TW201917855A - 多層印刷電路板 - Google Patents

多層印刷電路板 Download PDF

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Publication number
TW201917855A
TW201917855A TW107114119A TW107114119A TW201917855A TW 201917855 A TW201917855 A TW 201917855A TW 107114119 A TW107114119 A TW 107114119A TW 107114119 A TW107114119 A TW 107114119A TW 201917855 A TW201917855 A TW 201917855A
Authority
TW
Taiwan
Prior art keywords
conductive pattern
layer
insulating layer
pattern layer
printed circuit
Prior art date
Application number
TW107114119A
Other languages
English (en)
Chinese (zh)
Inventor
朴庸鎭
姜明杉
金柱澔
Original Assignee
南韓商三星電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW201917855A publication Critical patent/TW201917855A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW107114119A 2017-10-26 2018-04-26 多層印刷電路板 TW201917855A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170140400A KR20190046511A (ko) 2017-10-26 2017-10-26 다층 인쇄회로기판
??10-2017-0140400 2017-10-26

Publications (1)

Publication Number Publication Date
TW201917855A true TW201917855A (zh) 2019-05-01

Family

ID=66628907

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107114119A TW201917855A (zh) 2017-10-26 2018-04-26 多層印刷電路板

Country Status (3)

Country Link
JP (1) JP2019080032A (ja)
KR (1) KR20190046511A (ja)
TW (1) TW201917855A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708541B (zh) * 2019-06-06 2020-10-21 欣興電子股份有限公司 線路載板及其製作方法
CN113347786A (zh) * 2020-02-18 2021-09-03 财团法人工业技术研究院 具导电通孔阵列基板的电子装置
TWI763015B (zh) * 2020-02-18 2022-05-01 財團法人工業技術研究院 具導電通孔陣列基板之電子裝置
CN114916156A (zh) * 2021-02-08 2022-08-16 欣兴电子股份有限公司 电路板结构及其制作方法
TWI780972B (zh) * 2021-11-02 2022-10-11 頎邦科技股份有限公司 半導體裝置之製造方法
TWI836628B (zh) * 2022-09-21 2024-03-21 大陸商鵬鼎控股（深圳）股份有限公司 電路板及其製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230051885A (ko) * 2021-10-12 2023-04-19 주식회사 엘지에너지솔루션 인쇄회로기판, 이의 제조 방법 및 이를 포함하는 전지 팩

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103301B1 (ko) 2009-12-10 2012-01-11 엘지이노텍 주식회사 다층인쇄회로기판 및 그 제조방법

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708541B (zh) * 2019-06-06 2020-10-21 欣興電子股份有限公司 線路載板及其製作方法
CN113347786A (zh) * 2020-02-18 2021-09-03 财团法人工业技术研究院 具导电通孔阵列基板的电子装置
TWI763015B (zh) * 2020-02-18 2022-05-01 財團法人工業技術研究院 具導電通孔陣列基板之電子裝置
US11756865B2 (en) 2020-02-18 2023-09-12 Industrial Technology Research Institute Electronic device having substrate
CN113347786B (zh) * 2020-02-18 2023-12-26 财团法人工业技术研究院 具导电通孔阵列基板的电子装置
CN114916156A (zh) * 2021-02-08 2022-08-16 欣兴电子股份有限公司 电路板结构及其制作方法
TWI780972B (zh) * 2021-11-02 2022-10-11 頎邦科技股份有限公司 半導體裝置之製造方法
TWI836628B (zh) * 2022-09-21 2024-03-21 大陸商鵬鼎控股（深圳）股份有限公司 電路板及其製造方法

Also Published As

Publication number Publication date
KR20190046511A (ko) 2019-05-07
JP2019080032A (ja) 2019-05-23

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