TW202017683A - 加工系統以及加工方法 - Google Patents

加工系統以及加工方法 Download PDF

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Publication number
TW202017683A
TW202017683A TW108139328A TW108139328A TW202017683A TW 202017683 A TW202017683 A TW 202017683A TW 108139328 A TW108139328 A TW 108139328A TW 108139328 A TW108139328 A TW 108139328A TW 202017683 A TW202017683 A TW 202017683A
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TW
Taiwan
Prior art keywords
processing
light
measurement
energy beam
irradiation
Prior art date
Application number
TW108139328A
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English (en)
Chinese (zh)
Inventor
江上茂樹
立崎陽介
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202017683A publication Critical patent/TW202017683A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW108139328A 2018-10-31 2019-10-30 加工系統以及加工方法 TW202017683A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2018/040626 2018-10-31
PCT/JP2018/040626 WO2020090075A1 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法

Publications (1)

Publication Number Publication Date
TW202017683A true TW202017683A (zh) 2020-05-16

Family

ID=70463641

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108139328A TW202017683A (zh) 2018-10-31 2019-10-30 加工系統以及加工方法

Country Status (6)

Country Link
US (2) US12397367B2 (enExample)
EP (1) EP3875207A4 (enExample)
JP (6) JP7235054B2 (enExample)
CN (4) CN117182292A (enExample)
TW (1) TW202017683A (enExample)
WO (2) WO2020090075A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2022663A (en) * 2018-03-29 2019-10-03 Asml Netherlands Bv Position measurement system, interferometer system and lithographic apparatus
JP7515074B2 (ja) * 2020-06-19 2024-07-12 パナソニックＩｐマネジメント株式会社 レーザ溶接方法および装置
KR20220039966A (ko) * 2020-09-22 2022-03-30 삼성디스플레이 주식회사 빔 교정부를 포함하는 레이저 장치 및 이를 이용한 레이저 조사 방법
WO2022086557A1 (en) * 2020-10-23 2022-04-28 Hewlett-Packard Development Company, L.P. Scanning systems
KR102518030B1 (ko) * 2021-03-25 2023-04-05 한국광기술원 선박의 용접선 작업 처리용 이동 장치
CN118265599A (zh) * 2021-09-13 2024-06-28 株式会社 尼康 加工系统
EP4556154A1 (en) * 2022-07-14 2025-05-21 Nikon Corporation Modeling system
WO2024013930A1 (ja) * 2022-07-14 2024-01-18 株式会社ニコン 造形システム、加工システム、造形方法及び加工方法
CN115255772B (zh) * 2022-07-29 2024-03-22 中国原子能科学研究院 用于放射性样品焊接夹具的自动拧紧装置及自动拧紧方法
WO2025069363A1 (en) * 2023-09-29 2025-04-03 Nikon Corporation Beam scanning apparatus, processing apparatus, and processing method
WO2025079245A1 (ja) * 2023-10-13 2025-04-17 株式会社ニコン 加工システム
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置
CN117564489B (zh) * 2024-01-15 2024-03-26 鑫业诚智能装备(无锡)有限公司 一种半导体晶圆激光打标设备

