TW201927582A - Film forming device and film forming method that reduces the distortion of a linear edge of a film by using an inkjet printing technique - Google Patents

Abstract

A film forming device that reduces the distortion of a linear edge of a film by using an inkjet printing technique is provided. According to a pattern of a subject coating area, one of a coating subject and an ink ejecting device is made to move relative to the other one in a first direction, while the ink is ejected from the ink ejecting device, so that ink is coated on an edge of the subject coating area that is parallel to the first direction. One of the coating subject and the ink ejecting device is made to move relative to the other one in a second direction, while the ink is ejected from the ink ejecting device, so that ink is coated on an edge of the subject coating area that is parallel to the second direction.

Description

Film forming device and film forming method

The present application claims priority based on Japanese Patent Application No. 2017-240421, filed on Dec. All contents of this application are incorporated herein by reference. The present invention relates to a film forming apparatus and a film forming method.

In the formation of a resist pattern for patterning a transparent conductive film of a touch panel, a photolithography technique or a screen printing technique is used. In the method using the photolithography technique, although a high-definition pattern can be formed, the device cost, the waste liquid processing cost, and the like increase. In the method using the screen printing technique, although it is advantageous in terms of device cost and waste liquid processing cost than the method using the photolithography technique, it is difficult to form a high-definition pattern. A technique of forming a high-definition resist pattern using an inkjet printing technique has been proposed (Patent Document 1). (Previous Technical Literature) (Patent Literature)

Patent Document 1: Japanese Patent No. 5797277

(The problem that the invention wants to solve)

A technique for forming a film as an etching mask at the time of etching of a transparent conductive film or the like is required to be formed with high precision. In particular, when an ink jet printing technique is used to form a film having a linear edge, there is a problem that the edge is twisted linearly. An object of the present invention is to provide a film forming apparatus and a film forming method capable of reducing deformation of a linear edge of a film using an ink jet printing technique. (Technical means to solve the problem)

According to one aspect of the invention, there is provided a film forming apparatus comprising: a storage device storing a pattern including an application target region having an edge parallel to the first direction and an edge parallel to the second direction, the second direction and the foregoing The first direction intersects; the support portion supports the object to be coated; the ink discharge device discharges the ink toward the surface of the object to be coated supported by the support portion; and the moving mechanism has the object to be coated supported by the support portion and a function of moving one of the ink discharge devices to the other in a direction fixed to a surface of the object to be coated; and a control device for controlling the ink discharge device and the moving mechanism, wherein the control device is stored in the foregoing The pattern of the application target region of the storage device performs the functions of the first control and the second control, and the first control is to adjust one of the application target supported by the support portion and the ink discharge device to the other. One of the ink ejection devices is moved from the ink ejection device in the first direction In the ink, the ink is applied to the edge of the application target region that is parallel to the first direction, and the second control is one of the application object supported by the support portion and the ink discharge device. The ink is ejected from the ink ejecting apparatus while being moved in the second direction with respect to the other side, thereby applying ink to the edge parallel to the second direction of the application target region.

According to another aspect of the present invention, a film forming apparatus includes: a storage device that stores a pattern including a coating target region having an edge parallel to the first direction and an edge parallel to the second direction, wherein the second direction is The first direction intersects; the support portion supports the object to be coated; the ink discharge device has a plurality of nozzle holes for discharging ink toward the surface of the object to be coated supported by the support portion; and the moving mechanism has the support portion a function of moving one of the object to be coated and the ink discharge device to the other in a direction parallel to the surface of the object to be coated; and a control device for controlling the ink discharge device and the moving mechanism, the control device Controlling the ink discharge device and the moving mechanism to control one of the application target supported by the support portion and the ink discharge device with respect to the pattern of the application target region stored in the storage device The other side moves while spitting out from the ink discharge device When the ink is applied to the application target region, the ink is discharged from the same nozzle hole among the plurality of nozzle holes to the edge parallel to the first direction, and is parallel to the second direction. The edge is also coated with ink ejected from the same one of the plurality of nozzle holes.

According to still another aspect of the present invention, there is provided a method of forming a film, wherein an object to be coated having a coating target region including an edge parallel to the first direction and an edge parallel to the second direction is defined on the surface When one of the ink discharge devices moves in the first direction with respect to the other, the ink is applied to the edge of the application target region that is parallel to the first direction, and the second direction intersects with the first direction; When one of the object to be coated and the ink discharge device moves in the second direction with respect to the other, the ink is applied to the edge of the application target region that is parallel to the second direction; The ink is applied to the inner side of the application target region during at least one of a period in which one of the ink discharge devices moves in the first direction and a period in which the ink is ejected in the first direction.

According to still another aspect of the present invention, there is provided a method of forming a film, wherein an object to be coated having a coating target region including an edge parallel to the first direction and an edge parallel to the second direction is defined on the surface One of the ink discharge devices having a plurality of nozzle holes is moved to the other side, and the ink discharged from the same one of the plurality of nozzle holes is applied to the edge parallel to the first direction, and the second The direction intersects with the first direction; and the ink discharged from the same one of the plurality of nozzle holes is applied to the ink while the one of the application target and the ink discharge device is moved relative to the other In the edge parallel to the second direction, the ink discharged from the plurality of nozzle holes is applied to the inside of the object to be coated. (Effect of the invention)

It is possible to reduce the linear distortion of the edge parallel to the first direction and the edge parallel to the second direction of the film made of the applied ink.

A film formation apparatus and a film formation method according to the examples will be described with reference to Figs. 1 to 5B. Fig. 1 is a schematic view showing a film forming apparatus according to an embodiment. The support portion (stage) 23 is supported by the moving mechanism 21 on the susceptor 20. The substrate 50 as an application object is supported on the upper surface (support surface) of the support portion 23. The xyz orthogonal coordinate system in which the upper surface of the support portion 23 is the xy plane and the normal direction thereof is the positive direction of the z-axis is defined. The susceptor 20 is usually provided in such a manner that the xy plane is horizontal.

