TW201941222A - 導電性樹脂組成物及其製造方法 - Google Patents

導電性樹脂組成物及其製造方法 Download PDF

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TW201941222A
TW201941222A TW108109368A TW108109368A TW201941222A TW 201941222 A TW201941222 A TW 201941222A TW 108109368 A TW108109368 A TW 108109368A TW 108109368 A TW108109368 A TW 108109368A TW 201941222 A TW201941222 A TW 201941222A
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resin composition
dye
conductive
thermoplastic resin
conductive resin
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TW108109368A
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塚口晉悟
青柳太洋
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日商大日精化工業股份有限公司
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Publication of TW201941222A publication Critical patent/TW201941222A/zh

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Abstract

本發明係提供一種可輕易維持熱可塑性樹脂原有特性、即使導電性填料之調配量少仍顯示更優異之導電性的導電性樹脂組成物。本發明之導電性樹脂組成物係含有：聚碳酸酯或聚烯烴等之熱可塑性樹脂；及碳奈米管等導電性填料者。並進一步含有屬於用於提升導電性之成分的紫環酮系染料或雙偶氮系染料等染料；其將含有熱可塑性樹脂、導電性填料及染料的原料混合物，於熱可塑性樹脂之融點以上之溫度條件下進行混練或成型而可獲得。

