TW201943010A - 電路晶粒與互連件之間的自動對位 - Google Patents

電路晶粒與互連件之間的自動對位 Download PDF

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Publication number
TW201943010A
TW201943010A TW108107253A TW108107253A TW201943010A TW 201943010 A TW201943010 A TW 201943010A TW 108107253 A TW108107253 A TW 108107253A TW 108107253 A TW108107253 A TW 108107253A TW 201943010 A TW201943010 A TW 201943010A
Authority
TW
Taiwan
Prior art keywords
circuit die
channels
channel
substrate
cavity
Prior art date
Application number
TW108107253A
Other languages
English (en)
Chinese (zh)
Inventor
安基特 瑪哈詹
米克漢爾 里歐尼多維奇 皮庫羅維斯奇
沙加 亞馬 夏
湯瑪士 喬瑟夫 麥茲勒
卡拉 安 麥爾斯
詹姆士 朱
德瑞莎 瑪麗亞 王 勾奪爾
呂蜜拉 安娜托維納 皮庫羅維斯奇
強納生 偉恩 凱姆林
傑若米 凱文 拉森
Original Assignee
美商3M新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商3M新設資產公司 filed Critical 美商3M新設資產公司
Publication of TW201943010A publication Critical patent/TW201943010A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/01—Manufacture or treatment
    • H10W76/05—Providing fillings in containers, e.g. gas filling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW108107253A 2018-03-06 2019-03-05 電路晶粒與互連件之間的自動對位 TW201943010A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862639234P 2018-03-06 2018-03-06
US62/639,234 2018-03-06

Publications (1)

Publication Number Publication Date
TW201943010A true TW201943010A (zh) 2019-11-01

Family

ID=67846934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108107253A TW201943010A (zh) 2018-03-06 2019-03-05 電路晶粒與互連件之間的自動對位

Country Status (6)

Country Link
US (1) US20210035875A1 (https=)
EP (1) EP3762965A1 (https=)
JP (1) JP2021515983A (https=)
CN (1) CN111819686A (https=)
TW (1) TW201943010A (https=)
WO (1) WO2019171214A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020058815A1 (en) 2018-09-17 2020-03-26 3M Innovative Properties Company Flexible device including conductive traces with enhanced stretchability
EP3906759A4 (en) 2018-12-31 2022-10-12 3M Innovative Properties Company Flexible circuits on soft substrates
US11937381B2 (en) 2018-12-31 2024-03-19 3M Innovative Properties Company Forming electrical interconnections using capillary microfluidics
US12020951B2 (en) 2019-04-29 2024-06-25 3M Innovative Properties Company Methods for registration of circuit dies and electrical interconnects
CN114746988A (zh) 2019-12-04 2022-07-12 3M创新有限公司 包括微图案并使用部分固化以粘附管芯的电路
EP4094289A1 (en) 2020-01-24 2022-11-30 3M Innovative Properties Company Electrical connections to embedded electronic components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5454161A (en) * 1993-04-29 1995-10-03 Fujitsu Limited Through hole interconnect substrate fabrication process
JPH06350233A (ja) * 1993-06-10 1994-12-22 Sankyo Seiki Mfg Co Ltd 回路基板
WO2006100790A1 (ja) * 2005-03-22 2006-09-28 Cluster Technology Co., Ltd. 配線基板の製造方法及び配線基板
JP2006332615A (ja) * 2005-04-25 2006-12-07 Brother Ind Ltd パターン形成方法
JP2008211150A (ja) * 2007-02-28 2008-09-11 Seiko Instruments Inc ３次元構造体部品、及びその製造方法
JP5606908B2 (ja) * 2007-07-19 2014-10-15 クラリアント・インターナショナル・アクチェンゲゼルシャフト 微細伝導性構造体を表面に製造する方法
CN102157510B (zh) * 2010-02-12 2013-11-06 亿光电子工业股份有限公司 近接传感器封装结构及其制作方法
JP2011249357A (ja) * 2010-05-21 2011-12-08 Panasonic Electric Works Co Ltd 回路基板および回路基板の製造方法
CN103190204B (zh) * 2010-11-03 2016-11-16 3M创新有限公司 具有无引线接合管芯的柔性led器件
KR101968635B1 (ko) * 2012-11-22 2019-04-12 삼성전자주식회사 잉크젯 프린팅을 이용한 배선 형성 방법
JP2017147269A (ja) * 2016-02-15 2017-08-24 株式会社デンソー 車両用電装部品の製造方法

Also Published As

Publication number Publication date
EP3762965A1 (en) 2021-01-13
CN111819686A (zh) 2020-10-23
WO2019171214A1 (en) 2019-09-12
JP2021515983A (ja) 2021-06-24
US20210035875A1 (en) 2021-02-04

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