The moving mechanism 21 includes an x-axis direction linear motion mechanism 21A, a y-axis direction linear motion mechanism 21B, and a rotation mechanism 21C. The x-axis direction linear motion mechanism 21A moves the guide rail of the y-axis direction linear motion mechanism 21B in the x-axis direction. The y-axis direction linear motion mechanism 21B moves the rotation mechanism 21C in the y-axis direction. The rotation mechanism 21C rotates the support portion 23 about a rotation axis parallel to the z-axis. In other words, the moving mechanism 21 has a function of shifting the substrate 50 supported by the support portion 23 in both the x-axis direction and the y-axis direction, and a function of rotating the substrate 50 about a rotation axis parallel to the z-axis.

An ink discharge device 26 is disposed above the substrate 50 supported by the support portion 23. The ink discharge device 26 is supported by the susceptor 20 by, for example, the portal frame 24 . The ink discharge device 26 has a plurality of nozzle holes toward the substrate 50 side (downward). The ink discharge device 26 dropletizes the ink and discharges it from the plurality of nozzle holes toward the substrate 50.

As the ink discharged toward the substrate 50, for example, an ultraviolet curable ink can be used. A light source for emitting ultraviolet rays to the ink applied to the substrate 50 is disposed on the side of the ink discharge device 26. When a thermosetting ink is used, a heat source for heating the ink applied to the substrate 50 is disposed on the side of the ink discharge device 26.

In the storage device 31, image data defining the position and the planar shape of the region (application target region) where the ink is applied is stored. The application target area is defined by, for example, a plurality of pixels, and as image data, bit map data can be used. Various commands or materials are input from the input device 35 to the control device 30. The input device 35 uses, for example, a keyboard, a pointing device, a USB port, a communication device, and the like. Various information related to the operation of the film forming apparatus is output to the output device 36. The output device 36 uses, for example, a display, a speaker, a USB port, a communication device, and the like.

The control device 30 controls the moving mechanism 21 and the ink discharge device 26 based on the image data stored in the storage device 31. By moving the substrate 50 while moving the substrate 50, the ink is ejected from the ink discharge device 26, whereby the application target region of the substrate 50 can be coated with ink.

2A is a bottom view of the ink discharge device 26. A plurality of nozzle holes 27 are arranged at equal intervals in the x-axis direction on the bottom surface of the ink discharge device 26. The plurality of nozzle holes 27 may be arranged in a straight line or may be arranged in a staggered shape. The pitch P of the nozzle hole 27 in the x-axis direction is, for example, a size (about 85 μm) corresponding to a resolution of 300 dpi. The distance Lx from the nozzle hole 27 at one end to the nozzle hole 27 at the other end is, for example, 50 mm. A light source 28 for hardening the ink is disposed on both sides of the ink discharge device 26 in the y-axis direction.

Next, a state in which the relative movement of the substrate 50 and the ink discharge device 26 when the ink is applied onto the substrate 50 will be described with reference to FIG. 2B. 2B is a plan view showing a movement locus of the ink discharge device 26 with respect to the substrate 50. For example, the substrate 50 having a square or rectangular planar shape is supported by the support portion 23 such that its edge is parallel to the x-axis direction and the y-axis direction (FIG. 1). As an example, the planar shape of the substrate 50 is a square having a length of one side of 500 mm. Actually, the ink is applied by moving the substrate 50 relative to the ink discharge device 26 in the x-axis direction and the y-axis direction. However, in the following description, the substrate 50 may be moved by the ink discharge device 26 with respect to the substrate. The relative movement of 50 is expressed.

When the ink discharge device 26 is relatively moved in the y-axis direction with respect to the substrate 50, it is possible to apply ink to a strip-shaped region (hereinafter referred to as a street 51) having a width Lx in the x-axis direction. The process of moving the ink discharge device 26 from one end in the y-axis direction to the other end of the substrate 50 is referred to as a pass in the y-axis direction once. By performing the passage in the y-axis direction once, the ink can be applied in the x-axis direction with a resolution corresponding to the pitch P. In the one section 51, the ink discharge device 26 is displaced by 1/4 of the pitch P in the x-axis direction and four passes are performed, whereby the resolution in the x-axis direction in one segment 51 can be improved. Up to 4 times. For example, when the pitch P of the nozzle hole 27 (FIG. 2A) corresponds to 300 dpi, the resolution in the x-axis direction can be improved to 1200 dpi by performing four passes.

When the application of the ink of one of the segments 51 is completed, the ink discharge device 26 is relatively moved Lx (Fig. 2A) in the x-axis direction with respect to the substrate 50, and application of the ink to the adjacent segments 51 is performed. By repeating this process, it is possible to apply ink to the application target region of the entire region of the substrate 50.

Before the description of the examples, the procedure for coating the ink and the coating result by the method of the reference example will be described with reference to FIGS. 3A to 3C.

3A is a plan view of a plurality of application target regions 55 delineated on the surface of the substrate 50 (FIG. 2B). The coating target regions 55 each include an edge parallel to the x-axis direction and an edge parallel to the y-axis direction. As an example, the planar shape of each of the application target regions 55 is a square or a rectangle.

FIG. 3B is a plan view of the application target region 55 after four passes in the direction indicated by the arrow 56 (y-axis direction). A hatched line is marked in the area where the ink is applied. The coating target regions 55 are each coated with ink, and the ink is formed into a film.

Figure 3C is an enlarged plan view of film 52 formed from the applied ink. The edge of the formed film 52 that is parallel to the y-axis direction is substantially linear. On the other hand, the edge parallel to the x-axis direction is undulated, and its straight line is twisted and deformed.

Hereinafter, the reason why the edge is deformed in parallel with the y-axis direction will be described. Since the ink is applied while the ink discharge device 26 is relatively moved in the y-axis direction with respect to the substrate 50, the ink discharged from the same nozzle hole 27 (Fig. 2A) is applied to the edge parallel to the y-axis direction. On the other hand, the ink ejected from the plurality of different nozzle holes 27 is applied to the edge parallel to the x-axis direction.

