TW202006038A - 反應性稀釋劑、組成物、密封材、硬化物、基板、電子零件、環氧化合物、及化合物之製造方法 - Google Patents

反應性稀釋劑、組成物、密封材、硬化物、基板、電子零件、環氧化合物、及化合物之製造方法 Download PDF

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Publication number
TW202006038A
TW202006038A TW108117159A TW108117159A TW202006038A TW 202006038 A TW202006038 A TW 202006038A TW 108117159 A TW108117159 A TW 108117159A TW 108117159 A TW108117159 A TW 108117159A TW 202006038 A TW202006038 A TW 202006038A
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TW
Taiwan
Prior art keywords
compound
composition
component
epoxy
present
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Application number
TW108117159A
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English (en)
Chinese (zh)
Inventor
高嶋務
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日商Ｊｘｔｇ能源股份有限公司
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Publication of TW202006038A publication Critical patent/TW202006038A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/22—Ethers with hydroxy compounds containing no oxirane rings with monohydroxy compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW108117159A 2018-07-17 2019-05-17 反應性稀釋劑、組成物、密封材、硬化物、基板、電子零件、環氧化合物、及化合物之製造方法 TW202006038A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-134435 2018-07-17
JP2018-134436 2018-07-17
JP2018134435 2018-07-17
JP2018134436 2018-07-17

Publications (1)

Publication Number Publication Date
TW202006038A true TW202006038A (zh) 2020-02-01

Family

ID=69163514

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108117159A TW202006038A (zh) 2018-07-17 2019-05-17 反應性稀釋劑、組成物、密封材、硬化物、基板、電子零件、環氧化合物、及化合物之製造方法

Country Status (5)

Country Link
JP (1) JPWO2020017141A1 (fr)
KR (1) KR20210032383A (fr)
CN (1) CN112424255A (fr)
TW (1) TW202006038A (fr)
WO (1) WO2020017141A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7241389B2 (ja) * 2019-02-21 2023-03-17 ナミックス株式会社 液状エポキシ樹脂組成物及びそれを硬化させて得られる硬化物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4924026A (en) * 1989-08-11 1990-05-08 International Flavors & Fragrances Inc. Triisobutylene alcohols and esters, uses thereof in perfumery and halogenated intermediates useful for preparing same
US6235931B1 (en) * 1998-12-30 2001-05-22 Shell Oil Company Partial oxidation of polyoxyalkylene polyol compositions to polycarboxylic acid compositions
WO2003014102A1 (fr) * 2001-08-06 2003-02-20 Novartis Ag Polycetides substitues, compositions pharmaceutiques les contenant et leur utilisation pour le traitement de tumeurs
JP2012102230A (ja) * 2010-11-10 2012-05-31 Honda Motor Co Ltd 硬化性樹脂組成物及びこれを用いた電気電子部品
US9988349B2 (en) * 2014-01-03 2018-06-05 Daniel Halsell ESS Direct stereospecific synthesis of unprotected aziridines from olefins

Also Published As

Publication number Publication date
CN112424255A (zh) 2021-02-26
WO2020017141A1 (fr) 2020-01-23
KR20210032383A (ko) 2021-03-24
JPWO2020017141A1 (ja) 2021-09-24

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