TW201936741A - 毫米波天線用薄膜 - Google Patents
毫米波天線用薄膜 Download PDFInfo
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- TW201936741A TW201936741A TW108118584A TW108118584A TW201936741A TW 201936741 A TW201936741 A TW 201936741A TW 108118584 A TW108118584 A TW 108118584A TW 108118584 A TW108118584 A TW 108118584A TW 201936741 A TW201936741 A TW 201936741A
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- polyimide
- polymer
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- 229920006254 polymer film Polymers 0.000 claims abstract description 9
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- 239000004642 Polyimide Substances 0.000 claims description 66
- 239000002243 precursor Substances 0.000 claims description 58
- 239000011148 porous material Substances 0.000 claims description 51
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 30
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- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 5
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- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 description 2
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- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- DFSUKONUQMHUKQ-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound OC(=O)C1=CC=CC(C(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)(C(F)(F)F)C(F)(F)F)=C1C(O)=O DFSUKONUQMHUKQ-UHFFFAOYSA-N 0.000 description 1
- IFYXKXOINSPAJQ-UHFFFAOYSA-N 4-(4-aminophenyl)-5,5-bis(trifluoromethyl)cyclohexa-1,3-dien-1-amine Chemical group FC(F)(F)C1(C(F)(F)F)CC(N)=CC=C1C1=CC=C(N)C=C1 IFYXKXOINSPAJQ-UHFFFAOYSA-N 0.000 description 1
- WHZMNADTAVKJBU-UHFFFAOYSA-N 4-[1-(3,4-dicarboxyphenyl)-9H-fluoren-2-yl]phthalic acid Chemical compound C(=O)(O)C=1C=C(C=CC=1C(=O)O)C1=C(C=2CC3=CC=CC=C3C=2C=C1)C1=CC(=C(C=C1)C(=O)O)C(=O)O WHZMNADTAVKJBU-UHFFFAOYSA-N 0.000 description 1
- NMEJXGYJALHCPB-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)-1,1,1,3,3,3-hexafluoropropan-2-yl]oxyaniline Chemical compound C1=CC(N)=CC=C1OC(C(F)(F)F)(C(F)(F)F)OC1=CC=C(N)C=C1 NMEJXGYJALHCPB-UHFFFAOYSA-N 0.000 description 1
- IYMMZGRJAMFSKQ-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)propan-2-yloxy]aniline Chemical compound C=1C=C(N)C=CC=1OC(C)(C)OC1=CC=C(N)C=C1 IYMMZGRJAMFSKQ-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- WXAIEIRYBSKHDP-UHFFFAOYSA-N 4-phenyl-n-(4-phenylphenyl)-n-[4-[4-(4-phenyl-n-(4-phenylphenyl)anilino)phenyl]phenyl]aniline Chemical compound C1=CC=CC=C1C1=CC=C(N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC=CC=2)C=C1 WXAIEIRYBSKHDP-UHFFFAOYSA-N 0.000 description 1
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- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
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- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- YOSWQBTXYJJTHV-UHFFFAOYSA-N [amino(phenyl)phosphanyl]benzene Chemical compound C=1C=CC=CC=1P(N)C1=CC=CC=C1 YOSWQBTXYJJTHV-UHFFFAOYSA-N 0.000 description 1
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- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
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- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
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- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
- C08J9/286—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum the liquid phase being a solvent for the monomers but not for the resulting macromolecular composition, i.e. macroporous or macroreticular polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/26—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2201/00—Foams characterised by the foaming process
- C08J2201/04—Foams characterised by the foaming process characterised by the elimination of a liquid or solid component, e.g. precipitation, leaching out, evaporation
- C08J2201/046—Elimination of a polymeric phase
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2201/00—Foams characterised by the foaming process
- C08J2201/04—Foams characterised by the foaming process characterised by the elimination of a liquid or solid component, e.g. precipitation, leaching out, evaporation