The discharge directions of the inks of the different nozzle holes 27 do not coincide. The position at which the droplets of the ink ejected from the same nozzle hole 27 are bounced are offset by the same distance in the same direction with respect to the target position. Therefore, the edge of the application target region 55 that is parallel to the y-axis direction is substantially straight. On the other hand, the relative positional relationship between the position at which the droplets of the ink ejected from the different nozzle holes 27 are ejected and the target position are not the same. Therefore, the edge formed by the ink ejected from the different nozzle holes 27 and parallel to the x-axis direction is twisted and deformed by a straight line.

Next, a procedure for applying the ink by the method of the embodiment will be described with reference to FIGS. 4A to 4D and FIGS. 5A to 5B. 4A is a plan view of a plurality of application target regions 55 delineated on the surface of the substrate 50 (FIG. 2B), which is the same as the plan view shown in FIG. 3A. Four coating target regions 55 are shown in FIG. 4A, but actually more coating target regions 55 are distributed on the surface of the substrate 50. Further, the position and shape of the application target region 55 are defined by image data stored in the storage device 31 (FIG. 1). A plurality of pixels corresponding to the pixels of the image data are virtually defined in the coating target region 55.

A uv orthogonal coordinate system fixed to the surface of the coating target region 55 is defined. The xyz orthogonal coordinate system is fixed relative to the base 20 (Fig. 1). Before the application of the ink, the u-axis direction and the v-axis direction are parallel to the x-axis direction and the y-axis direction, respectively. Each of the plurality of coating target regions 55 has an edge parallel to the u-axis direction and the v-axis direction.

4B is a plan view of the application target region 55 after four passes in the direction indicated by the arrow 57 (v-axis direction). Mark the area where the ink is applied. The ink is applied to the inside of the edge 55v and the application target region 55 which are parallel to the y-axis direction of the application target region 55, and the ink is not applied to the edge 55u which is parallel to the x-axis direction. Further, at least one pixel of the apex of the square or rectangular coating target region 55 is coated with ink. The plurality of pixels near the apex of the pixel containing the vertices may be coated with ink.

After performing 4 passes, an uncoated region 59 containing pixels on the edge 55u parallel to the u-axis direction remains. The size (width) of the uncoated region 59 in the v-axis direction is one pixel or more. Since the pixels of the apex of the application target region 55 are coated with ink, both ends of the uncoated region 59 do not reach the edge 55v parallel to the v-axis direction.

4C is a view showing a procedure after the application target region 55 in all the segments 51 (FIG. 2B) of the substrate 50 ends the ink coating process of FIG. 4B. The control device 30 (Fig. 1) controls the rotation mechanism 21C to rotate the support portion 23 by 90°. After the rotation, the u-axis direction and the v-axis direction of the surface fixed to the application target region 55 are parallel to the y-axis direction and the x-axis direction, respectively.

4D is a plan view of the application target region 55 after four passes in the direction indicated by the arrow 58 (u-axis direction). Mark the area where the ink is applied. By the four passes, the uncoated region 59 (Fig. 4A) was coated with ink. The entire area inside the application target region 55 is coated with ink by a plurality of passes performed by the processes shown in FIGS. 4B and 4D.

FIG. 5A is a view showing a positional relationship between the vicinity of the apex of the application target region 55 and the nozzle hole 27 after the four passes shown in FIG. 4B are performed. The position and shape of the application target region 55 are defined by a plurality of pixels 60 arranged in a square lattice shape. The pixels 60 coated with ink by performing the four passes shown in Fig. 4B are hatched.

Further, on the surface of the application target region 55, the droplets of the actual ink cover a region larger than the size of one pixel 60. For example, the pitch of the pixel 60 is about 21 μm corresponding to a resolution of 1200 dpi, and the diameter of the droplet of the ink applied to the surface of the application target region 55 is about 50 μm. At this time, the diameter of the droplet of the ink corresponds to the size of the pixel 60 of about 2.5 amounts.

By performing four passes, the ink is applied to the pixels 60 on the edge 55v parallel to the v-axis direction, and the pixels 60 inside the uncoated region 59 are also coated with ink. In FIG. 5A, the width of the uncoated region 59 is set to be twice the pixel pitch. Further, ink is applied to a predetermined number (for example, 2 × 2) of pixels 60 including the apexes of the application target region 55.

Although an example in which the ink is applied to the pixel 60 on the edge 55v parallel to the v-axis direction by the first pass is shown in FIG. 5A, the position of the edge 55v parallel to the v-axis direction may be borrowed. The ink is applied to the pixel 60 on the edge 55v by any of the second to fourth passes. For example, when the ink is applied by the fourth pass through the pixel 60 on the edge 55v parallel to the v-axis direction, it is by the first pass, on the edge 55v parallel to the v-axis direction. The pixel 60 on the inner side of the pixel 60 adjacent to the pixel 60 is coated with ink.

FIG. 5B is a view showing a positional relationship between the vicinity of the vertex of the application target region 55 and the nozzle hole 27 immediately before the four passes shown in FIG. 4D are performed. In FIG. 5B, the u-axis direction of the surface of the substrate 50 is parallel to the y-axis direction. In FIG. 5B, since the width of the uncoated region 59 is twice the pixel pitch, it is possible to apply ink to all the pixels 60 in the uncoated region 59 by performing the second pass.

According to the positional relationship between the uncoated region 59 and the other uncoated regions shown in Fig. 5B, it is possible that all of the uncoated regions cannot be coated with ink by these two passes. In this case, by performing the third and fourth passes, it is possible to apply ink to all of the uncoated regions.

Next, an excellent effect obtained by using the film forming apparatus and the film forming method of the above embodiments will be described.

