JPWO2020241594A1 - - Google Patents

Info

Publication number
JPWO2020241594A1
JPWO2020241594A1 JP2021522761A JP2021522761A JPWO2020241594A1 JP WO2020241594 A1 JPWO2020241594 A1 JP WO2020241594A1 JP 2021522761 A JP2021522761 A JP 2021522761A JP 2021522761 A JP2021522761 A JP 2021522761A JP WO2020241594 A1 JPWO2020241594 A1 JP WO2020241594A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021522761A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020241594A1 publication Critical patent/JPWO2020241594A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021522761A 2019-05-30 2020-05-25 Pending JPWO2020241594A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019101664 2019-05-30
PCT/JP2020/020613 WO2020241594A1 (ja) 2019-05-30 2020-05-25 封止用樹脂組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
JPWO2020241594A1 true JPWO2020241594A1 (ja) 2020-12-03

Family

ID=73553471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021522761A Pending JPWO2020241594A1 (ja) 2019-05-30 2020-05-25

Country Status (4)

Country Link
JP (1) JPWO2020241594A1 (ja)
CN (1) CN113891913A (ja)
TW (1) TW202104339A (ja)
WO (1) WO2020241594A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7336419B2 (ja) 2020-06-08 2023-08-31 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物、熱硬化性エポキシ樹脂シート、及びその硬化物

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03207746A (ja) * 1990-01-10 1991-09-11 Fujitsu Ltd エポキシ樹脂組成物
JPH04216820A (ja) * 1990-12-19 1992-08-06 Fujitsu Ltd エポキシ樹脂組成物
JPH04348121A (ja) * 1990-08-27 1992-12-03 Fujitsu Ltd エポキシ樹脂組成物
JPH05132539A (ja) * 1991-11-11 1993-05-28 Fujitsu Ltd エポキシ樹脂組成物
JPH05170876A (ja) * 1991-12-19 1993-07-09 Fujitsu Ltd エポキシ樹脂組成物
JPH05320317A (ja) * 1992-05-21 1993-12-03 Fujitsu Ltd エポキシ樹脂組成物
JPH05326754A (ja) * 1992-05-22 1993-12-10 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
JPH06136093A (ja) * 1992-09-08 1994-05-17 Fujitsu Ltd エポキシ樹脂組成物
JPH06263841A (ja) * 1993-03-12 1994-09-20 Fujitsu Ltd エポキシ樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101090654B1 (ko) * 2006-10-02 2011-12-07 히다치 가세고교 가부시끼가이샤 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03207746A (ja) * 1990-01-10 1991-09-11 Fujitsu Ltd エポキシ樹脂組成物
JPH04348121A (ja) * 1990-08-27 1992-12-03 Fujitsu Ltd エポキシ樹脂組成物
JPH04216820A (ja) * 1990-12-19 1992-08-06 Fujitsu Ltd エポキシ樹脂組成物
JPH05132539A (ja) * 1991-11-11 1993-05-28 Fujitsu Ltd エポキシ樹脂組成物
JPH05170876A (ja) * 1991-12-19 1993-07-09 Fujitsu Ltd エポキシ樹脂組成物
JPH05320317A (ja) * 1992-05-21 1993-12-03 Fujitsu Ltd エポキシ樹脂組成物
JPH05326754A (ja) * 1992-05-22 1993-12-10 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
JPH06136093A (ja) * 1992-09-08 1994-05-17 Fujitsu Ltd エポキシ樹脂組成物
JPH06263841A (ja) * 1993-03-12 1994-09-20 Fujitsu Ltd エポキシ樹脂組成物

Also Published As

Publication number Publication date
WO2020241594A1 (ja) 2020-12-03
TW202104339A (zh) 2021-02-01
CN113891913A (zh) 2022-01-04

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