CN111819686A - 电路管芯和互连件之间的自动对准 - Google Patents

电路管芯和互连件之间的自动对准 Download PDF

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Publication number
CN111819686A
CN111819686A CN201980017362.2A CN201980017362A CN111819686A CN 111819686 A CN111819686 A CN 111819686A CN 201980017362 A CN201980017362 A CN 201980017362A CN 111819686 A CN111819686 A CN 111819686A
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CN
China
Prior art keywords
circuit die
channel
channels
substrate
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201980017362.2A
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English (en)
Chinese (zh)
Inventor
安基特·马哈詹
米哈伊尔·L·佩库罗夫斯基
撒格尔·A·沙
托马斯·J·梅茨勒
卡拉·A·迈耶斯
詹姆斯·朱
特雷莎·M·格代尔
柳德米拉·A·佩库罗夫斯基
乔纳森·W·肯灵
杰里米·K·拉森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN111819686A publication Critical patent/CN111819686A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/01—Manufacture or treatment
    • H10W76/05—Providing fillings in containers, e.g. gas filling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
CN201980017362.2A 2018-03-06 2019-02-27 电路管芯和互连件之间的自动对准 Withdrawn CN111819686A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862639234P 2018-03-06 2018-03-06
US62/639,234 2018-03-06
PCT/IB2019/051585 WO2019171214A1 (en) 2018-03-06 2019-02-27 Automatic registration between circuit dies and interconnects

Publications (1)

Publication Number Publication Date
CN111819686A true CN111819686A (zh) 2020-10-23

Family

ID=67846934

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980017362.2A Withdrawn CN111819686A (zh) 2018-03-06 2019-02-27 电路管芯和互连件之间的自动对准

Country Status (6)

Country Link
US (1) US20210035875A1 (https=)
EP (1) EP3762965A1 (https=)
JP (1) JP2021515983A (https=)
CN (1) CN111819686A (https=)
TW (1) TW201943010A (https=)
WO (1) WO2019171214A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020058815A1 (en) 2018-09-17 2020-03-26 3M Innovative Properties Company Flexible device including conductive traces with enhanced stretchability
EP3906759A4 (en) 2018-12-31 2022-10-12 3M Innovative Properties Company Flexible circuits on soft substrates
US11937381B2 (en) 2018-12-31 2024-03-19 3M Innovative Properties Company Forming electrical interconnections using capillary microfluidics
US12020951B2 (en) 2019-04-29 2024-06-25 3M Innovative Properties Company Methods for registration of circuit dies and electrical interconnects
CN114746988A (zh) 2019-12-04 2022-07-12 3M创新有限公司 包括微图案并使用部分固化以粘附管芯的电路
EP4094289A1 (en) 2020-01-24 2022-11-30 3M Innovative Properties Company Electrical connections to embedded electronic components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5454161A (en) * 1993-04-29 1995-10-03 Fujitsu Limited Through hole interconnect substrate fabrication process
JPH06350233A (ja) * 1993-06-10 1994-12-22 Sankyo Seiki Mfg Co Ltd 回路基板
WO2006100790A1 (ja) * 2005-03-22 2006-09-28 Cluster Technology Co., Ltd. 配線基板の製造方法及び配線基板
JP2006332615A (ja) * 2005-04-25 2006-12-07 Brother Ind Ltd パターン形成方法
JP2008211150A (ja) * 2007-02-28 2008-09-11 Seiko Instruments Inc ３次元構造体部品、及びその製造方法
JP5606908B2 (ja) * 2007-07-19 2014-10-15 クラリアント・インターナショナル・アクチェンゲゼルシャフト 微細伝導性構造体を表面に製造する方法
CN102157510B (zh) * 2010-02-12 2013-11-06 亿光电子工业股份有限公司 近接传感器封装结构及其制作方法
JP2011249357A (ja) * 2010-05-21 2011-12-08 Panasonic Electric Works Co Ltd 回路基板および回路基板の製造方法
CN103190204B (zh) * 2010-11-03 2016-11-16 3M创新有限公司 具有无引线接合管芯的柔性led器件
KR101968635B1 (ko) * 2012-11-22 2019-04-12 삼성전자주식회사 잉크젯 프린팅을 이용한 배선 형성 방법
JP2017147269A (ja) * 2016-02-15 2017-08-24 株式会社デンソー 車両用電装部品の製造方法

Also Published As

Publication number Publication date
EP3762965A1 (en) 2021-01-13
WO2019171214A1 (en) 2019-09-12
JP2021515983A (ja) 2021-06-24
US20210035875A1 (en) 2021-02-04
TW201943010A (zh) 2019-11-01

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Application publication date: 20201023

WW01 Invention patent application withdrawn after publication