In the above-described embodiment, the ink ejecting device 26 is applied to the edge 55v parallel to the v-axis direction of the application target region 55 while moving relative to the substrate 50 in the v-axis direction (FIG. 4B). While the ink discharge device 26 is relatively moved in the u-axis direction with respect to the substrate 50, the ink is applied to the edge 55u parallel to the u-axis direction (FIG. 4D). Therefore, the ink discharged from the same nozzle hole 27 is applied to the edge parallel to the u-axis direction, and the ink discharged from the same nozzle hole 27 is also applied to the edge parallel to the v-axis direction. Therefore, the edge of the film formed of the ink can be made to approach a straight line. Therefore, the appearance of the film formed of the ink can be improved. Further, when the film of the applied ink is used as an etching mask to etch the underlayer film, the appearance of the underlayer film after etching can be improved.

Even when a plurality of application target regions 55 are arranged close to each other in the u-axis direction and the v-axis direction, that is, the interval between the u-axis direction and the v-axis direction of the application target region 55 is narrow, and the deformation of the edge is reduced. It is possible to suppress the films of the ink applied to the adjacent application target regions 55 from being continuous with each other. For example, when a film of the applied ink is used as an etching mask to etch the underlying conductive film, short-circuit failure between the conductive patterns after etching can be suppressed.

Next, a preferred size of the width of the uncoated region 59 (Fig. 4B) will be described. According to the coating treatment shown in Fig. 4B, in the edge parallel to the u-axis direction of the film formed of the ink, the characteristics of the plurality of nozzle holes 27 are different, and linear distortion occurs. If the width of the uncoated region 59 is too narrow, the deformation cannot be corrected. In order to correct this deformation, it is preferable to set the width of the uncoated region 59 to be greater than or equal to the maximum amplitude of deformation that may occur. For example, even if there is a deviation in the direction of the ink ejected from the nozzle holes 27, the width of the deviation does not exceed the pixel pitch. Therefore, by setting the width of the uncoated region 59 to twice or more the pixel pitch, the deformation of the edge can be sufficiently corrected.

Further, it is not necessary to set the planar shape of the uncoated region 59 (FIG. 4B) to a rectangular shape that is long in the u-axis direction, and it may have any shape. The ink may be applied in the uncoated region 59 by the treatment shown in Fig. 4D. For example, in a triangular region obtained by dividing a square or rectangular coating target region 55 by two diagonal lines, two regions including edges parallel to the u-axis direction may remain as uncoated regions 59. .

In the above embodiment, the procedure for rotating the substrate 50 (Fig. 4C) is required, so that there is a fear that the takt time becomes long. As described below, the tact time of the application of the ink by the method of the embodiment is not greatly increased as compared with the tact time required for the high-quality ink application by the conventional method (Fig. 3B).

In the example described below, the size of the substrate 50 is set to a square of 500 mm × 500 mm, and the interval Lx ( FIG. 2A ) of the nozzle holes 27 provided at both ends of the ink discharge device 26 is 50 mm, and the pitch P of the nozzle holes 27 is set. (Fig. 2A) The amount corresponding to 300 dpi was set, and the moving speed of the substrate 50 was set to 200 mm/s.

It has been found that when the resolution in the x-axis direction is increased by the conventional method (Fig. 3B), the deformation of the edge of the application target region 55 parallel to the x-axis direction is reduced to some extent. For example, when the resolution in the y-axis direction is 1200 dpi and the resolution in the x-axis direction is 2400 dpi, the deformation of the edge parallel to the x-axis direction is reduced to some extent. In order to set the decomposition energy in the x-axis direction to 2400 dpi, it is necessary to repeatedly pass 8 times in the coating process of one segment 51 (Fig. 2B). When one pass is performed, the time for the ink discharge device 26 to pass above the substrate 50 is 2.5 seconds, but the acceleration and deceleration takes about 1 second, so the time required for one pass is about 3.5 seconds.

It takes 8 passes in one section, so the coating treatment time of one section is about 28 seconds. Since 10 segments 51 are defined on one substrate 50, the coating processing time of one substrate 50 is about 280 seconds.

According to the method of the embodiment, even if the resolution in the x-axis direction is lowered to 1200 dpi, sufficient linearity of the edge of the coating target region 55 can be obtained. Therefore, it is sufficient to perform four passes in the coating process of one section. Even if the time required for acceleration and deceleration is added, the coating processing time of one section 51 is also 14 seconds. The coating treatment time of the ten sections 51 was 140 seconds. In the embodiment, the process of applying the ink to the edge parallel to the v-axis direction (FIG. 4B) and the process of applying the ink to the edge parallel to the u-axis direction (FIG. 4D) are performed individually, so that a total of 280 seconds of processing is required. time. The time required for the process of rotating the substrate 50 is 10 seconds or less. Even if the time required for the rotation is 10 seconds, the time for processing one substrate 50 is about 290 seconds.

As described above, the takt time when the coating method according to the embodiment is employed is not greatly increased with respect to the takt time when the conventional method is employed.

Next, a modification of the above embodiment will be described. In the above embodiment, the ink discharge device 26 is moved to move the substrate 50 with respect to the susceptor 20 (FIG. 1), but one of the substrate 50 and the ink discharge device 26 may be relatively moved relative to the other. For example, the substrate 50 can be made to stand and the ink ejection device 26 can be moved. Alternatively, the substrate 50 may be stopped in the x-axis direction and the ink discharge device 26 may be moved. Conversely, the ink discharge device 26 may be stationary and the substrate 50 may be moved in the y-axis direction.

In the above embodiment, the u-axis direction is orthogonal to the v-axis direction, but the two are not necessarily orthogonal to each other and may be crossed. For example, the planar shape of each of the coating target regions 55 may be a parallelogram. At this time, in the rotation processing shown in FIG. 4C, the substrate 50 may be rotated by an angle formed by the u-axis direction and the v-axis direction.

