側並覆蓋所述通槽,所述感光組件還包括第二電路板,所述第二電路板固定在所述第一電路板背離所述濾波片的一側並與所述第一電路板電連接,所述感光芯片與所述第二電路板電連接。
  2. 如請求項1所述的攝像頭裝置,其中:所述感光芯片通過導線與所述第二電路板電連接,所述導線收容在所述通槽內。
  3. 如請求項2所述的攝像頭裝置,其中:所述感光芯片邊緣設置第一電連接部,所述第二電路板上設置有對應所述第一電連接部的第二電連接部,所述導線的兩端分別焊接於所述第一電連接部和所述第二電連接部。
  4. 如請求項1所述的攝像頭裝置,其中:所述第一電路板與所述第二電路板通過一連接件固定並電連接。
  5. 如請求項4所述的攝像頭裝置,其中:所述連接件為導電膠。
  6. 如請求項1所述的攝像頭裝置,其中:所述攝像頭裝置包括一安裝座,所述安裝座固定設置在所述第一電路板上並架設於所述濾波片上方,所述鏡頭元件和所述驅動器設置在所述安裝座上,所述驅動器與所述第一電路板電連接。
  7. 如請求項6所述的攝像頭裝置,其中:所述安裝座上開設安裝槽,所述驅動器具有與所述安裝槽連通的內腔,所述鏡頭元件安裝在所述驅動器的內腔並可以在所述內腔和所述安裝槽組成的空間內移動。
  8. 如請求項1所述的攝像頭裝置,其中:所述攝像頭裝置還包括一電連接元件,電連接於所述第一電路板,所述電連接元件用於連接外部電源或電設備。
  9. 一種移動終端,其中,所述移动终端包括請求項1至請求項8任一項所述的攝像頭裝置。
TW108129368A 2019-08-12 2019-08-16 攝像頭裝置及移動終端 TWI736954B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910741034.9A CN112399031B (zh) 2019-08-12 2019-08-12 摄像头装置及移动终端
CN201910741034.9 2019-08-12

Publications (2)

Publication Number Publication Date
TW202107189A true TW202107189A (zh) 2021-02-16
TWI736954B TWI736954B (zh) 2021-08-21

Family

ID=74567645

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108129368A TWI736954B (zh) 2019-08-12 2019-08-16 攝像頭裝置及移動終端

Country Status (3)

Country Link
US (1) US10965851B2 (zh)
CN (1) CN112399031B (zh)
TW (1) TWI736954B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115473988A (zh) * 2022-08-04 2022-12-13 荣耀终端有限公司 摄像模组以及电子设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210724991U (zh) * 2019-08-14 2020-06-09 南昌欧菲光电技术有限公司 底座、摄像模组及电子设备
CN114500697B (zh) * 2021-07-16 2023-01-03 荣耀终端有限公司 电子设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160241787A1 (en) * 2013-09-27 2016-08-18 Sharp Kabushiki Kaisha Camera module
CN105321973B (zh) * 2015-09-25 2019-01-22 江西芯创光电有限公司 一种覆晶摄像头及其制作方法
CN105611135B (zh) * 2015-11-13 2019-03-19 宁波舜宇光电信息有限公司 系统级摄像模组及其电气支架和制造方法
CN205081864U (zh) * 2015-11-19 2016-03-09 江西芯创光电有限公司 摄像头模组
KR20180093963A (ko) * 2015-12-01 2018-08-22 닝보 써니 오포테크 코., 엘티디. 촬상 모듈 및 그의 전기적 지지체
WO2017140118A1 (zh) * 2016-02-18 2017-08-24 宁波舜宇光电信息有限公司 阵列摄像模组及其模塑感光组件、线路板组件和制造方法以及电子设备
US10848657B2 (en) * 2016-04-29 2020-11-24 Lg Innotek Co., Ltd. Camera module having a slim overall structure and portable device comprising same
CN108363159B (zh) * 2017-01-26 2023-04-07 宁波舜宇光电信息有限公司 一镜头和摄像模组及其制造方法
CN110089101B (zh) * 2017-02-08 2023-08-08 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和制造方法以及电子设备
US10401590B2 (en) * 2017-11-07 2019-09-03 Google Llc Embeddable camera with lens actuator
CN208143327U (zh) * 2018-01-05 2018-11-23 江西盛泰光学有限公司 一种摄像头模组内带油墨丝印的滤光片结构
CN108055444A (zh) * 2018-01-11 2018-05-18 维沃移动通信有限公司 一种摄像头模组和移动终端
CN114721201B (zh) * 2018-07-25 2024-03-08 台湾东电化股份有限公司 感光组件驱动机构
CN208782913U (zh) * 2018-08-07 2019-04-23 宁波舜宇光电信息有限公司 一种摄像模组和电子设备
CN208522861U (zh) * 2018-08-30 2019-02-19 Oppo广东移动通信有限公司 镜头组件、摄像头模组及电子装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115473988A (zh) * 2022-08-04 2022-12-13 荣耀终端有限公司 摄像模组以及电子设备
CN115473988B (zh) * 2022-08-04 2023-12-05 荣耀终端有限公司 摄像模组以及电子设备

Also Published As

Publication number Publication date
CN112399031A (zh) 2021-02-23
CN112399031B (zh) 2022-07-26
TWI736954B (zh) 2021-08-21
US20210051251A1 (en) 2021-02-18
US10965851B2 (en) 2021-03-30

Similar Documents

Publication Publication Date Title
TWI736954B (zh) 攝像頭裝置及移動終端
JP4668036B2 (ja) 撮像素子のfpcに対する取り付け構造
JP5277105B2 (ja) カメラモジュール
KR20170056439A (ko) 전기적 지지체를 구비한 시스템 레벨 카메라 모듈 및 그 제조 방법
CN108174080B (zh) 一种摄像头模组及移动终端
EP3706405B1 (en) Image capture module of electronic device
KR20130057257A (ko) 카메라 모듈
TW202321804A (zh) 圖像感測器基板
CN112702498B (zh) 摄像头模组及电子设备
US8054369B2 (en) Image capturing device
KR20180092362A (ko) 액체 렌즈를 포함하는 카메라 모듈 및 광학 기기
CN216930117U (zh) 感光模块、摄像装置及电子设备
CN114422681B (zh) 驱动机构、驱动机构组合、摄像头模组及电子设备
CN213718044U (zh) 摄像模组和电子设备
CN211557351U (zh) 感光组件、摄像头模组及电子设备
TWI707190B (zh) 鏡頭模組
CN210780975U (zh) 摄像模组及电子设备
KR20140023822A (ko) 카메라 모듈
CN113259568A (zh) 一种电路板组件、摄像模组及电子设备
CN113497868A (zh) 感光组件、摄像头模组及电子设备
KR100803275B1 (ko) 카메라장치 및 그 제조방법
KR100947967B1 (ko) 카메라 모듈 및 그 제조방법
WO2021196221A1 (zh) 感光组件、摄像头模组及电子设备
JP2020092398A (ja) 撮像モジュール及び携帯電子機器
WO2017113748A1 (zh) 成像模组及电子装置