Description

導電性樹脂組成物及其製造方法
本發明係關於導電性樹脂組成物及導電性樹脂組成物之製造方法。
習知係對電絕緣性之熱可塑性樹脂調配導電性填料，而對熱可塑性樹脂賦予導電性。作為依此種目的所使用之導電性填料，除了金屬纖維或金屬粉末等之金屬材料之外，有如碳奈米管或碳黑等之碳系材料等。將此等導電性填料調配於熱可塑性樹脂而得的導電性樹脂組成物，係使用作為例如電子‧電氣零件等之構成材料。
調配於熱可塑性樹脂中之導電性填料的量，若為賦予既定導電性之範圍內，則較佳為盡可能地少。若減少導電性填料之調配量，則容易維持熱可塑性樹脂原有之特性，且在成本方面亦有利。
而且，近年來為了更加提升所得導電性樹脂組成物之導電性，已檢討控制導電性填料之形狀或比表面積等之物性。又，亦嘗試了進一步調配用於提升導電性之成分。具體而言，已提案有將纖維徑為既定範圍內之碳纖維依其破斷率抑制為20%以下而調配於熱可塑性樹脂而得的導電性之樹脂組成物(專利文獻1)。又，已提案有將碳系之導電性填料及烷基磺酸金屬鹽調配於熱可塑性 樹脂的導電性之樹脂組成物(專利文獻2)。
尚且，已知所得樹脂組成物之導電性將視成型方法而變動。其中，於射出成型的情況，有依越高速射出則導電性越降低的傾向。為了不依賴成型方法而製造導電性優異的樹脂組成物，已在例如導電性材料之增量、或與樹脂間之相溶性低之第三成分之添加等材料面方面下了工夫(專利文獻3)
[先前技術文獻] [專利文獻]
[專利文獻1]日本專利特開2006-097006號公報
[專利文獻2]日本專利特開2007-277313號公報
[專利文獻3]日本專利第6076542號公報
然而，即使是專利文獻1及2所提案之樹脂組成物，仍未必稱得上是充分提升了導電性。又，專利文獻1提案之樹脂組成物由於必須嚴密地控制導電性填料之碳纖維之形狀等而製造，故稍欠缺通用性。再者，專利文獻2提案之樹脂組成物由於含有烷基磺酸金屬鹽作為必須成分，故亦有容易損及熱可塑性樹脂原有特性之虞。
又，藉由導電性材料之增量或第三成分之添加等努力，可得到某程度導電性良好的樹脂組成物。然而，由於熱可塑性樹脂以外之成分的含有比例增加，故有容易損及熱可塑性樹脂原有特性的課題。再者，期望有不依賴成型方法、而可穩定製造導電性 優異之導電性樹脂組成物的方法。
本發明係有鑑於此種習知技術所具有之問題點，其課題在於提供可輕易維持熱可塑性樹脂原有特性、即使導電性填料之調配量少仍顯示優異導電性的導電性樹脂組成物。又，本發明之課題在於提供上述導電性樹脂組成物之簡便之製造方法。
本案發明人等為了解決上述課題而潛心研究，結果發現藉由將具有過去未知之所謂「提升導電性」之機能染料添加至樹脂中，可解決上述課題，遂完成本發明。
亦即，根據本發明，提供以下所示之導電性樹脂組成物。
[1]一種導電性樹脂組成物，係含有熱可塑性樹脂及導電性填料者，其進一步含有屬於用於提升導電性之成分的染料，其將含有上述熱可塑性樹脂、上述導電性填料及上述染料的原料混合物，於上述熱可塑性樹脂之融點以上之溫度條件下進行混練或成型而得。
[2]如上述[1]之導電性樹脂組成物，其係將上述原料混合物於上述染料之融點以上之溫度條件下進行混練或成型而得。
[3]如上述[1]或[2]之導電性樹脂組成物，其中，上述熱可塑性樹脂為聚碳酸酯、聚酯、聚醯胺及聚苯硫之至少任一者。
[4]如上述[1]至[3]中任一項之導電性樹脂組成物，其中，上述染料為紫環酮(perinone)系染料、苝系染料、喹啉系染料、蒽醌系染料、次甲基偶氮系染料、雙偶氮系染料及硫系染料之至少任一者。
[5]如上述[1]至[4]中任一項之導電性樹脂組成物，其中，上述 導電性填料為碳黑、多壁碳奈米管、單壁碳奈米管、石墨及石墨烯之至少任一者。
[6]如上述[1]至[5]中任一項之導電性樹脂組成物，其中，上述染料之含量係相對於上述熱可塑性樹脂與上述導電性填料之合計100質量份，為0.01~5質量份；上述導電性填料之含量係相對於上述熱可塑性樹脂與上述導電性填料之合計100質量份，為0.01~30質量份。
又，根據本發明，提供以下所示之導電性樹脂組成物之製造方法。
[7]一種導電性樹脂組成物之製造方法，係上述[1]至[6]中任一項之導電性樹脂組成物之製造方法，其具有：將含有熱可塑性樹脂、導電性填料及染料之原料混合物，於上述熱可塑性樹脂之融點以上之溫度條件下進行混練或成型的步驟。
[8]如上述[7]之導電性樹脂組成物之製造方法，其中，將上述原料混合物於上述染料之融點以上之溫度條件下進行混練或成型。
[9]如上述[7]或[8]之導電性樹脂組成物之製造方法，其中，將上述原料混合物進行射出成型。
根據本發明，可提供即使導電性填料之調配量少仍顯示更優異之導電性的導電性樹脂組成物。又，根據本發明，可提供上述導電性樹脂組成物之簡便之製造方法。
<導電性樹脂組成物>