Further, in the above embodiment, the ink discharge device 26 is constituted by one ink jet head, but the ink discharge device 26 may be constituted by a plurality of ink jet heads. For example, when a plurality of ink jet heads are arranged side by side in the x-axis direction, the coating process of the plurality of segments 51 (FIG. 2B) can be performed by one pass. Further, by arranging the n ink-jet heads in the y-axis direction and shifting by 1/n times the pitch P (Fig. 2A) of the nozzle holes 27 in the x-axis direction, it is possible to coat them by one pass. The resolution of the cloth is increased to n times.

Next, a film forming apparatus and a film forming method according to another embodiment will be described with reference to FIGS. 6A to 7C. Hereinafter, the description of the configuration common to the film forming apparatus and the film forming method according to the embodiment shown in FIGS. 1 to 5B will be omitted.

Fig. 6A is a plan view of a plurality of application target regions 55 delineated on the surface of the substrate 50 (Fig. 2B), which is the same as the plan view shown in Fig. 4A.

FIG. 6B is a plan view of the application target region 55 after four passes in the direction indicated by the arrow 61 (the y-axis direction and the v-axis direction). Mark the area where the ink is applied. The state in which the ink-coated region after the four passes is performed is the same as that shown in Fig. 4B. An uncoated region 59 remains in the coating target region 55.

6C is a plan view of the application target region 55 after a predetermined number of passes are performed in the direction indicated by the arrow 62 (the direction parallel to the x-axis direction and the u-axis direction). By this coating treatment, ink is applied to the uncoated region 59 (FIG. 6B), and as a result, the entire region inside the application target region 55 is coated with ink. The nozzle holes 27 (FIG. 2A) of the ink discharge device 26 are arranged in the x-axis direction. Therefore, by performing the first pass in the x-axis direction, only the pixels 60 of one line parallel to the x-axis direction are coated with ink.

Figs. 7A to 7C are views showing the positional relationship between the pixels for applying ink and the ink ejecting device 26 when the plural passes shown in Fig. 6C are performed.

As shown in FIG. 7A, the ink discharge device 26 is moved so that the position of the nozzle hole 27 in the y-axis direction and the pixel 60 of one line arranged in the u-axis direction in the plurality of pixels 60 of the uncoated region 59 are moved. The position in the y-axis direction is the same. In this state, the passage of the ink discharge device 26 relative to the substrate 50 in the x-axis direction is performed once. Thereby, ink is applied to one line of pixels 60 in the uncoated region 59. Any one of the plurality of nozzle holes 27 can be used for the application of the ink of the plurality of pixels 60 of one line. However, in order to avoid the influence of the characteristics of the nozzle holes 27, it is preferable to use the same nozzle hole 27 for a plurality of pixels of one line.

As shown in FIG. 7B, the ink ejecting device 26 is relatively moved with respect to the substrate 50 such that the position of the nozzle hole 27 in the y-axis direction and the uncoated ink in the plurality of pixels 60 of the uncoated region 59 are one line. The positions of the pixels 60 in the y-axis direction coincide.

As shown in FIG. 7C, the passage of the ink ejection device 26 relative to the substrate 50 in the x-axis direction is performed once. Thereby, ink is applied to one line of pixels 60 in the uncoated region 59.

By performing one pass in the x-axis direction, it is possible to apply ink to one line of pixels 60. Until the ink is applied to all of the pixels 60 in all of the uncoated regions 59 (FIG. 6B), the position in the y-axis direction of the ink discharge device 26 is changed and the passage in the x-axis direction is repeatedly performed.

Next, an excellent effect obtained by using the film forming apparatus and the film forming method according to the examples shown in FIGS. 6A to 7C will be described.

In the present embodiment, the ink is ejected to the edge 55v (FIG. 6B) parallel to the v-axis direction of the application target region 55 while relatively moving the ink ejection device 26 in the v-axis direction. Further, while the ink discharge device 26 is relatively moved in the u-axis direction, the ink is applied to the edge 55u (FIG. 6C) parallel to the u-axis direction. Therefore, similarly to the embodiment shown in FIGS. 1 to 5B, the linear distortion of the edge of the application target region 55 can be reduced.

Further, in the present embodiment, since it is not necessary to rotate the substrate 50, it is not necessary to have the moving mechanism 21 (Fig. 1) have a rotation function.

Next, a preferred size of the width of the uncoated region 59 (Fig. 4B) will be described. In the present embodiment, as in the embodiment shown in Figs. 1 to 5B, it is preferable that the width of the uncoated region 59 is twice or more the pixel pitch. Further, in the present embodiment, when the passage in the u-axis direction (Fig. 6C) is performed, only one line of the pixels 60 can be coated with ink. In order to reduce the number of passes required for the coating process shown in Fig. 6C and to shorten the tact time, it is preferable to reduce the width of the uncoated region 59 as much as possible. Therefore, it is preferable to set the width of the uncoated region 59 to twice the pixel pitch.

Next, a modification of this embodiment will be described. In the present embodiment, the posture of the ink discharge device 26 is not changed in the coating process shown in Fig. 6B and the coating process shown in Fig. 6C. It is also possible to rotate the ink discharge device 26 by 90° after the end of the coating process shown in FIG. 6B and before the coating process shown in FIG. 6C. As a result, when the coating process shown in FIG. 6C is performed, a plurality of nozzle holes 27 (FIG. 2A) are arranged in the v-axis direction. Therefore, in the processing shown in FIGS. 7A and 7C, by performing one pass, it is possible to apply ink to the pixels 60 of the plurality of rows. As a result, the number of executions of the pass can be reduced.

Next, a film formation apparatus and a film formation method according to still another embodiment will be described with reference to FIGS. 8A and 8B. Hereinafter, the description of the configuration common to the film forming apparatus and the film forming method according to the embodiment shown in FIGS. 1 to 5B will be omitted. In the embodiment shown in FIGS. 1 to 5B, the object to be coated is a hard substrate 50. However, in the present embodiment, the object to be coated is a flexible substrate 50.

