TW201914726A - 加工裝置及操作方法 - Google Patents
加工裝置及操作方法 Download PDFInfo
- Publication number
- TW201914726A TW201914726A TW107127633A TW107127633A TW201914726A TW 201914726 A TW201914726 A TW 201914726A TW 107127633 A TW107127633 A TW 107127633A TW 107127633 A TW107127633 A TW 107127633A TW 201914726 A TW201914726 A TW 201914726A
- Authority
- TW
- Taiwan
- Prior art keywords
- support
- processing
- substrate
- support element
- longitudinal axis
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
??102017216862.5 | 2017-09-22 | ||
DE102017216862.5A DE102017216862B3 (de) | 2017-09-22 | 2017-09-22 | Bearbeitungsvorrichtung und Verfahren zum Betreiben einer Bearbeitungsvorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201914726A true TW201914726A (zh) | 2019-04-16 |
Family
ID=63683860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107127633A TW201914726A (zh) | 2017-09-22 | 2018-08-08 | 加工裝置及操作方法 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102017216862B3 (de) |
TW (1) | TW201914726A (de) |
WO (1) | WO2019057715A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020208163B4 (de) | 2020-06-30 | 2023-10-12 | Ekra Automatisierungssysteme Gmbh | Druckvorrichtung und Drucksystem mit Schablonenmagazin zum Bedrucken flächiger Substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5794329A (en) | 1995-02-27 | 1998-08-18 | Mpm Corporation | Support apparatus for circuit board |
CN1977577B (zh) | 2004-04-30 | 2010-04-14 | 富士机械制造株式会社 | 印刷基板支撑设备 |
DE102008027138A1 (de) | 2008-05-30 | 2009-12-03 | Gas - Automation Gmbh | Werkstückträger für eine Trenneinrichtung für flächenhafte Werkstücke sowie Trenneinrichtung |
JP5830644B2 (ja) * | 2011-12-06 | 2015-12-09 | パナソニックIpマネジメント株式会社 | 下受けピン配置判定装置および下受けピン配置判定方法 |
CN105580508B (zh) * | 2013-09-23 | 2018-11-09 | 株式会社富士 | 软支撑销的状态确认装置 |
-
2017
- 2017-09-22 DE DE102017216862.5A patent/DE102017216862B3/de active Active
-
2018
- 2018-08-08 TW TW107127633A patent/TW201914726A/zh unknown
- 2018-09-18 WO PCT/EP2018/075219 patent/WO2019057715A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE102017216862B3 (de) | 2018-11-22 |
WO2019057715A1 (de) | 2019-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7587814B2 (en) | Printed-board supporting apparatus | |
EP3115794A1 (de) | Anordnung und verfahren zur handhabung von komponenten | |
CN104249547B (zh) | 位置检测装置、基板制造装置、位置检测方法及基板的制造方法 | |
JP6359541B2 (ja) | 電子部品装着機、および転写確認方法 | |
JP2013115229A (ja) | 部品実装方法及び部品実装システム | |
JP6442625B2 (ja) | 被実装物作業装置 | |
TW201914726A (zh) | 加工裝置及操作方法 | |
KR101209556B1 (ko) | 자동화된 콘택트 정렬기구 | |
JP2017204559A (ja) | リペアユニットを有するシステム | |
TWI423354B (zh) | 導電球安裝裝置 | |
KR100998999B1 (ko) | 납땜 페이스트 프린팅 시 기판 및 프린팅 스크린을정렬하는 방법 및 장치 | |
TWI798916B (zh) | 印刷機、確定部件位置的高度偏差的方法以及工裝銷釘放置方法 | |
JP2011014946A (ja) | 電子部品実装方法及び実装機 | |
JP6734403B2 (ja) | 部品実装装置 | |
US11116121B2 (en) | Mounting target working device | |
JP2019129271A (ja) | ピン挿入機及びピン挿入方法 | |
JP7425091B2 (ja) | 検査装置及び検査方法 | |
JP6950085B2 (ja) | 装着作業機、および確認方法 | |
KR100570198B1 (ko) | 반도체 소자 테스트 핸들러의 픽커의 작업위치 인식 장치및 방법 | |
KR20160033309A (ko) | 모듈형 인라인 마이크로 드릴비트 재연마장치 | |
JP6616981B2 (ja) | ボール検査リペア装置 | |
JP6334544B2 (ja) | 実装ライン | |
JP7410826B2 (ja) | ピンの位置ずれ測定装置およびダイ供給装置 | |
JP7418142B2 (ja) | 対基板作業機、および異物検出方法 | |
JP4433419B2 (ja) | 球状体の形状測定方法 |