- C08J2201/052—Inducing phase separation by thermal treatment, e.g. cooling a solution
- C08J2201/0522—Inducing phase separation by thermal treatment, e.g. cooling a solution the liquid phase being organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/08—Supercritical fluid
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Details Of Aerials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
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| JP2016-145540 | 2016-07-25 | ||
| JP2016145540 | 2016-07-25 | ||
| JP2017075984A JP6567590B2 (ja) | 2016-07-25 | 2017-04-06 | ミリ波アンテナ用フィルム |
| JP2017-075984 | 2017-04-06 |
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| TW201936741A true TW201936741A (zh) | 2019-09-16 |
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| TW108118584A TW201936741A (zh) | 2016-07-25 | 2017-07-25 | 毫米波天線用薄膜 |
| TW106124865A TWI666244B (zh) | 2016-07-25 | 2017-07-25 | 毫米波天線用薄膜 |
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| CN (1) | CN109496222B (enExample) |
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| WO (1) | WO2018020745A1 (enExample) |
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| US20190263995A1 (en) * | 2016-07-25 | 2019-08-29 | Nitto Denko Corporation | Low-dielectric porous polymer film and film for millimeter-wave antenna |
| JP6567722B2 (ja) * | 2017-04-06 | 2019-08-28 | 日東電工株式会社 | ミリ波アンテナ用フィルム |
| JP7397570B2 (ja) * | 2018-02-01 | 2023-12-13 | 東京応化工業株式会社 | 多孔質ポリイミドフィルム原反、その製造方法、及び組成物 |
| JP7257342B2 (ja) | 2018-02-08 | 2023-04-13 | テルモ株式会社 | 医療器具およびこれを用いた癒合促進デバイス |
| CN109280190B (zh) * | 2018-08-01 | 2021-06-04 | 乳源东阳光氟树脂有限公司 | 一种聚酰亚胺多孔薄膜及其制备方法 |
| JP7082932B2 (ja) * | 2018-09-28 | 2022-06-09 | 日東電工株式会社 | 低誘電基板材 |
| JP2020049905A (ja) * | 2018-09-28 | 2020-04-02 | 日東電工株式会社 | 低誘電基板材 |
| JP7222727B2 (ja) * | 2019-01-24 | 2023-02-15 | 日東電工株式会社 | 低誘電基板材およびその製造方法 |
| JP7751974B2 (ja) | 2021-02-15 | 2025-10-09 | 太陽ホールディングス株式会社 | 多孔質膜形成用ポリマー組成物、多孔質膜の製造方法、多孔質膜、フレキシブル金属張積層板及び電子基板 |
| JP7733466B2 (ja) | 2021-03-31 | 2025-09-03 | 日東電工株式会社 | 多孔質液晶ポリマーシートおよび配線回路基板 |
| JP7742713B2 (ja) * | 2021-04-19 | 2025-09-22 | 日東電工株式会社 | 多孔質ポリイミドフィルム |
| JP2022165324A (ja) * | 2021-04-19 | 2022-10-31 | 日東電工株式会社 | 金属層積層板用フィルム |
| JP2023077787A (ja) | 2021-11-25 | 2023-06-06 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| CN115322431A (zh) * | 2022-09-19 | 2022-11-11 | 吉林大学 | 一种低介电交联型多孔聚酰亚胺薄膜及其制备方法 |
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| JP3115215B2 (ja) | 1995-10-05 | 2000-12-04 | 松下電器産業株式会社 | 低誘電率プラスチック絶縁フィルムおよびその製造方法 |
| JP4159199B2 (ja) | 1999-09-16 | 2008-10-01 | 日東電工株式会社 | 多孔質体及び多孔質体の製造方法 |
| JP4557409B2 (ja) | 2000-11-13 | 2010-10-06 | 日東電工株式会社 | 多孔質ポリイミドの製造方法及び多孔質ポリイミド |
| JP2007077275A (ja) * | 2005-09-14 | 2007-03-29 | Shin Etsu Polymer Co Ltd | 熱可塑性ポリイミド発泡体の製造方法及び熱可塑性ポリイミド発泡体 |
| JP4948211B2 (ja) * | 2007-03-12 | 2012-06-06 | 古河電気工業株式会社 | 発泡体、発泡体を用いた回路基板、及びこれらの製造方法 |
| JP5588434B2 (ja) * | 2009-05-28 | 2014-09-10 | キヤノン株式会社 | 樹脂組成物、それを含む積層膜及びその積層膜を部品に用いる画像形成装置 |
| KR20120123017A (ko) * | 2009-12-14 | 2012-11-07 | 가부시끼가이샤 다이셀 | 다공질층을 갖는 적층체, 및 그것을 사용한 기능성 적층체 |
| JP5734623B2 (ja) | 2010-11-10 | 2015-06-17 | ユニチカ株式会社 | 積層体の製造方法 |
| JP2014231533A (ja) * | 2011-02-03 | 2014-12-11 | 日東電工株式会社 | 多孔質樹脂成型体、多孔体基板およびその製造方法 |
| JP5916498B2 (ja) * | 2011-06-06 | 2016-05-11 | 日東電工株式会社 | ポリイミド多孔質体及びその製造方法 |
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2019
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Also Published As
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| TWI666244B (zh) | 2019-07-21 |
| KR20190029649A (ko) | 2019-03-20 |
| JP2018021171A (ja) | 2018-02-08 |
| JP6567590B2 (ja) | 2019-08-28 |
| KR20220158872A (ko) | 2022-12-01 |
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| US20190263996A1 (en) | 2019-08-29 |
| JP2019199614A (ja) | 2019-11-21 |
| TW201811884A (zh) | 2018-04-01 |
| CN109496222B (zh) | 2022-01-11 |
| CN109496222A (zh) | 2019-03-19 |
| WO2018020745A1 (ja) | 2018-02-01 |
| EP3489288A4 (en) | 2020-01-22 |
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