Fig. 8A is a schematic view showing a film forming apparatus according to the present embodiment. The flexible substrate 50 as an object to be coated is fed from the feed roller 71 and taken up on the take-up roller 72. The moving mechanism 73 is controlled by the control device 30, whereby the feed roller 71 and the take-up roller 72 are rotated. The ink discharge device 26 is disposed above the substrate 50 during the period of being fed from the feed roller 71 and being wound up on the take-up roller 72. The transport direction of the substrate 50 is defined as the y-axis direction, the width direction of the substrate 50 is set to the x-axis direction, and the vertical upper side is set to the xyz orthogonal coordinate system of the positive direction of the z-axis.

The ink ejection device 26 includes two inkjet heads 26A and 26B opposed to the substrate 50. An ink jet head 26A has a plurality of nozzle holes arranged in the x-axis direction. The other ink jet head 26B has a plurality of nozzle holes arranged in the y-axis direction. Further, the inkjet head 26B is supported by the linear motion mechanism 74, and is configured to be movable in translation in the x-axis direction with respect to the substrate 50.

Fig. 8B is a schematic plan view of the film forming apparatus according to the embodiment. Between the feed roller 71 and the take-up roller 72, the substrate 50 is conveyed in the y-axis direction. One ink jet head 26A passes from one edge to the other edge in the width direction (x-axis direction) of the substrate 50, and is capable of applying ink to the entire region in the width direction. The other inkjet head 26B is movable from one edge to the other in the width direction (x-axis direction) of the substrate 50. A uv orthogonal coordinate system in which the width direction is the u-axis direction and the transport direction is the v-axis direction is defined on the surface of the substrate 50.

A plurality of coating target regions 55 are defined on the surface of the substrate 50. Only a part of the coating target region 55 is shown in FIG. 8B. The coating target region 55 includes an edge 55u parallel to the u-axis direction and an edge 55v parallel to the v-axis direction. When the application target region 55 passes under the inkjet head 26A, the ink is ejected from the inkjet head 26A, and the ink is applied to the edge 55v and the inside of the application target region 55 which are parallel to the v-axis direction. This coating process is substantially the same as the process shown in FIG. 4B. At this stage, an uncoated region 59 along the edge 55u of the coating target region 55 which is parallel to the u-axis direction remains.

In a state where the conveyance of the substrate 50 is stopped, the inkjet head 26B is moved in the x-axis direction (u-axis direction), whereby the uncoated region 59 is coated with ink. The relative movement of the substrate 50 and the ink discharge device 26 in the coating process is substantially the same as the relative movement in the process shown in Fig. 4D.

Next, an excellent effect obtained by using the film forming apparatus and the film forming method according to the present embodiment will be described. In the present embodiment, similarly to the embodiment shown in FIGS. 1 to 5B, the edge of the film formed by the ink applied to the application target region 55 can be made to approach a straight line.

Next, a modification of the above embodiment will be described. In the above embodiment, the application of the ink is performed when the application target region 55 passes under the inkjet head 26A once. In order to increase the resolution in the u-axis direction, the inkjet head 26A can be displaced in the u-axis direction by a distance shorter than the pitch of the nozzle holes, and the application target region 55 is along the v-axis direction below the inkjet head 26A. The conveyance control of the substrate 50 is performed while reciprocating. That is, the passage in the v-axis direction can be performed plural times. Further, in order to increase the resolution in the v-axis direction, the substrate 50 can be moved in the v-axis direction by a distance shorter than the pitch of the nozzle holes, and the ink-jet head 26B can be moved in the u-axis direction a plurality of times. That is, the passage in the u-axis direction can be performed plural times.

Further, in the above embodiment, when the ink is applied to the edge 55v parallel to the v-axis direction of the application target region 55, the substrate 50 is transported in the v direction with respect to the inkjet head 26A, but the substrate 50 may be made stationary. The ink jet head 26A is moved in the v-axis direction.

Next, a film forming apparatus and a film forming method according to still another embodiment will be described with reference to FIGS. 9A to 9C. Hereinafter, the description of the configuration common to the film forming apparatus and the film forming method shown in FIGS. 8A and 8B will be omitted.

Fig. 9A is a schematic view showing a film forming apparatus according to the present embodiment. In the embodiment shown in Figs. 8A and 8B, the ink ejecting device 26 includes two ink jet heads 26A, 26B, but in the present embodiment, the ink ejecting device 26 is constituted by one ink jet head. The ink discharge device 26 is capable of translational movement in the x-axis direction by the linear motion mechanism 74.

FIG. 9B is a plan view showing a state of movement of the substrate 50 and the ink discharge device 26 when ink is applied to the edge 55v parallel to the v-axis direction of the application target region 55. One pass is performed by transporting the substrate 50 in the v-axis direction. The ink discharge device 26 is displaced in the u-axis direction and is subjected to a plurality of passes, whereby the ink is applied to the edge 55v parallel to the v-axis direction of the application target region 55 and the inside. This coating process is substantially the same as the coating process shown in FIG. 6B. At the end of the coating process, the uncoated region 59 along the edge 55u parallel to the u-axis direction remains.

FIG. 9C is a plan view showing a state of movement of the substrate 50 and the ink discharge device 26 when ink is applied to the edge 55v parallel to the v-axis direction of the application target region 55. In a state where the uncoated region 59 is disposed below the ink discharge device 26, one pass of moving the ink discharge device 26 in the u-axis direction is performed. The substrate 50 is conveyed in the v-axis direction while a plurality of passes are performed, thereby applying ink to the uncoated region 59. This treatment is substantially the same as the coating process shown in Fig. 6C.

Next, an excellent effect obtained by using the film forming apparatus and the film forming method according to the present embodiment will be described. In the present embodiment, as in the embodiment shown in FIGS. 6A to 6B, the edge of the film formed by the ink applied to the application target region 55 can be made to approach a straight line.