以下說明本發明之實施形態，但本發明並不限定於以下實施形態。本發明之導電性樹脂組成物係含有熱可塑性樹脂及導電性填料者，並進一步含有屬於用於提升導電性之成分的染料。而且，本發明之導電性樹脂組成物係將含有熱可塑性樹脂、導電性填料及染料之原料混合物，於熱可塑性樹脂之融點以上之溫度條件下、較佳為染料之融點以上之溫度條件下進行混練或成型而得者。以下詳細說明本發明之導電性樹脂組成物。
(熱可塑性樹脂)
本發明之導電性樹脂組成物係含有熱可塑性樹脂。作為熱可塑性樹脂，可舉例如聚丙烯、高密度聚乙烯、低密度聚乙烯、直鏈低密度聚乙烯、聚苯硫、液晶聚合物、不飽和聚酯、聚胺基甲酸酯、丙烯酸系樹脂、聚醚醚酮(PEEK)、聚醚碸、聚醚硫、聚苯乙烯、聚苯醚、丙烯腈-丁二烯-苯乙烯共聚合體(ABS)、聚氯乙烯(PVC)、聚縮醛(POM)等。其中，較佳為聚碳酸酯、聚酯、聚胺及聚苯硫。此等熱可塑性樹脂可單獨使用1種或組合使用2種以上。
導電性樹脂組成物中之熱可塑性樹脂的含量，係以導電性樹脂組成物之全體為基準，較佳為70質量%以上。若熱可塑性樹脂之含量未滿70質量%，則有成形性降低的情形。
(導電性填料)
本發明之導電性樹脂組成物係含有導電性填料。作為導電性填 料，可舉例如科琴黑、乙炔黑、爐黑等碳黑之外，有如多壁碳奈米管、單壁碳奈米管、疊杯型碳奈米管、石墨、石墨烯等。其中，較佳為碳黑、多壁碳奈米管、單壁碳奈米管、疊杯型碳奈米管，更佳為碳黑、多壁碳奈米管、單壁碳奈米管。此等導電性填料可單獨使用1種或組合使用2種以上。
導電性樹脂組成物中之導電性填料的含量，係相對於熱可塑性樹脂與導電性填料之合計100質量份，較佳為0.01~30質量份、更佳0.5~25質量份。相對於熱可塑性樹脂與導電性填料之合計100質量份，若導電性填料之含量為未滿0.01質量份，則有導電性樹脂組成物及使用其(進行成型)所得之成形物的導電性不足的情形。另一方面，相對於熱可塑性樹脂與導電性填料之合計100質量份，若導電性填料之含量超過30質量份，則有容易損及熱可塑性樹脂原有特性的傾向。
(染料)
本發明之導電性樹脂組成物係含有屬於用於提升導電性之成分的染料。若比較染料與導電性填料，則染料與熱可塑性樹脂間之相溶性較高。因此，可認為藉由含有染料，與熱可塑性樹脂間之相溶性相對較低之導電性填料容易配向於樹脂組成物之表面，導電性樹脂組成物之表面電阻變低(導電性提升)。亦即，染料係具有有助於樹脂中之導電性填料之分散性提升的機能的成分，藉由使染料發揮作為分散材的機能，導電性填料依良好狀態分散於樹脂中，推測所得樹脂組成物之導電性降低。從而，本發明之導電性樹脂組成物係即使導電性填料之調配量較少，仍顯示更優異的導電性。再者， 由於可減少導電性填料之調配量，故亦具有容易維持熱可塑性樹脂原有特性的優點。
作為染料，可使用用於對樹脂著色之一般染料(樹脂著色用染料)。作為染料，可舉例如紫環酮系染料、雙偶氮系染料、蒽醌系染料、雜環系染料、苝系染料、偶氮系染料、次甲基系染料、萘二甲醯亞胺系染料、次甲基偶氮系染料、香豆素系染料、蒽吡啶酮系染料、吖系染料、酞菁系染料、硫靛系染料、喹啉系染料、硫系染料等。其中，由可使用較少量便有效提升導電性之方面而言，較佳為紫環酮系染料、苝系染料、喹啉系染料、蒽醌系染料、次甲基偶氮系染料、雙偶氮系染料、及硫系染料，更佳為紫環酮系染料、苝系染料、喹啉系染料、蒽醌系染料、次甲基偶氮系染料、及硫系染料。此等染料可單獨使用1種或組合使用2種以上。
導電性樹脂組成物中染料之含量，係相對於熱可塑性樹脂與導電性填料之合計100質量份，較佳為0.01~5質量份、更佳0.1~3質量份、特佳0.3~1質量份。相對於熱可塑性樹脂與導電性填料之合計100質量份，若染料之含量未滿0.01質量份，則有導電性之提升效果稍不足之情形。另一方面，相對於熱可塑性樹脂與導電性填料之合計100質量份，若染料含量超過5質量份，則有滲出或機械物性降低等之虞。
(其他成分)
導電性樹脂組成物中，視需要亦可調配熱可塑性樹脂、導電性填料及染料以外的成分(其他成分)。作為其他成分，可舉例如抗氧 化劑、難燃劑、滑劑等。
<導電性樹脂組成物之製造方法>
本發明之導電性樹脂組成物係將上述之含有熱可塑性樹脂、導電性填料及染料之原料混合物，於熱可塑性樹脂之融點以上之溫度條件下進行混練或成型而得者。亦即，本發明之導電性樹脂組成物之製造方法係具有：將上述原料混合物於熱可塑性樹脂之融點以上之溫度條件下進行混練或成型的步驟(混練‧成型步驟)。
於混練‧成型步驟中，例如將熱可塑性樹脂、導電性填料及視需要所調配之其他成分進行溶融混練後，使用擠出機而造粒為顆粒。熔融混練之方法並無特別限定，可採用公知之熔融混練方法。具體而言，使用以滾筒或漢歇爾混合機為首的高速混合機等各種混合機將各成分事先混合後，藉由班伯里混合機、輥、塑性儀、單軸擠出機、雙軸擠出機、捏合器等混練裝置進行熔融混練的方法。其中，由生產效率的觀點而言，較佳為使用擠出機之方法，更佳為使用雙軸擠出機之方法。