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3518079B2 (ja) * 1995-07-20 2004-04-12 株式会社デンソー レーザ加工方法
JPH1015684A (ja) * 1996-07-01 1998-01-20 Nikon Corp レーザ加工装置
JPH1058174A (ja) * 1996-08-27 1998-03-03 Nikon Corp レーザ加工装置
JPH115185A (ja) * 1997-06-11 1999-01-12 Nikon Corp レーザ加工装置
JP3410989B2 (ja) 1999-08-02 2003-05-26 住友重機械工業株式会社 精密レーザ照射装置及び制御方法
US7456949B2 (en) * 1999-09-14 2008-11-25 Amo Manufacturing Usa, Llc Methods and systems for laser calibration and eye tracker camera alignment
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP2002067171A (ja) * 2000-08-25 2002-03-05 Canon Inc 目的物生成装置、目的物生成方法、及び記憶媒体
US20030038121A1 (en) * 2001-01-16 2003-02-27 Christensen C. Paul Laser system and method for marking gemstones
JP2002347128A (ja) 2001-05-24 2002-12-04 Nakakin:Kk 光造形品とその製造方法
US20050205778A1 (en) * 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
JP2006337873A (ja) * 2005-06-03 2006-12-14 Fujifilm Holdings Corp 露光装置及び露光方法
CN101479832B (zh) * 2006-06-09 2011-05-11 株式会社尼康 移动体装置、曝光装置和曝光方法以及元件制造方法
JP2008055436A (ja) 2006-08-29 2008-03-13 Sharp Corp レーザ照射装置
JP2008093682A (ja) * 2006-10-10 2008-04-24 Tokyo Electron Ltd レーザ発光装置の位置調整方法
US8098362B2 (en) * 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
US8053279B2 (en) * 2007-06-19 2011-11-08 Micron Technology, Inc. Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
US8378252B2 (en) * 2009-05-29 2013-02-19 Electro Scientific Industries, Inc. Method and apparatus for hybrid resolution feedback of a motion stage
US20100326962A1 (en) * 2009-06-24 2010-12-30 General Electric Company Welding control system
WO2012029142A1 (ja) 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
JP6218770B2 (ja) 2014-06-23 2017-10-25 三菱電機株式会社 レーザ加工装置
US10252466B2 (en) 2014-07-28 2019-04-09 Massachusetts Institute Of Technology Systems and methods of machine vision assisted additive fabrication
CN111687415A (zh) * 2014-11-14 2020-09-22 株式会社尼康 造型装置及造型方法
WO2016121122A1 (ja) * 2015-01-30 2016-08-04 株式会社牧野フライス製作所 レーザ加工機およびレーザ加工方法
JP6395869B2 (ja) * 2015-01-30 2018-09-26 株式会社牧野フライス製作所 レーザ加工機およびアライメント調整方法
JP5947941B1 (ja) * 2015-03-26 2016-07-06 Dmg森精機株式会社 付加加工用ヘッドおよび加工機械
JP5807134B1 (ja) 2015-04-30 2015-11-10 アイエムエス ソフトウェア サービシズ リミテッド 情報処理装置、情報処理方法及びプログラム
JP5948462B1 (ja) 2015-05-19 2016-07-06 株式会社ソディック 積層造形装置
JP2016215251A (ja) 2015-05-22 2016-12-22 三菱重工業株式会社 レーザ切断装置
DE102015012565B3 (de) * 2015-09-25 2016-10-27 Lessmüller Lasertechnik GmbH Vorrichtung und Verfahren zur Erhöhung der Genauigkeit eines OCT-Messsystems für die Lasermaterialbearbeitung
WO2017096050A1 (en) * 2015-12-04 2017-06-08 Raytheon Company Electron beam additive manufacturing
JP6348101B2 (ja) 2015-12-17 2018-06-27 ファナック株式会社 ワークの傾きを考慮したギャップ制御軸の落下防止機能を備えた制御装置
JP6412049B2 (ja) 2016-04-14 2018-10-24 ファナック株式会社 金属粉を供給しながらレーザを照射する加工部を移動させて積層造形を行う積層造形加工方法及び積層造形加工装置
JP6809952B2 (ja) * 2017-03-23 2021-01-06 住友重機械工業株式会社 レーザ加工装置
JP7036129B2 (ja) * 2018-01-31 2022-03-15 株式会社ニコン 加工システム、及び、加工方法

Also Published As

Publication number Publication date
JP2024160010A (ja) 2024-11-08
WO2020090962A1 (ja) 2020-05-07
US20210379693A1 (en) 2021-12-09
WO2020090075A1 (ja) 2020-05-07
JP7409315B2 (ja) 2024-01-09
JPWO2020090075A1 (ja) 2021-09-24
JP2024019574A (ja) 2024-02-09
JPWO2020090962A1 (ja) 2021-09-24
JP7613546B2 (ja) 2025-01-15
EP3875207A4 (en) 2022-12-14
JP7235054B2 (ja) 2023-03-08
CN117182292A (zh) 2023-12-08
US12397367B2 (en) 2025-08-26
JP2025031984A (ja) 2025-03-07
CN117226248A (zh) 2023-12-15
EP3875207A1 (en) 2021-09-08
CN112930242A (zh) 2021-06-08
JP7552756B2 (ja) 2024-09-18
CN117245209A (zh) 2023-12-19
US20250339920A1 (en) 2025-11-06
CN112930242B (zh) 2023-09-29
JP2023057171A (ja) 2023-04-20

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