Next, a film forming method according to still another embodiment will be described with reference to Figs. 10A to 10D. Hereinafter, the description of the configuration common to the film forming apparatus and the film forming method according to the embodiment shown in FIGS. 1 to 5B will be omitted.

FIG. 10A is a plan view showing a pattern of a plurality of application target regions 55 delineated on the surface of the substrate 50 (FIGS. 1 and 2B). In the embodiment shown in FIGS. 1 to 5B, the application target region 55 (FIG. 4A) is a square or a rectangle having edges 55u, 55v parallel to the two directions of the u-axis direction and the v-axis direction. On the other hand, in the present embodiment, the application target region 55 has edges 55u, 55v, and 55w which are parallel to the three directions of the u-axis direction, the v-axis direction, and the w-axis direction, respectively. For example, the planar shape of each of the application target regions 55 is an isosceles trapezoid. The isosceles trapezoid is reversed up and down and arranged in the direction of the w-axis and the direction orthogonal to the w-axis direction.

In the present embodiment, the passage in the w-axis direction and the passage in the u-axis direction are performed by the edge 55w parallel to the w-axis direction, the edge 55u parallel to the u-axis direction, and the edge 55v parallel to the v-axis direction, respectively. The ink is applied by passing in the direction of the v-axis. In the initial state, the w-axis direction is parallel to the y-axis direction.

FIG. 10B is a plan view of the application target region 55 after the passage of the ink ejection device 26 in the w-axis direction relative to the w-axis direction (y-axis direction). Mark the area where the ink is applied. The ink is applied to the inside of the edge 55w and the application target region 55 which are parallel to the w-axis direction of the application target region 55, and the ink is not applied to the edge 55u parallel to the u-axis direction and the edge 55v parallel to the v-axis direction. . Thereby, the uncoated region 59 of the uncoated ink remains. The uncoated region 59 is composed of, for example, a strip-shaped region along the edge 55u parallel to the u-axis direction and a strip-shaped region along the edge 55v parallel to the v-axis direction.

After the passage in the w-axis direction is performed, the control device 30 (FIG. 1) controls the rotation mechanism 21C to rotate the substrate 50 such that the u-axis direction is parallel to the y-axis direction. In this state, the passage in the u-axis direction is performed by moving the ink discharge device 26 in the y-axis direction.

FIG. 10C is a plan view of the application target region 55 after the passage in the u-axis direction is performed. By performing the passage in the u-axis direction, the ink is applied to the uncoated region 59 along the edge 55u parallel to the u-axis direction.

After the passage in the u-axis direction is performed, the control device 30 (FIG. 1) controls the rotation mechanism 21C to rotate the substrate 50 such that the v-axis direction is parallel to the y-axis direction. In this state, the passage in the v-axis direction is performed by moving the ink discharge device 26 in the y-axis direction.

FIG. 10D is a plan view of the application target region 55 after the passage in the v-axis direction is performed. By performing the passage in the v-axis direction, the ink is applied to the uncoated region 59 along the edge 55v parallel to the v-axis direction.

Next, an excellent effect obtained by using the film forming apparatus and the film forming method according to the present embodiment will be described.

In the present embodiment, it is possible to suppress linear distortion of the edge 55w parallel to the w-axis direction, the edge 55u parallel to the u-axis direction, and the edge 55v parallel to the v-axis direction of the film formed of the ink. In order to improve the linearity of the edge, a plurality of pixels defining the pattern of the application target region 55 may be arranged in parallel with the u-axis direction, the v-axis direction, and the w-axis direction.

In the present embodiment, the planar shape of the application target region 55 is an isosceles trapezoid, but other shapes having edges parallel to the three directions may be used. For example, the planar shape of the coating target region 55 may be a regular hexagon and arranged to constitute a honeycomb structure. The planar shape of the application target region 55 may be set to another polygon.

The above embodiments are illustrative, and of course, partial replacements or combinations of the configurations shown in the different embodiments can be performed. The same effects as those of the same configuration of the plural embodiments will not be described one by one for each embodiment. Further, the present invention is not limited to the above embodiment. For example, various modifications, improvements, combinations, and the like can be made, which will be apparent to those of ordinary skill in the art.

20‧‧‧ Pedestal

21‧‧‧Mobile agencies

21A‧‧‧x-axis direct acting mechanism

21B‧‧‧Y-axis direct acting mechanism

21C‧‧‧Rotating mechanism

23‧‧‧Support

24‧‧‧Door frame

26‧‧‧Ink discharge device

26A, 26B‧‧ ‧ inkjet head

27‧‧‧Nozzle hole

28‧‧‧Light source

30‧‧‧Control device

31‧‧‧Storage device

35‧‧‧ Input device

36‧‧‧Output device

50‧‧‧Substrate (application object)

