JP7235054B2 - 加工システム、及び、加工方法 - Google Patents

加工システム、及び、加工方法 Download PDF

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Publication number
JP7235054B2
JP7235054B2 JP2020554701A JP2020554701A JP7235054B2 JP 7235054 B2 JP7235054 B2 JP 7235054B2 JP 2020554701 A JP2020554701 A JP 2020554701A JP 2020554701 A JP2020554701 A JP 2020554701A JP 7235054 B2 JP7235054 B2 JP 7235054B2
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Japan
Prior art keywords
processing
light
light receiving
energy beam
measurement
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JP2020554701A
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English (en)
Japanese (ja)
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JPWO2020090075A1 (ja
Inventor
茂樹 江上
陽介 立崎
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Nikon Corp
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Nikon Corp
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Publication of JPWO2020090075A1 publication Critical patent/JPWO2020090075A1/ja
Priority to JP2023025263A priority Critical patent/JP7552756B2/ja
Application granted granted Critical
Publication of JP7235054B2 publication Critical patent/JP7235054B2/ja
Priority to JP2024151345A priority patent/JP2024160010A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2020554701A 2018-10-31 2018-10-31 加工システム、及び、加工方法 Active JP7235054B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023025263A JP7552756B2 (ja) 2018-10-31 2023-02-21 加工システム、及び、加工方法
JP2024151345A JP2024160010A (ja) 2018-10-31 2024-09-03 加工システム、及び、加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/040626 WO2020090075A1 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023025263A Division JP7552756B2 (ja) 2018-10-31 2023-02-21 加工システム、及び、加工方法

Publications (2)

Publication Number Publication Date
JPWO2020090075A1 JPWO2020090075A1 (ja) 2021-09-24
JP7235054B2 true JP7235054B2 (ja) 2023-03-08

Family

ID=70463641

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2020554701A Active JP7235054B2 (ja) 2018-10-31 2018-10-31 加工システム、及び、加工方法
JP2020554025A Active JP7409315B2 (ja) 2018-10-31 2019-10-31 加工システム、及び、加工方法
JP2023025263A Active JP7552756B2 (ja) 2018-10-31 2023-02-21 加工システム、及び、加工方法
JP2023212250A Active JP7613546B2 (ja) 2018-10-31 2023-12-15 加工システム、及び、加工方法
JP2024151345A Pending JP2024160010A (ja) 2018-10-31 2024-09-03 加工システム、及び、加工方法
JP2024230394A Pending JP2025031984A (ja) 2018-10-31 2024-12-26 加工システム、及び、加工方法

Family Applications After (5)

Application Number Title Priority Date Filing Date
JP2020554025A Active JP7409315B2 (ja) 2018-10-31 2019-10-31 加工システム、及び、加工方法
JP2023025263A Active JP7552756B2 (ja) 2018-10-31 2023-02-21 加工システム、及び、加工方法
JP2023212250A Active JP7613546B2 (ja) 2018-10-31 2023-12-15 加工システム、及び、加工方法
JP2024151345A Pending JP2024160010A (ja) 2018-10-31 2024-09-03 加工システム、及び、加工方法
JP2024230394A Pending JP2025031984A (ja) 2018-10-31 2024-12-26 加工システム、及び、加工方法

Country Status (6)

Country Link
US (2) US12397367B2 (enExample)
EP (1) EP3875207A4 (enExample)
JP (6) JP7235054B2 (enExample)
CN (4) CN112930242B (enExample)
TW (1) TW202017683A (enExample)
WO (2) WO2020090075A1 (enExample)

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NL2022663A (en) * 2018-03-29 2019-10-03 Asml Netherlands Bv Position measurement system, interferometer system and lithographic apparatus
JP7515074B2 (ja) * 2020-06-19 2024-07-12 パナソニックＩｐマネジメント株式会社 レーザ溶接方法および装置
KR20220039966A (ko) * 2020-09-22 2022-03-30 삼성디스플레이 주식회사 빔 교정부를 포함하는 레이저 장치 및 이를 이용한 레이저 조사 방법
WO2022086557A1 (en) * 2020-10-23 2022-04-28 Hewlett-Packard Development Company, L.P. Scanning systems
KR102518030B1 (ko) * 2021-03-25 2023-04-05 한국광기술원 선박의 용접선 작업 처리용 이동 장치
JPWO2023037541A1 (enExample) * 2021-09-13 2023-03-16
JP7786586B2 (ja) * 2022-07-14 2025-12-16 株式会社ニコン 造形システム
JPWO2024013930A1 (enExample) * 2022-07-14 2024-01-18
CN115255772B (zh) * 2022-07-29 2024-03-22 中国原子能科学研究院 用于放射性样品焊接夹具的自动拧紧装置及自动拧紧方法
WO2025069363A1 (en) * 2023-09-29 2025-04-03 Nikon Corporation Beam scanning apparatus, processing apparatus, and processing method
WO2025079245A1 (ja) * 2023-10-13 2025-04-17 株式会社ニコン 加工システム
WO2025094320A1 (ja) * 2023-11-01 2025-05-08 株式会社ニコン データ生成方法、コンピュータプログラム、記録媒体及び加工装置
CN117564489B (zh) * 2024-01-15 2024-03-26 鑫业诚智能装备(无锡)有限公司 一种半导体晶圆激光打标设备

Citations (1)

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JPH1058174A (ja) * 1996-08-27 1998-03-03 Nikon Corp レーザ加工装置
JPH115185A (ja) * 1997-06-11 1999-01-12 Nikon Corp レーザ加工装置
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Also Published As

Publication number Publication date
CN112930242B (zh) 2023-09-29
EP3875207A4 (en) 2022-12-14
JP7613546B2 (ja) 2025-01-15
TW202017683A (zh) 2020-05-16
JPWO2020090075A1 (ja) 2021-09-24
CN117226248A (zh) 2023-12-15
JP2024019574A (ja) 2024-02-09
JP7409315B2 (ja) 2024-01-09
CN117182292A (zh) 2023-12-08
CN112930242A (zh) 2021-06-08
EP3875207A1 (en) 2021-09-08
JP2025031984A (ja) 2025-03-07
CN117245209A (zh) 2023-12-19
WO2020090075A1 (ja) 2020-05-07
JPWO2020090962A1 (ja) 2021-09-24
WO2020090962A1 (ja) 2020-05-07
US20210379693A1 (en) 2021-12-09
US20250339920A1 (en) 2025-11-06
JP7552756B2 (ja) 2024-09-18
JP2024160010A (ja) 2024-11-08
JP2023057171A (ja) 2023-04-20
US12397367B2 (en) 2025-08-26

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