接著，將經造粒之顆粒與染料混合而獲得之原料混合物，並將所得原料混合物於熱可塑性樹脂之融點以上之溫度條件下進行混練或成型。藉此，可得到導電性樹脂組成物(導電性樹脂成形物)。若對原料混合物進行混練或成型時之溫度未滿熱可塑性樹脂之融點，則無法得到導電性樹脂組成物。又，較佳係將原料混合物於染料之融點以上之溫度條件下進行混練或成型。若依染料之融點以上之溫度對原料混合物進行混練或成型，可使染料依更良好狀態熔融於熱可塑性樹脂中，可進一步提升所得導電性樹脂組成物之 導電性。
作為成型方法，可採用用於對熱可塑性樹脂進行成型之公知之成型方法。作為成型方法之具體例，可舉例如射出成型法、壓製成型法、擠出成型法等。其中，為了更加提升生產性，較佳係對原料混合物進行射出成型。作為射出成型法，可採用公知之射出成型法。
如上述，通常所得導電性樹脂組成物之導電性係視成型方法而變動。尤其在射出成型的情況，依越高速進行射出則所得製品之導電性越容易降低。相對於此，本發明之導電性樹脂組成物之製造方法中，係將含有屬於用於提升導電性之成分、同時被期待具有作為提升導電性填料分散性之分散劑之機能之染料的原料混合物，依上述特定條件進行混練或成型。因此，即使在藉由射出成型、尤其是高速射出之射出成型對原料混合物進行成型的情況，所得導電性樹脂組成物之導電性仍不易降低，可製造導電性優異的導電性樹脂組成物(成形品)。又，由於即使藉由高速射出之射出成型仍可得到導電性優異的導電性樹脂組成物，故可依短時間製造大量製品，可提高生產性。
[實施例]
以下根據實施例具體說明本發明，但本發明並不限定於此等實施例。又，在未特別限定之前提下，實施例、比較例中之「份」及「%」為質量基準。
<導電性樹脂組成物(射出成型物)之製造> (實施例1)
將聚碳酸酯(商品名「L1225WP」、帝人公司製、融點：約250℃)95份、及多壁碳奈米管(MWNT，商品名「NC7000」、Nanocyl公司製)5份投入至混合機(商品名「Super Mixer型式SMB-20」、川田製作所公司製)，混合1分鐘得到混合物。將所得混合物投入至設定溫度280℃之雙軸擠出機(商品名「TEX30」、日本製鋼所公司製)，進行熔融混練及製造而得到造粒物。將所得造粒物、及Solvent Red 179(商名品「MACROLEX RED E2GGRAN」、LANXESS公司製)0.5份裝入至塑膠袋中混合，得到原料混合物1。
使用射出成型機(型式「J110AD-180H」，日本製鋼所製)，依滾筒溫度320℃、模具溫度120℃之條件將所得原料混合物1依低速(20mm/s)及高速(300mm/s)之2種模式進行射出成型，而製造板(150mm×80mm×2mmt)。
(實施例2~20、比較例1~7)
除了設為表1-1及1-2所示配方(單位：份)以外，其餘與實施例1同樣地進行而調製原料混合物2~24。又，除了取代原料混合物1，分別使用所調製之原料混合物2~24，以及將滾筒溫度設為表3所示溫度(成型溫度)以外，其餘與上述實施例1同樣進行製造板。所使用之染料之細節示於表2。又，聚對苯二甲酸丁二酯之融點為約220℃，聚苯硫之融點為約280℃，聚醯胺6之融點為約225℃。又，表1-1及1-2中之「碳黑」為Denka公司製之乙炔黑(商品名「DENKA BLACK粒狀」)。
<評價(1)> (表面電阻之測定(1))
使用電阻計(商品名「Loresta GP」，型式「MCP-HT450」，Mitsubishi Chemical Analytech公司製)，測定所製造之板的表面電阻。又，探針係使用ASP探針(型號「MCP-TP03P」，Mitsubishi Chemical Analytech公司製)，依施加電壓90V之條件測定板之表面電阻。測定結果示於表3。
<導電性樹脂組成物(壓製成型物)之製造> (實施例21)
將聚碳酸酯(商品名「L1225WP」、帝人公司製、融點：約250℃)100份、及單壁碳奈米管(SWNT，商品名「TUBALL」、OCSiAl公司製)0.03份及Solvent Red 179(商名品「MACROLEX RED E2GGRAN」、紫環酮系染料，融點255℃，LANXESS公司製)0.05份，投入至設定溫度280℃之Laboplast mill(東洋精機公司製)中，進行熔融混練得到樹脂組成物。將所得樹脂組成物使用至設定溫度280℃之壓製成型機(神藤金屬工業所公司製)進行壓製成型，製造1mmt之壓製成形物。
(比較例8)
除了未使用Solvent Red 179以外，其餘與上述實施例21同樣進行製造壓製成型物。
<評價(2)> (表面電阻之測定(2))
與上述「表面電阻之測定(1)」同樣地進行，測定所製造之壓製成型物的表面電阻。其結果，實施例21所得壓製成型物之表面電阻為8.60E+06(Ω/□)，比較例8所得壓製成型物之表面電阻為1.00E+08≦(Ω/□)。
(產業上之可利用性)
本發明之導電性樹脂組成物可用於作為電子、電氣零 件等之構成材料。

