TW202104339A - 密封用樹脂組合物以及電子零件裝置 - Google Patents

密封用樹脂組合物以及電子零件裝置 Download PDF

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Publication number
TW202104339A
TW202104339A TW109117629A TW109117629A TW202104339A TW 202104339 A TW202104339 A TW 202104339A TW 109117629 A TW109117629 A TW 109117629A TW 109117629 A TW109117629 A TW 109117629A TW 202104339 A TW202104339 A TW 202104339A
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TW
Taiwan
Prior art keywords
resin composition
sealing
curing agent
mass
resin
Prior art date
Application number
TW109117629A
Other languages
English (en)
Chinese (zh)
Inventor
遠藤貴訓
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202104339A publication Critical patent/TW202104339A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW109117629A 2019-05-30 2020-05-27 密封用樹脂組合物以及電子零件裝置 TW202104339A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-101664 2019-05-30
JP2019101664 2019-05-30

Publications (1)

Publication Number Publication Date
TW202104339A true TW202104339A (zh) 2021-02-01

Family

ID=73553471

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109117629A TW202104339A (zh) 2019-05-30 2020-05-27 密封用樹脂組合物以及電子零件裝置

Country Status (4)

Country Link
JP (1) JPWO2020241594A1 (ja)
CN (1) CN113891913A (ja)
TW (1) TW202104339A (ja)
WO (1) WO2020241594A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7336419B2 (ja) 2020-06-08 2023-08-31 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物、熱硬化性エポキシ樹脂シート、及びその硬化物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03207746A (ja) * 1990-01-10 1991-09-11 Fujitsu Ltd エポキシ樹脂組成物
JP2713320B2 (ja) * 1991-11-11 1998-02-16 富士通株式会社 エポキシ樹脂組成物
JPH06136093A (ja) * 1992-09-08 1994-05-17 Fujitsu Ltd エポキシ樹脂組成物
JP2970969B2 (ja) * 1992-05-21 1999-11-02 富士通株式会社 エポキシ樹脂組成物
JPH04348121A (ja) * 1990-08-27 1992-12-03 Fujitsu Ltd エポキシ樹脂組成物
JPH04216820A (ja) * 1990-12-19 1992-08-06 Fujitsu Ltd エポキシ樹脂組成物
JPH05170876A (ja) * 1991-12-19 1993-07-09 Fujitsu Ltd エポキシ樹脂組成物
JPH05326754A (ja) * 1992-05-22 1993-12-10 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
JPH06263841A (ja) * 1993-03-12 1994-09-20 Fujitsu Ltd エポキシ樹脂組成物
US8084130B2 (en) * 2006-10-02 2011-12-27 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing and electronic component device

Also Published As

Publication number Publication date
WO2020241594A1 (ja) 2020-12-03
JPWO2020241594A1 (ja) 2020-12-03
CN113891913A (zh) 2022-01-04

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