TW201913852A - 黏著帶剝離方法及黏著帶剝離裝置 - Google Patents

黏著帶剝離方法及黏著帶剝離裝置 Download PDF

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Publication number
TW201913852A
TW201913852A TW107111587A TW107111587A TW201913852A TW 201913852 A TW201913852 A TW 201913852A TW 107111587 A TW107111587 A TW 107111587A TW 107111587 A TW107111587 A TW 107111587A TW 201913852 A TW201913852 A TW 201913852A
Authority
TW
Taiwan
Prior art keywords
peeling
adhesive tape
tape
holding
semiconductor wafer
Prior art date
Application number
TW107111587A
Other languages
English (en)
Chinese (zh)
Inventor
橋本淳
森伸一郎
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201913852A publication Critical patent/TW201913852A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
TW107111587A 2017-08-28 2018-04-02 黏著帶剝離方法及黏著帶剝離裝置 TW201913852A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017163533A JP2019041051A (ja) 2017-08-28 2017-08-28 粘着テープ剥離方法および粘着テープ剥離装置
JP2017-163533 2017-08-28

Publications (1)

Publication Number Publication Date
TW201913852A true TW201913852A (zh) 2019-04-01

Family

ID=65514747

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107111587A TW201913852A (zh) 2017-08-28 2018-04-02 黏著帶剝離方法及黏著帶剝離裝置

Country Status (4)

Country Link
JP (1) JP2019041051A (ko)
KR (1) KR20190024631A (ko)
CN (1) CN109427646A (ko)
TW (1) TW201913852A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6769689B1 (ja) * 2019-06-28 2020-10-14 東芝三菱電機産業システム株式会社 剥離把持装置、剥離検査装置及び超音波振動接合システム
JP6900540B1 (ja) * 2020-04-08 2021-07-07 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
DE102020129064B4 (de) * 2020-11-04 2023-10-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Abziehverfahren und abziehwerkzeug
KR102476313B1 (ko) * 2021-02-04 2022-12-13 (주)미래컴퍼니 보호 필름 박리 장치 및 이를 이용한 박리 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4767122B2 (ja) * 2005-11-24 2011-09-07 株式会社東京精密 テープの貼り替え方法及び該テープの貼り替え方法を使用した基板の分割方法
JP4729003B2 (ja) * 2007-06-08 2011-07-20 リンテック株式会社 脆質部材の処理方法
JP2009099865A (ja) * 2007-10-18 2009-05-07 Toyota Motor Corp 保護テープの除去装置と除去方法
JP2009141070A (ja) * 2007-12-05 2009-06-25 Lintec Corp 剥離装置及び剥離方法
JP2010076875A (ja) * 2008-09-25 2010-04-08 Fujifilm Corp フイルム剥離装置及び方法
JP2011077238A (ja) * 2009-09-30 2011-04-14 Hitachi Setsubi Eng Co Ltd 貼付け部材の剥離方法及び装置
JP5635363B2 (ja) 2010-10-19 2014-12-03 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
JP2016039301A (ja) * 2014-08-08 2016-03-22 日東電工株式会社 粘着テープ剥離方法および粘着テープ剥離装置
JP6312563B2 (ja) * 2014-09-04 2018-04-18 株式会社ディスコ 保護部材の剥離方法及び剥離装置
JP6449024B2 (ja) * 2015-01-22 2019-01-09 株式会社ディスコ 保護部材の剥離方法及び剥離装置
JP6543135B2 (ja) * 2015-08-26 2019-07-10 株式会社ディスコ 粘着テープ剥離装置

Also Published As

Publication number Publication date
JP2019041051A (ja) 2019-03-14
KR20190024631A (ko) 2019-03-08
CN109427646A (zh) 2019-03-05

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