Claims (9)

  1. 一種導電性樹脂組成物，係含有熱可塑性樹脂及導電性填料者，其進一步含有屬於用於提升導電性之成分的染料，其將含有上述熱可塑性樹脂、上述導電性填料及上述染料的原料混合物，於上述熱可塑性樹脂之融點以上之溫度條件下進行混練或成型而得。
  2. 如請求項1之導電性樹脂組成物，其係將上述原料混合物於上述染料之融點以上之溫度條件下進行混練或成型而得。
  3. 如請求項1或2之導電性樹脂組成物，其中，上述熱可塑性樹脂為聚碳酸酯、聚酯、聚醯胺及聚苯硫之至少任一者。
  4. 如請求項1或2之導電性樹脂組成物，其中，上述染料為紫環酮(perinone)系染料、苝系染料、喹啉系染料、蒽醌系染料、次甲基偶氮系染料、雙偶氮系染料及硫 系染料之至少任一者。
  5. 如請求項1或2之導電性樹脂組成物，其中，上述導電性填料為碳黑、多壁碳奈米管、單壁碳奈米管、石墨及石墨烯之至少任一者。
  6. 如請求項1或2之導電性樹脂組成物，其中，上述染料之含量係相對於上述熱可塑性樹脂與上述導電性填料之合計100質量份，為0.01~5質量份；上述導電性填料之含量係相對於上述熱可塑性樹脂與上述導電性填料之合計100質量份，為0.01~30質量份。
  7. 一種導電性樹脂組成物之製造方法，係請求項1至6中任一項之導電性樹脂組成物之製造方法，其具有： 將含有熱可塑性樹脂、導電性填料及染料之原料混合物，於上述熱可塑性樹脂之融點以上之溫度條件下進行混練或成型的步驟。
  8. 如請求項7之導電性樹脂組成物之製造方法，其中，將上述原料混合物於上述染料之融點以上之溫度條件下進行混練或成型。
  9. 如請求項7或8之導電性樹脂組成物之製造方法，其中，將上述原料混合物進行射出成型。
TW108109368A 2018-03-20 2019-03-19 導電性樹脂組成物及其製造方法 TW201941222A (zh)

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Publication number Priority date Publication date Assignee Title
US4477608A (en) 1982-08-20 1984-10-16 Ciba-Geigy Corporation Compositions containing graphite
JPS6076542A (ja) 1983-10-03 1985-05-01 Mitsubishi Metal Corp 導電性樹脂
JPS60144367A (ja) 1984-01-05 1985-07-30 Dainichi Seika Kogyo Kk 導電性樹脂組成物の製造方法
US6207344B1 (en) 1999-09-29 2001-03-27 General Electric Company Composition for laser marking
WO2003005378A1 (de) * 2001-07-04 2003-01-16 Ticona Gmbh Elekrisch leitfähige zusammensetzungen und verfahren zu deren herstellung und deren verwendung
US20060108567A1 (en) 2002-07-23 2006-05-25 Charati Sanjay G Conductive poly (arylene ether) compositions and methods of making the same
US8999200B2 (en) * 2002-07-23 2015-04-07 Sabic Global Technologies B.V. Conductive thermoplastic composites and methods of making
DE10259498A1 (de) * 2002-12-19 2004-07-01 Bayer Ag Leitfähige Thermoplaste mit Ruß und Kohlenstoff-Nanofibrillen
JP2006097006A (ja) 2004-08-31 2006-04-13 Showa Denko Kk 導電性樹脂組成物の製造方法及び用途
JP4938315B2 (ja) 2006-01-17 2012-05-23 ダイセルポリマー株式会社 レーザーマーキング用熱可塑性樹脂組成物
JP4878895B2 (ja) 2006-04-03 2012-02-15 旭化成ケミカルズ株式会社 導電性樹脂組成物
JP2010006998A (ja) 2008-06-28 2010-01-14 Mitsubishi Materials Corp 導電性樹脂組成物とその用途
JP6028168B2 (ja) * 2012-11-15 2016-11-16 コニカミノルタ株式会社 液体現像剤
KR20140141145A (ko) 2013-05-31 2014-12-10 제일모직주식회사 전도성 및 충격강도가 우수한 열가소성 수지조성물
JP6261957B2 (ja) 2013-11-11 2018-01-17 旭化成株式会社 熱可塑性樹脂組成物からなる漆黒部品及び自動車内装部品
WO2015095267A1 (en) * 2013-12-18 2015-06-25 Ticona Llc Conductive thermoplastic compositions for use in tubular applications

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