51‧‧‧ Section

52‧‧‧ film

55‧‧‧Coating area

55u‧‧‧Edge parallel to the u-axis direction

55v‧‧‧Edge parallel to the v-axis

55w‧‧‧Edge parallel to the w-axis

56, 57, 58‧‧‧ indicates the direction of the arrow

59‧‧‧Uncoated area

60‧‧ ‧ pixels

61, 62‧‧‧ indicates the direction of the arrow

71‧‧‧feed rolls

72‧‧‧Winding roller

73‧‧‧Mobile agencies

74‧‧‧Direct motion mechanism

Fig. 1 is a schematic view showing a film forming apparatus according to an embodiment. 2A is a bottom view of the ink discharge device, and FIG. 2B is a plan view showing a movement trajectory of the ink discharge device with respect to the substrate. 3A is a plan view of a plurality of application target regions defined on the surface of the substrate, and FIG. 3B is a plan view of the application target region after four passes in the direction indicated by the arrow, and FIG. 3C is applied. An enlarged top view of the film formed by the ink. 4A is a plan view of a plurality of application target regions defined on the surface of the substrate, FIG. 4B is a plan view of the application target region after four passes in the direction indicated by the arrow, and FIG. 4C shows all of the substrate. FIG. 4D is a plan view of the application target region after the completion of the ink application process in FIG. 4B in the application target region in the segment, and FIG. 4D is a plan view of the application target region after four passes in the direction indicated by the arrow. Fig. 5A is a view showing the positional relationship between the vicinity of the apex of the application target region and the nozzle hole after the four passes shown in Fig. 4B, and Fig. 5B shows the application immediately before the four passes shown in Fig. 4D are performed. A diagram showing the positional relationship between the vicinity of the vertex of the cloth object area and the nozzle hole. 6A is a plan view of a plurality of application target regions defined on the surface of a substrate to be formed by a film formation method according to another embodiment, and FIG. 6B is performed after four passes in the direction indicated by the arrow. FIG. 6C is a plan view of the application target region after a predetermined number of passes in the direction indicated by the arrow (the direction parallel to the x-axis direction and the u-axis direction). Figs. 7A to 7C are views showing the positional relationship between the pixels for applying ink and the ink ejecting apparatus when the plural number of passes shown in Fig. 6C are performed. Fig. 8A is a schematic view of a film forming apparatus according to still another embodiment, and Fig. 8B is a schematic plan view of a film forming apparatus. 9A is a schematic view of a film forming apparatus according to still another embodiment, and FIG. 9B is a plan view showing a state in which the substrate and the ink discharge device are moved when ink is applied to the edge parallel to the v-axis direction of the application target region. 9C is a plan view showing a state in which the substrate and the ink discharge device are moved when ink is applied to the edge of the application target region that is parallel to the v-axis direction. 10A is a plan view showing a pattern of a coating target region defined on the surface of a substrate to be formed by a film formation method according to still another embodiment, and FIG. 10B is a coating after passing in the w-axis direction. FIG. 10C is a plan view of the application target region after passing in the u-axis direction, and FIG. 10D is a plan view of the application target region after passing in the v-axis direction.

Claims (6)

A film forming apparatus comprising: a storage device that stores a pattern of a coating target region including an edge parallel to the first direction and an edge parallel to the second direction, wherein the second direction intersects the first direction; the support portion The ink discharge device discharges the ink toward the surface of the object to be coated supported by the support portion, and the moving mechanism has one of the object to be coated supported by the support portion and the ink discharge device. a function of moving the other side in two directions fixed to the surface of the object to be coated; and a control device for controlling the ink discharge device and the moving mechanism, the control device having the coating target region stored in the storage device The pattern is configured to perform the functions of the first control and the second control, and the first control moves one of the application target supported by the support portion and the ink discharge device in the first direction with respect to the other. Discharging ink from the ink discharge device, thereby applying the coating The ink is applied to the edge of the target region in parallel with the first direction, and the second control is performed by one of the application target supported by the support portion and the ink discharge device with respect to the other in the second direction. The ink is ejected from the ink discharge device, and the ink is applied to the edge of the application target region that is parallel to the second direction. The film forming apparatus according to claim 1, wherein the moving mechanism has an object to be coated supported by the support portion around a rotation axis parallel to a normal direction of a surface of the object to be coated, and the aforementioned a function of rotating one of the ink discharge devices relative to the other, wherein the control device has a function of executing a third control after performing the first control and before performing the second control, and the third control is to control the movement mechanism. One of the application target object supported by the support portion and the ink discharge device is rotated at an angle formed by the first direction and the second direction with respect to the other. The film forming apparatus according to the first aspect of the invention, wherein the ink ejecting apparatus includes a first ink jet head and a second ink jet head that eject ink toward a surface of an application object supported by the support portion, The moving mechanism includes: one of the application target object supported by the support portion and the first inkjet head moved in the first direction with respect to the other, and the object to be coated supported by the support portion and the aforementioned The function of moving one of the second ink jet heads in the second direction with respect to the other. A film forming apparatus comprising: a storage device that stores a pattern of a coating target region including an edge parallel to the first direction and an edge parallel to the second direction, wherein the second direction intersects the first direction; the support portion The ink discharge device has a plurality of nozzle holes for discharging ink toward the surface of the object to be coated supported by the support portion, and the moving mechanism has an application target and the ink supported by the support portion. a function of moving one of the discharge devices in a direction parallel to the surface of the object to be coated with respect to the other; and a control device for controlling the ink discharge device and the moving mechanism, wherein the control device sets the ink discharge device and the moving mechanism Controlling the discharge from the ink while moving one of the application object supported by the support portion and the ink discharge device relative to the other based on the pattern of the application target region stored in the storage device The device discharges ink, thereby applying the aforementioned coating object When the ink is applied to the region, the ink discharged from the same one of the plurality of nozzle holes is applied to the edge parallel to the first direction, and the edge parallel to the second direction is also coated from the plurality of The ink ejected from the same nozzle hole in the nozzle hole. A method of forming a film by arranging one of an application target and an ink discharge device having a coating target region including an edge parallel to the first direction and an edge parallel to the second direction on the surface, with respect to the other While moving in the first direction, the ink is applied to the edge of the application target region parallel to the first direction, and the second direction intersects with the first direction; and the object to be coated and the ink discharge device are disposed. One of the coating target regions and the ink discharge device are coated with ink on one side of the application target region that is parallel to the second direction while moving in the second direction relative to the other. The ink is applied to the inner side of the application target region during at least one of the period in which the other side moves in the first direction and the period in which the second direction is moved. A film forming method in which an application object including a coating target region including an edge parallel to the first direction and an edge parallel to the second direction is defined on the surface, and an ink discharge device having a plurality of nozzle holes One of the plurality of nozzle holes is applied to the edge parallel to the first direction, and the second direction intersects with the first direction while moving in one of the plurality of nozzle holes; While moving one of the object to be coated and one of the ink discharge devices relative to the other, the ink discharged from the same one of the plurality of nozzle holes is applied to an edge parallel to the second direction; The ink discharged from a plurality of the nozzle holes is applied to the inner side of the object to be coated.