TW201914726A - 加工裝置及操作方法 - Google Patents

加工裝置及操作方法 Download PDF

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Publication number
TW201914726A
TW201914726A TW107127633A TW107127633A TW201914726A TW 201914726 A TW201914726 A TW 201914726A TW 107127633 A TW107127633 A TW 107127633A TW 107127633 A TW107127633 A TW 107127633A TW 201914726 A TW201914726 A TW 201914726A
Authority
TW
Taiwan
Prior art keywords
support
processing
substrate
support element
longitudinal axis
Prior art date
Application number
TW107127633A
Other languages
English (en)
Chinese (zh)
Inventor
托斯坦 弗傑藍
麥克 哈曼
托拔斯 艾波
Original Assignee
德商Ekra自動化系統公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商Ekra自動化系統公司 filed Critical 德商Ekra自動化系統公司
Publication of TW201914726A publication Critical patent/TW201914726A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • B41F15/26Supports for workpieces for articles with flat surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/0881Machines for printing on polyhedral articles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
TW107127633A 2017-09-22 2018-08-08 加工裝置及操作方法 TW201914726A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??102017216862.5 2017-09-22
DE102017216862.5A DE102017216862B3 (de) 2017-09-22 2017-09-22 Bearbeitungsvorrichtung und Verfahren zum Betreiben einer Bearbeitungsvorrichtung

Publications (1)

Publication Number Publication Date
TW201914726A true TW201914726A (zh) 2019-04-16

Family

ID=63683860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127633A TW201914726A (zh) 2017-09-22 2018-08-08 加工裝置及操作方法

Country Status (3)

Country Link
DE (1) DE102017216862B3 (de)
TW (1) TW201914726A (de)
WO (1) WO2019057715A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020208163B4 (de) 2020-06-30 2023-10-12 Ekra Automatisierungssysteme Gmbh Druckvorrichtung und Drucksystem mit Schablonenmagazin zum Bedrucken flächiger Substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5794329A (en) 1995-02-27 1998-08-18 Mpm Corporation Support apparatus for circuit board
CN1977577B (zh) 2004-04-30 2010-04-14 富士机械制造株式会社 印刷基板支撑设备
DE102008027138A1 (de) 2008-05-30 2009-12-03 Gas - Automation Gmbh Werkstückträger für eine Trenneinrichtung für flächenhafte Werkstücke sowie Trenneinrichtung
JP5830644B2 (ja) * 2011-12-06 2015-12-09 パナソニックIpマネジメント株式会社 下受けピン配置判定装置および下受けピン配置判定方法
CN105580508B (zh) * 2013-09-23 2018-11-09 株式会社富士 软支撑销的状态确认装置

Also Published As

Publication number Publication date
DE102017216862B3 (de) 2018-11-22
WO2019057715A1 (de) 2019-03-28

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